AU3PDHM3_A/I

AU3PD, AU3PG, AU3PJ www.vishay.com Vishay General Semiconductor Ultrafast Avalanche Surface Mount Rectifiers FEATURES eSMP® Series • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement K • Glass passivated pellet chip junction • Fast reverse recovery time 1 • Controlled avalanche characteristics 2 • Low leakage current • High forward surge capability SMPC (TO-277A) K Anode 1 Cathode Anode 2 • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 LINKS TO ADDITIONAL RESOURCES 3D 3D • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS 3D Models PRIMARY CHARACTERISTICS IF(AV) 3.0 A VRRM 200 V, 400 V, 600 V IFSM 75 A trr 75 ns EAS 20 mJ VF at IF = 3.0 A 1.13 V TJ max. 175 °C Package SMPC (TO-277A) Circuit configuration Single For use in lighting, high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer, automotive, and telecommunication. MECHANICAL DATA Case: SMPC (TO-277A) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3_X - halogen-free, RoHS-compliant and AEC-Q101 qualified (“_X” denotes revision code e.g. A, B,.....) Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code Maximum repetitive peak reverse voltage VRRM Peak forward surge current 10 ms single half sine-wave superimposed on rated load Non-repetitive avalanche energy at TJ = 25 °C IAS = 2.5 A max. IAS = 1.0 A typ. Operating junction and storage temperature range AU3PG AU3PJ AU3D AU3G AU3J 200 400 600 (1) 3.0 IF (2) 1.7 IFSM 45 IF Maximum DC forward current (fig. 1) AU3PD EAS TJ, TSTG 20 30 -55 to +175 UNIT V A A mJ °C Notes (1) Mounted on 14 mm x 14 mm pad areas, 1 oz. FR4 PCB (2) Free air, mounted on recommended pad area Revision: 01-Apr-2020 Document Number: 89338 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AU3PD, AU3PG, AU3PJ www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS TA = 25 °C Instantaneous forward voltage IF = 3.0 A Reverse current Rated VR Maximum reverse recovery time IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A Typical junction capacitance per diode Rated VR = 4.0 V, 1 MHz TA = 125 °C TA = 25 °C TA = 125 °C SYMBOL VF (1) TYP. MAX. 1.53 1.9 1.13 1.4 UNIT V 0.41 10 70 250 trr 66 75 ns CJ 72 - pF AU3PJ UNIT IR (2) μA Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL RθJA Typical thermal resistance AU3PD AU3PG (1) 85 RθJM (2) °C/W 5 Notes (1) Free air, mounted on recommended PCB 1 oz. pad are; thermal resistance R θJA - junction to ambient (2) Units mounted on PCB with 14 mm x 14 mm copper pad areas; R θJM - junction to mount ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE AU3PJ-M3/86A 0.10 86A 1500 7" diameter plastic tape and reel AU3PJ-M3/87A 0.10 87A 6500 13" diameter plastic tape and reel AU3PJHM3_A/H (1) 0.10 H 1500 7" diameter plastic tape and reel AU3PJHM3_A/I (1) 0.10 I 6500 13" diameter plastic tape and reel Note (1) AEC-Q101 qualified Revision: 01-Apr-2020 Document Number: 89338 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AU3PD, AU3PG, AU3PJ www.vishay.com Vishay General Semiconductor RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) 2nd line Instantaneous Reverse Current (µA) TM = 155 °C TA = 25 °C TM Measured at the Cathode Band Terminal 10000 TJ = 175 °C 100 TJ = 125 °C 1000 10 TJ = 75 °C 1 0.1 100 TJ = 25 °C 0.01 TJ = -40 °C 10 0.001 0 25 50 75 100 125 150 175 10 20 30 40 50 60 70 80 90 100 TM - Mount Temperature (°C) Percent of Rated Peak Reverse Voltage (%) Fig. 1 - Maximum Forward Current Derating Curve Fig. 4 - Typical Reverse Leakage Characteristics 4.8 D = 0.5 1000 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p D = 0.8 D = 0.3 4.0 Average Power Loss (W) te 1st line 2nd line 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 D = 0.2 3.2 D = 0.1 Junction Capacitance (pF) DC Forward Current (A) s 1000 D = 1.0 2.4 T 1.6 0.8 D = tp/T 100 tp 0 10 0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 0.1 1 10 100 Average Forward Current (A) Reverse Voltage (V) Fig. 2 - Average Power Loss Characteristics Fig. 5 - Typical Junction Capacitance Axis Title 100 10000 TJ = 175 °C TJ = 125 °C 10 1000 TJ = 75 °C 1 100 TJ = 25 °C TJ = -40 °C 0.1 10 0.2 0.7 1.2 1.7 2.2 2.7 3.2 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Transient Thermal Impedance (°C/W) 2nd line Instantaneous Forward Current (A) 100 Junction-to-Ambient 10 1 0.01 0.1 1 10 100 t - Pulse Duration (s) Fig. 6 - Typical Transient Thermal Impedance Revision: 01-Apr-2020 Document Number: 89338 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AU3PD, AU3PG, AU3PJ www.vishay.com Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) SMPC (TO-277A) 0.187 (4.75) 0.175 (4.45) 0.016 (0.40) 0.006 (0.15) K 0.262 (6.65) 0.250 (6.35) 0.242 (6.15) 0.238 (6.05) 2 1 0.047 (1.20) 0.039 (1.00) 0.171 (4.35) 0.167 (4.25) 0.146 (3.70) 0.134 (3.40) Mounting Pad Layout 0.087 (2.20) 0.075 (1.90) 0.189 (4.80) MIN. 0.189 (4.80) 0.173 (4.40) 0.186 (4.72) MIN. 0.268 (6.80) 0.155 (3.94) NOM. 0.030 (0.75) NOM. 0.049 (1.24) 0.037 (0.94) 0.050 (1.27) MIN. 0.084 (2.13) NOM. 0.053 (1.35) 0.041 (1.05) 0.041 (1.04) 0.055 (1.40) MIN. Conform to JEDEC® TO-277A Revision: 01-Apr-2020 Document Number: 89338 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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