BAS16L-G3-08

BAS16L-G3-08

  • 厂商:

    TFUNK(威世)

  • 封装:

    0402

  • 描述:

    SWITCHING DIODE GENPURP DFN1006-

  • 数据手册
  • 价格&库存
BAS16L-G3-08 数据手册
BAS16L www.vishay.com Vishay Semiconductors Small Signal Fast Switching Diode FEATURES • Silicon epitaxial planar diode Available • Fast switching diode 1 • Leadless ultra small DFN1006-2A package (1 mm × 0.6 mm × 0.45 mm) 2 • Power dissipation better than SOT-23 • Surface-mounted device (SMD) plastic package with visible and sidewall plated / wettable flanks LINKS TO ADDITIONAL RESOURCES • Soldering can be checked by standard visual inspection. No X-ray inspection necessary to meet automotive AOI requirements 3D 3D 3D Models Models Application Notes • AEC-Q101 qualified available MECHANICAL DATA • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Case: DFN1006-2A Weight: 0.83 mg Molding compound flammability rating: UL 94 V-0 Terminals: high temperature soldering guaranteed: Peak temperature max. 260 °C Packaging codes / options: 08/10K per 7" reel (8 mm tape) PARTS TABLE BAS16L ORDERING CODE AEC-Q101 QUALIFIED BAS16L-G3-08 no BAS16L-HG3-08 yes CIRCUIT CONFIGURATION TYPE MARKING REMARKS D PART Tape and reel Single . ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION Reverse voltage Forward current on FR-4 board with recommended soldering footprint SYMBOL VALUE VR 100 V IF 250 mA IFSM 1.7 tp = 1 μs Non repetitive forward current (1) tp = 1 ms 9 tp = 1 s Repetitive peak forward current Power dissipation TL = 100 °C, tp = ≤ 1 ms, D = 0.05 on FR-4 board with recommended soldering footprint RthJL = 100 K/W UNIT A 0.5 IFRM Ptot 500 mA 300 mW 1250 mW Note (1) Square wave, T = 25 °C prior to surge j THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT according to JEDEC® 51-3 on FR-4 board with recommended soldering footprint RthJA 420 K/W Thermal resistance junction to lead RthJL 100 K/W Maximum junction temperature Tj max. 150 °C Storage temperature range Tstg -55 to +150 °C Operating temperature range Top -55 to +150 °C Thermal resistance junction to ambient air Rev. 1.1, 06-Apr-2021 Document Number: 86187 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BAS16L www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL TYP. IF = 150 mA IF = 50 mA Forward voltage VF IF = 10 mA IF = 1 mA UNIT 1.250 V 1.0 V 0.86 V 0.715 V nA VR = 80 V IR 500 VR = 80 V, TJ = 150 °C IR 100 μA VR = 100 V IR 1 μA VR = 0 V, f = 1 MHz CD 2 pF IF = 10 mA, IR = 10 mA, iR = 1 mA trr 4 ns Leakage current Diode capacitance Reverse recovery time MAX. 0.36 TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) Axis Title Axis Title 10000 1000 10000 0.5 f = 1 MHz 100 0.4 TJ = 150 °C 1000 10 1st line 2nd line 0.2 2nd line IR (µA) 0.3 1st line 2nd line 2nd line CD (pF) 1000 125 °C 1 100 100 0.1 0.1 0 10 0 20 40 60 80 25 °C 10 0.01 100 0 20 40 60 80 100 VR (V) VR (V) Fig. 1 - Typical Capacitance vs. Reverse Voltage Fig. 3 - Typical Reverse Leakage Current vs. Reverse Voltage Axis Title 10000 1.5 TJ = -40 °C 1000 1st line 2nd line 2nd line VF (V) 1.0 TJ = 25 °C 100 0.5 TJ = 125 °C TJ = 150 °C 0 0.001 0.01 0.1 1 10 100 10 1000 IF (mA) Fig. 2 - Typical Forward Voltage vs. Forward Current Rev. 1.1, 06-Apr-2021 Document Number: 86187 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BAS16L www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: DFN1006-2A 0.5 ± 0.05 0.25 ± 0.05 0.23 ± 0.05 0.6 ± 0.05 min. 0.1 0.45 ± 0.05 max. 0.05 0.4 Ref. Orientation identification 1 ± 0.05 Footprint recommendation: 1.4 Document no.: S8-V3906.04-059 (4) Created - Date: 11-July-2018 Rev.3 - Date: 02-Nov-2020 0.3 0.55 0.3 0.4 23170 Rev. 1.1, 06-Apr-2021 Document Number: 86187 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BAS16L www.vishay.com Vishay Semiconductors CARRIER TAPE DFN1006-2A max. 5° 1.15 ±0.05 Ø 0.4 ±0.1 Section 0.18 ±0.02 + 0.3 8 - 0.1 2 ±0.05 A 3.5 ±0.05 +0.1 Ø 1.5 0.0 1.75 ±0.1 A-A 4 ±0.1 B B 2 ±0.05 A + 0.05 0.55 - 0.03 B-B S8-V-3906.04-063 (4) created 28.10.2019 + 0.05 0.55 - 0.03 Section max. 5° + 0.06 0.66 - 0.02 OHMS SQ Cummulative tolerances of 10 sprocket holes is ± 0.2 mm surface resistance: 105 - 1011 ORIENTATION IN CARRIER TAPE DFN1006-2A Unreeling direction Cathode marking S8-V-3906.04-064 (4) created 28.10.2019 Top view Rev. 1.1, 06-Apr-2021 Document Number: 86187 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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