AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
High Current Density Standard Avalanche
Surface-Mount Rectifiers
FEATURES
eSMP ® Series
• Very low profile - typical height of 1.1 mm
Available
• Ideal for automated placement
K
• Glass passivated pellet chip junction
• Controlled avalanche characteristics
• Low leakage current
1
• High forward surge capability
2
• Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
SMPC (TO-277A)
K
Anode 1
Cathode
Anode 2
• AEC-Q101 qualified available
- Automotive ordering code: base P/NHM3
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3D 3D
TYPICAL APPLICATIONS
For use in general purpose rectification of power supplies,
inverters, converters and freewheeling diodes for consumer,
automotive and telecommunication.
3D Models
PRIMARY CHARACTERISTICS
MECHANICAL DATA
IF(AV)
3.0 A
VRRM
200 V, 400 V, 600 V, 800 V, 1000 V
IFSM
70 A
EAS
20 mJ
VF at IF = 3 A
0.90 V
TJ max.
175 °C
Package
SMPC (TO-277A)
Circuit configuration
Single
Case: SMPC (TO-277A)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3_X - halogen-free, RoHS-compliant and
AEC-Q101 qualified
(“_X” denotes revision code e.g. A, B,.....)
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
Device marking code
Max. repetitive peak reverse voltage
VRRM
Max. DC forward current (fig. 1)
Peak forward surge current 10 ms single half
sine-wave superimposed on rated load
Non-repetitive avalanche energy
at TJ = 25 °C
IAS = 2.5 A max.
IAS = 1.0 A typical
Operating junction and storage temperature range
AS3PD
AS3PG
AS3PJ
AS3PK
AS3PM
AS3D
AS3G
AS3J
AS3K
AS3M
200
400
600
800
1000
IF (1)
3.0
IF (2)
2.1
IFSM
70
EAS
TJ, TSTG
20
30
-55 to +175
UNIT
V
A
A
mJ
°C
Notes
(1) Mounted on 10 mm x 10 mm pad areas, 1 oz. FR4 PCB
(2) Free air, mounted on recommended copper pad area
Revision: 15-Apr-2020
Document Number: 88837
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
IF = 1.5 A
IF = 3.0 A
Instantaneous forward voltage
IF = 1.5 A
IF = 3.0 A
SYMBOL
TA = 25 °C
VF (1)
TA = 125 °C
TA = 25 °C
IR (2)
TYP.
MAX.
0.92
-
1.00
1.10
0.81
-
0.90
0.95
0.28
10
62
150
UNIT
V
Reverse current
rated VR
Typical reverse recovery time
IF = 0.5 A, IR = 1.0 A,
Irr = 0.25 A
trr
1.2
-
μs
Typical junction capacitance per diode
4.0 V, 1 MHz
CJ
37
-
pF
AS3PM
UNIT
TA = 125 °C
μA
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width ≤ 40 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
RθJA
Typical thermal resistance
AS3PD
AS3PG
(1)
AS3PJ
AS3PK
80
RθJM (2)
°C/W
5
Notes
(1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance R
θJA - junction to ambient
(2) Units mounted on PCB with 10 mm x 10 mm copper pad areas, 1 oz. FR4 PCB; R
θJM - junction to mount
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
AS3PJ-M3/86A
0.10
86A
1500
7" diameter plastic tape and reel
AS3PJ-M3/87A
0.10
87A
6500
13" diameter plastic tape and reel
AS3PJHM3_A/H (1)
0.10
H
1500
7" diameter plastic tape and reel
AS3PJHM3_A/I (1)
0.10
I
6500
13" diameter plastic tape and reel
Note
(1) AEC-Q101 qualified
Revision: 15-Apr-2020
Document Number: 88837
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
Axis Title
1000
TM = 160 °C
DC Forward Current (A)
3.0
2.5
TA = 25 °C
2.0
1.5
1.0
TM Measured
at the Cathode Band Terminal
0.5
100
TJ = 125 °C
10
1000
TJ = 75 °C
1
TJ = 25 °C
0.1
0.01
100
TJ = -40 °C
10
0.001
0
0
25
50
75
100
125
150
10
175
20
30
40
50
60
70
80
90
100
Percent of Rated Peak Reverse Voltage (%)
Mount Temperature (°C)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 4 - Typical Reverse Leakage Characteristics
4.0
1000
D = 0.8
D = 0.5
3.6
D = 0.3
D = 0.2
3.2
Junction Capacitance (pF)
Average Power Loss (W)
10000
TJ = 175 °C
1st line
2nd line
Instantaneous Reverse Current (µA)
3.5
D = 0.1
2.8
D = 1.0
2.4
2.0
1.6
T
1.2
0.8
D = tp/T
0.4
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
100
10
tp
0
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0.1
1
Average Forward Current (A)
10
100
Reverse Voltage (V)
Fig. 2 - Forward Power Loss Characteristics
Fig. 5 - Typical Junction Capacitance
Axis Title
1000
TJ = 175 °C
TJ = 125 °C
TJ = -40 °C
1
100
TJ = 25 °C
100
TJ = 75 °C
0.1
10
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5
Instantaneous Forward Voltage (V)
Fig. 3 - Typical Instantaneous Forward Characteristics
Transient Thermal Impedance (°C/W)
10
10000
1st line
2nd line
2nd line
Instantaneous Forward Current (A)
100
Junction to Ambient
10
1
0.01
0.1
1
10
100
t - Pulse Duration (s)
Fig. 6 - Typical Transient Thermal Impedance
Revision: 15-Apr-2020
Document Number: 88837
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
SMPC (TO-277A)
0.187 (4.75)
0.175 (4.45)
0.016 (0.40)
0.006 (0.15)
K
0.262 (6.65)
0.250 (6.35)
0.242 (6.15)
0.238 (6.05)
2
1
0.047 (1.20)
0.039 (1.00)
0.171 (4.35)
0.167 (4.25)
0.146 (3.70)
0.134 (3.40)
Mounting Pad Layout
0.087 (2.20)
0.075 (1.90)
0.189 (4.80)
MIN.
0.189 (4.80)
0.173 (4.40)
0.186 (4.72)
MIN.
0.268
(6.80)
0.155 (3.94)
NOM.
0.030 (0.75) NOM.
0.049 (1.24)
0.037 (0.94)
0.050 (1.27)
MIN.
0.084 (2.13) NOM.
0.053 (1.35)
0.041 (1.05)
0.041
(1.04)
0.055 (1.40)
MIN.
Conform to JEDEC® TO-277A
Revision: 15-Apr-2020
Document Number: 88837
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2022
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Document Number: 91000