CHP2512L1200JNT

CHP, HCHP www.vishay.com Vishay Sfernice High Stability Resistor Chips (< 0.25 % at Pn at 70 °C During 1000 h) Thick Film Technology FEATURES • CHP: standard passivated version for industrial, professional and military applications Available • Robust terminations • Large ohmic value range 0.1 Ω to 100 MΩ Available • Tight tolerance to 0.5 % • HCHP: for high frequency applications LINKS TO ADDITIONAL RESOURCES 3D 3D • ESCC approved see CHPHR • High temperature (245 °C) see CHPHT • SMD wraparound chip resistor 3D Models Vishay Sfernice thick film resistor chips are specially designed to meet very stringent specifications in terms of reliability, stability < 0.25 % at Pn at +70 °C during 1000 h, homogeneity, reproducibility and quality. They conform to specifications NFC 83-240 and MIL-R-55342 D. Evaluated to ESCC 4001/026 (see CHPHR datasheet). Thin film technology terminations, with nickel barrier, are very convenient for high operating conditions. They can withstand thousands of very severe thermal shocks. B (W/A), N (W/A), and F (one face) types are for solder reflow assembly. G (W/A) and W (one face) types are for wire bonding, gluing and even high temperature solder reflow. • Withstand moisture resistance test of AEC-Q200 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE RATED POWER Pn W TEMPERATURE UNIT LIMITING MAX. OVERLOAD RESISTANCE RANGE (1) TOLERANCE COEFFICIENT WEIGHT ELEMENT VOLTAGE VOLTAGE ±% mg ± ppm/°C V V Ω CHP0502 0502 0.050 50 100 0.1 to 25M 0.5, 1, 2, 5 100, 200 HCHP0502 CHP0505 0505 0.125 50 100 0.1 to 10M 0.5, 1, 2, 5 100, 200 HCHP0505 CHP0603 0.125 50 100 0.1 to 25M 0.5, 1, 2, 5 100, 200 HCHP0603 0603 CHP0805 (2) 0805 0.200 150 300 0.1 to 25M 0.5, 1, 2, 5 100, 200 HCHP0805 CHP1005 1005 0.250 150 300 0.1 to 50M 0.5, 1, 2, 5 100, 200 HCHP1005 CHP1206 0.250 200 400 0.1 to 50M 0.5, 1, 2, 5 100, 200 HCHP1206 1206 CHP1505 1505 0.500 200 400 0.1 to 75M 0.5, 1, 2, 5 100, 200 HCHP1505 CHP2010 2010 1.000 (3) 200 400 0.1 to 100M 0.5, 1, 2, 5 100, 200 HCHP2010 CHP1020 200 400 0.1 to 10M 0.5, 1, 2, 5 100, 200 1.000 (3) HCHP1020 1020 CHP2208 2208 0.750 200 400 0.1 to 100M 0.5, 1, 2, 5 100, 200 HCHP2208 CHP2512 2512 2.000 (3) 250 500 0.1 to 100M 0.5, 1, 2, 5 100, 200 HCHP2512 CHP1010 0.500 200 400 0.1 to 25M 0.5, 1, 2, 5 100, 200 HCHP1010 1010 Notes (1) Shall be read in conjunction with other tables (2) Model CHP0805 being same size than case 0705 with same performances, only codification of CHP0805 remains (3) With special assembly care Revision: 15-Jan-2024 1 3 2 4 5 8 8 26 25 21 42 12 Document Number: 52023 1 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice DIMENSIONS in millimeters (B), (G), and (N) (F) and (W) D C D C B B E E A A CASE SIZE A B C D E ± 0.152 ± 0.127 ± 0.127 ± 0.127 ± 0.127 0502 1.22 0.70 0.38 0.20 0.31 0505 1.22 1.25 0.38 0.20 0.31 0603 1.60 0.90 0.38 0.31 0.40 0805 1.85 1.25 0.38 0.31 0.50 1005 2.49 1.25 0.38 0.31 0.50 1010 2.49 2.64 0.38 0.31 0.50 1020 2.49 5.18 0.50 0.31 0.50 1206 3.00 1.73 0.38 0.40 0.50 1505 3.70 1.25 0.50 0.50 0.50 2010 5.03 2.64 0.50 0.50 0.50 2208 5.53 2.05 0.50 0.50 0.50 2512 6.30 3.30 0.50 0.50 0.50 SUGGESTED LAND PATTERN (to IPC-7351A) in millimeters Gmin. Xmax. Zmax. CASE SIZE Zmax. Gmin. Xmax. 0502 1.77 0.19 0.83 0505 1.77 0.19 1.38 0603 2.15 0.39 1.03 0805 2.70 0.44 1.38 1005 3.34 1.08 1.38 1010 3.34 1.08 2.77 1020 3.34 1.08 5.31 1206 3.85 1.59 1.85 1505 4.55 2.29 1.38 2010 5.88 3.62 2.77 2208 6.38 4.12 2.18 2512 7.15 4.89 3.43 Revision: 15-Jan-2024 Document Number: 52023 2 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice PACKAGING MECHANICAL SPECIFICATIONS Substrate Alumina Technology Thick film (ruthenium oxide) Protection 0.5 Ω < R < 100 MΩ: epoxy coating R ≤ 0.5 Ω: overglaze protection (no epoxy coating) B (W/A): SnPb over nickel barrier for solder reflow N (W/A): SnAg over nickel barrier for solder reflow F (Flip Chip): SnAg over nickel barrier for solder reflow W (one face) and G (W/A) type: gold over nickel barrier for other applications Terminations Note • Refer to Application Note “Guidelines for Vishay Sfernice Resistive and Inductive Components” (www.vishay.com/doc?52029) for recommended reflow