BAS381, BAS382, BAS383
www.vishay.com
Vishay Semiconductors
Small Signal Schottky Diodes
FEATURES
• Integrated
discharge
protection
ring
against
static
• Low capacitance
• Low leakage current
• Low forward voltage drop
• Very low switching time
LINKS TO ADDITIONAL RESOURCES
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
3D 3D
3D Models
APPLICATIONS
MECHANICAL DATA
• General purpose and switching Schottky barrier diode
Case: MicroMELF
• HF-detector
Weight: approx. 12 mg
• Protection circuit
Cathode band color: black
• Diode for low currents with a low supply voltage
Packaging codes/options:
• Small battery charger
TR3/10K per 13" reel (8 mm tape), 10K/box
• Power supplies
TR/2.5K per 7" reel (8 mm tape), 12.5K/box
• DC/DC converter for notebooks
PARTS TABLE
PART
TYPE DIFFERENTIATION
ORDERING CODE
CIRCUIT CONFIGURATION
REMARKS
BAS381
VR = 40 V
BAS381-TR3 or BAS381-TR
Single
Tape and reel
BAS382
VR = 50 V
BAS382-TR3 or BAS382-TR
Single
Tape and reel
BAS383
VR = 60V
BAS383-TR3 or BAS383-TR
Single
Tape and reel
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Reverse voltage
Peak forward surge current
PART
SYMBOL
VALUE
UNIT
BAS381
VR
40
V
BAS382
VR
50
V
BAS383
VR
60
V
IFSM
500
mA
IFRM
150
mA
IF
30
mA
tp = 1 s
Repetitive peak forward current
Forward continuous current
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Junction to ambient air
Junction temperature
Storage temperature range
TEST CONDITION
SYMBOL
VALUE
UNIT
On PC board
50 mm x 50 mm x 1.6 mm
RthJA
320
K/W
Tj
125
°C
Tstg
-65 to +150
°C
Rev. 2.3, 26-Nov-2021
Document Number: 85503
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BAS381, BAS382, BAS383
www.vishay.com
Vishay Semiconductors
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MAX.
UNIT
IF = 0.1mA
VF
330
mV
IF = 1 mA
VF
410
mV
IF = 15 mA
VF
1000
mV
VR = VRmax.
IR
200
nA
VR = 1 V, f = 1 MHz
CD
1.6
pF
Forward voltage
Reserve current
Diode capacitance
MIN.
TYP.
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
PR - Reverse Power Dissipation (mW)
14
VR = 60 V
I F - Forward Current (mA)
12
RthJA = 540 K/W
10
8
6
Limit at
PPRR - Limit
at100
100%%VRVR
4
PR - Limit at 80 % VR
100
Tj = 125 °C
10
Tj = 25 °C
1
0.1
2
0.01
0
25
50
75
100
125
Tj - Junction Temperature (°C)
15794
0
150
Fig. 1 - Max. Reverse Power Dissipation vs.
Junction Temperature
1
1.5
2.0
Fig. 3 - Forward Current vs. Forward Voltage
1000
2.0
CD - Diode Capacitance (pF)
V R = V RRM
I R - Reverse Current (µA)
0.5
V F - Forward Voltage (V)
15796
100
10
1
f = 1 MHz
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.1
25
15795
0
50
75
100
125
0.1
150
Tj - Junction Temperature (°C)
Fig. 2 - Reverse Current vs. Junction Temperature
15797
1
10
100
VR - Reverse Voltage (V)
Fig. 4 - Diode Capacitance vs. Reverse Voltage
Rev. 2.3, 26-Nov-2021
Document Number: 85503
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BAS381, BAS382, BAS383
www.vishay.com
0.71
Vishay Semiconductors
1.3
1.27
9.9
0.152
10
25
0.355
2.5
24
95 10329
Fig. 5 - Board for RthJA Definition (in mm)
PACKAGE DIMENSIONS in millimeters (inches): MicroMELF
0.6 (0.024)
*
1.1 (0.043)
1.2 (0.047)
<
1.
surface plan
gl
1 (0.039)
35
(
as 0.0
s 53
)
surface plan
Cathode indification
0.25 (0.010)
0.15 (0.006)
> R2.5 (0.098)
glass
2 (0.079)
1.8 (0.071)
* The gap between plug and glass can
be either on cathode or anode side
Foot print recommendation:
Wave soldering
2.4 (0.094)
2.8 (0.110)
0.8 (0.031)
0.9 (0.035)
0.9 (0.035)
1.4 (0.055)
1.2 (0.047)
0.8 (0.031)
Reflow soldering
0.8 (0.031)
1 (0.039)
Created - Date: 26.July.1996
Rev. 13 - Date: 07.June.2006
Document no.:6.560-5007.01-4
96 12072
Rev. 2.3, 26-Nov-2021
Document Number: 85503
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 01-Jan-2022
1
Document Number: 91000