BAS382-TR

BAS381, BAS382, BAS383 www.vishay.com Vishay Semiconductors Small Signal Schottky Diodes FEATURES • Integrated discharge protection ring against static • Low capacitance • Low leakage current • Low forward voltage drop • Very low switching time LINKS TO ADDITIONAL RESOURCES • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 3D 3D 3D Models APPLICATIONS MECHANICAL DATA • General purpose and switching Schottky barrier diode Case: MicroMELF • HF-detector Weight: approx. 12 mg • Protection circuit Cathode band color: black • Diode for low currents with a low supply voltage Packaging codes/options: • Small battery charger TR3/10K per 13" reel (8 mm tape), 10K/box • Power supplies TR/2.5K per 7" reel (8 mm tape), 12.5K/box • DC/DC converter for notebooks PARTS TABLE PART TYPE DIFFERENTIATION ORDERING CODE CIRCUIT CONFIGURATION REMARKS BAS381 VR = 40 V BAS381-TR3 or BAS381-TR Single Tape and reel BAS382 VR = 50 V BAS382-TR3 or BAS382-TR Single Tape and reel BAS383 VR = 60V BAS383-TR3 or BAS383-TR Single Tape and reel ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION Reverse voltage Peak forward surge current PART SYMBOL VALUE UNIT BAS381 VR 40 V BAS382 VR 50 V BAS383 VR 60 V IFSM 500 mA IFRM 150 mA IF 30 mA tp = 1 s Repetitive peak forward current Forward continuous current THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Junction to ambient air Junction temperature Storage temperature range TEST CONDITION SYMBOL VALUE UNIT On PC board 50 mm x 50 mm x 1.6 mm RthJA 320 K/W Tj 125 °C Tstg -65 to +150 °C Rev. 2.3, 26-Nov-2021 Document Number: 85503 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BAS381, BAS382, BAS383 www.vishay.com Vishay Semiconductors ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MAX. UNIT IF = 0.1mA VF 330 mV IF = 1 mA VF 410 mV IF = 15 mA VF 1000 mV VR = VRmax. IR 200 nA VR = 1 V, f = 1 MHz CD 1.6 pF Forward voltage Reserve current Diode capacitance MIN. TYP. TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 PR - Reverse Power Dissipation (mW) 14 VR = 60 V I F - Forward Current (mA) 12 RthJA = 540 K/W 10 8 6 Limit at PPRR - Limit at100 100%%VRVR 4 PR - Limit at 80 % VR 100 Tj = 125 °C 10 Tj = 25 °C 1 0.1 2 0.01 0 25 50 75 100 125 Tj - Junction Temperature (°C) 15794 0 150 Fig. 1 - Max. Reverse Power Dissipation vs. Junction Temperature 1 1.5 2.0 Fig. 3 - Forward Current vs. Forward Voltage 1000 2.0 CD - Diode Capacitance (pF) V R = V RRM I R - Reverse Current (µA) 0.5 V F - Forward Voltage (V) 15796 100 10 1 f = 1 MHz 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.1 25 15795 0 50 75 100 125 0.1 150 Tj - Junction Temperature (°C) Fig. 2 - Reverse Current vs. Junction Temperature 15797 1 10 100 VR - Reverse Voltage (V) Fig. 4 - Diode Capacitance vs. Reverse Voltage Rev. 2.3, 26-Nov-2021 Document Number: 85503 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 BAS381, BAS382, BAS383 www.vishay.com 0.71 Vishay Semiconductors 1.3 1.27 9.9 0.152 10 25 0.355 2.5 24 95 10329 Fig. 5 - Board for RthJA Definition (in mm) PACKAGE DIMENSIONS in millimeters (inches): MicroMELF 0.6 (0.024) * 1.1 (0.043) 1.2 (0.047) < 1. surface plan gl 1 (0.039) 35 ( as 0.0 s 53 ) surface plan Cathode indification 0.25 (0.010) 0.15 (0.006) > R2.5 (0.098) glass 2 (0.079) 1.8 (0.071) * The gap between plug and glass can be either on cathode or anode side Foot print recommendation: Wave soldering 2.4 (0.094) 2.8 (0.110) 0.8 (0.031) 0.9 (0.035) 0.9 (0.035) 1.4 (0.055) 1.2 (0.047) 0.8 (0.031) Reflow soldering 0.8 (0.031) 1 (0.039) Created - Date: 26.July.1996 Rev. 13 - Date: 07.June.2006 Document no.:6.560-5007.01-4 96 12072 Rev. 2.3, 26-Nov-2021 Document Number: 85503 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Revision: 01-Jan-2024