profile. Profile #3 applies CLIMATIC SPECIFICATIONS Operating temperature range -55 °C; +155 °C Note • For temperature up to 215 °C please consult Vishay Sfernice BEST TOL. AND TCR VS. OHMIC VALUE (1) TIGHTEST TOLERANCE (%) BEST TCR (ppm/°C) 0.5 (D) 100 (K) 5 ≤ R ≤ 10M 1 (F) 100 (K) 1 ≤ R ≤ Rmax. 2 (G) 200 (L) 0.5 ≤ R ≤ Rmax. 5 (J) 200 (L) 0.1 ≤ R ≤ Rmax. 5 (J) 300 (M) OHMIC VALUE RANGE (Ω) 10 ≤ R ≤ 5M Note (1) Improved performance on request ESD packaging available: Waffle pack and plastic tape and reel (low conductivity). Paper tapes available on request (ESD only). NUMBER OF PIECES PER PACKAGE SIZE MOQ 0502 WAFFLE PACK 2" × 2" TAPE AND REEL MIN. 400 MAX. 4000 0505 0603 5000 100 0805 0705 8 mm 1005 1206 TAPE WIDTH 221 100 1505 2010 140 60 4000 100 2000 12 mm 1010 100 2500 8 mm 2208 60 4000 12 mm 1020 60 1000 8 mm 2512 50 2000 12 mm PACKAGING RULES Waffle Pack Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other and closed by one single cover. To get “not stacked up” waffle pack in case of ordered quantity > maximum number of pieces per package: Please consult Vishay Sfernice for specific ordering code Tape and Reel CHIPS FOR HIGH FREQUENCY APPLICATIONS The HF performance of flip chip and W/A types can be improved on request. See Part Numbering information to get the quantity desired by tape. Please ask for HCHP Rated Power (%) POWER DERATING CURVE 100 80 60 40 20 0 0 20 40 60 70 80 100 120 140 155 Ambient Temperature in °C Revision: 15-Jan-2024 Document Number: 52023 3 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice TYPICAL HF PERFORMANCE OF HCHP 2.0 2.0 1Ω 1.8 1.6 1.6 10 Ω 10 Ω 1.4 1.4 1.2 1.2 100 Ω 1.0 |Z|/R |Z|/R 1Ω 1.8 200 Ω 0.8 100 Ω 1.0 200 Ω 1 kΩ 0.8 0.6 0.6 1 kΩ 0.4 1 MΩ 0.2 100 kΩ 10 kΩ 0.4 10 kΩ 1 MΩ 0.2 100 kΩ 0 0 1 10 100 1000 Size 0603 (W/A) 1 10 000 10 100 Size 0603 (Flip chip) f (MHz) 1000 10 000 f (MHz) POPULAR OPTIONS For any option it is recommended to consult Vishay Sfernice for availability first. Option: Enlarged terminations: 0063 For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA Arrays, CHP Thick Film) www.vishay.com/doc?53048. Option to order: 0063 (applies to size 1206 / 1505 / 1020 / 2010 / 2512). DIMENSIONS (Option 0063) in millimeters Bottom view for mounting Uncoated ceramic Enlarged termination C E D B A CASE SIZE A B C D E ± 0.152 ± 0.127 ± 0.127 ± 0.127 ± 0.127 1206 3.00 1.73 0.38 0.40 1.19 1505 3.70 1.25 0.50 0.50 1.54 2010 5.03 2.64 0.50 0.50 2.20 1020 2.49 5.18 0.50 0.31 0.93 2208 5.53 2.05 0.50 0.50 2.45 2512 6.30 3.30 0.50 0.50 2.84 Revision: 15-Jan-2024 Document Number: 52023 4 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice SUGGESTED LAND PATTERN (Option 0063) Gmin. Xmax. Zmax. CASE SIZE DIMENSIONS (in millimeters) Gmin. 0.50 0.50 0.50 0.50 0.50 0.50 Zmax. 3.85 4.55 5.88 3.34 6.38 7.15 1206 1505 2010 1020 2208 2512 Xmax. 1.86 1.38 2.77 5.31 2.18 3.43 OPTION: MARKING Option to order 0013: Marking of ohmic value and tolerance: Sizes: 0805 to 1005: 3 digits marking (according to EIA-96) Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure) Tolerance indicated by a color dot. Option to order 0014: Marking of ohmic value: Sizes 0805 to 1005: 3 digits marking (according to EIA-96) Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure) No standard marking available for smaller sizes. A price adder will apply to the unit price of the parts for options 0013 and 0014. PERFORMANCE CONDITIONS REQUIREMENTS TYPICAL VALUES AND DRIFTS 5N for 10 s ± (0.25 % + 0.05 Ω) < ± 0.1 % Immersion 10 s in Sn/Pb 60/40 at +260 °C ± (0.25 % + 0.05 Ω) < ± 0.1 % ± (0.25 % + 0.05 Ω) < ± 0.1 % Phase A dry heat Phase B damp heat Phase C cold -55 °C Phase D damp heat 5 cycles ± (1 % + 0.05 Ω) < ± 0.2 % 56 days ± (1 % + 0.05 Ω) < ± 0.2 % Moisture resistance AEC-Q200 85 °C / 85 % RH / Pn / 10 1000 h 5 % + 0.05 Ω Max. < 3 % + 0.05 Ω Short time overload 6.25 Pr for 2 s ± (0.25 % + 0.05 Ω) < ± 0.1 % 1000 h at rated power 90’/30’ at +70 °C 1000 h ± (1 % + 0.05 Ω) TESTS Termination adhesion Resistance to solder heat Rapid temperature change Climatic sequence Humidity (steady state) Load life Revision: 15-Jan-2024 5 cycles -55 °C +155 °C 1000 h < 0.25 % 2000 h < 0.5 % 10 000 h