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CHP2512L75R0JNT

CHP2512L75R0JNT

  • 厂商:

    TFUNK(威世)

  • 封装:

    2512

  • 描述:

    RES SMD THICK FILM 2512

  • 详情介绍
  • 数据手册
  • 价格&库存
CHP2512L75R0JNT 数据手册
CHP, HCHP www.vishay.com Vishay Sfernice High Stability Resistor Chips (< 0.25 % at Pn at 70 °C During 1000 h) Thick Film Technology FEATURES • CHP: standard passivated version for industrial, professional and military applications Available • Robust terminations • Large ohmic value range 0.1 Ω to 100 MΩ Available • Tight tolerance to 0.5 % • HCHP: for high frequency applications LINKS TO ADDITIONAL RESOURCES 3D 3D • ESCC approved see CHPHR • High temperature (245 °C) see CHPHT • SMD wraparound chip resistor 3D Models Vishay Sfernice thick film resistor chips are specially designed to meet very stringent specifications in terms of reliability, stability < 0.25 % at Pn at +70 °C during 1000 h, homogeneity, reproducibility and quality. They conform to specifications NFC 83-240 and MIL-R-55342 D. Evaluated to ESCC 4001/026 (see CHPHR datasheet). Thin film technology terminations, with nickel barrier, are very convenient for high operating conditions. They can withstand thousands of very severe thermal shocks. B (W/A), N (W/A), and F (one face) types are for solder reflow assembly. G (W/A) and W (one face) types are for wire bonding, gluing and even high temperature solder reflow. • Withstand moisture resistance test of AEC-Q200 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE RATED POWER Pn W TEMPERATURE UNIT LIMITING MAX. OVERLOAD RESISTANCE RANGE (1) TOLERANCE COEFFICIENT WEIGHT ELEMENT VOLTAGE VOLTAGE ±% mg ± ppm/°C V V Ω CHP0502 0502 0.050 50 100 0.1 to 25M 0.5, 1, 2, 5 100, 200 HCHP0502 CHP0505 0505 0.125 50 100 0.1 to 10M 0.5, 1, 2, 5 100, 200 HCHP0505 CHP0603 0.125 50 100 0.1 to 25M 0.5, 1, 2, 5 100, 200 HCHP0603 0603 CHP0805 (2) 0805 0.200 150 300 0.1 to 25M 0.5, 1, 2, 5 100, 200 HCHP0805 CHP1005 1005 0.250 150 300 0.1 to 50M 0.5, 1, 2, 5 100, 200 HCHP1005 CHP1206 0.250 200 400 0.1 to 50M 0.5, 1, 2, 5 100, 200 HCHP1206 1206 CHP1505 1505 0.500 200 400 0.1 to 75M 0.5, 1, 2, 5 100, 200 HCHP1505 CHP2010 2010 1.000 (3) 200 400 0.1 to 100M 0.5, 1, 2, 5 100, 200 HCHP2010 CHP1020 200 400 0.1 to 10M 0.5, 1, 2, 5 100, 200 1.000 (3) HCHP1020 1020 CHP2208 2208 0.750 200 400 0.1 to 100M 0.5, 1, 2, 5 100, 200 HCHP2208 CHP2512 2512 2.000 (3) 250 500 0.1 to 100M 0.5, 1, 2, 5 100, 200 CHP2512 CHP1010 1010 0.500 200 400 0.1 to 25M 0.5, 1, 2, 5 100, 200 CHP1010 Notes (1) Shall be read in conjunction with other tables (2) Model CHP0805 being same size than case 0705 with same performances, only codification of CHP0805 remains (3) With special assembly care Revision: 13-Oct-2022 1 3 2 4 5 8 8 26 25 21 42 12 Document Number: 52023 1 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice DIMENSIONS in millimeters (B), (G), and (N) (F) and (W) D C D C B B E E A A CASE SIZE A B C D E ± 0.152 ± 0.127 ± 0.127 ± 0.127 ± 0.127 0502 1.22 0.70 0.38 0.20 0.31 0505 1.22 1.25 0.38 0.20 0.31 0603 1.60 0.90 0.38 0.31 0.40 0805 1.85 1.25 0.38 0.31 0.50 1005 2.49 1.25 0.38 0.31 0.50 1010 2.49 2.64 0.38 0.31 0.50 1020 2.49 5.18 0.50 0.31 0.50 1206 3.00 1.73 0.38 0.40 0.50 1505 3.70 1.25 0.50 0.50 0.50 2010 5.03 2.64 0.50 0.50 0.50 2208 5.53 2.05 0.50 0.50 0.50 2512 6.30 3.30 0.50 0.50 0.50 SUGGESTED LAND PATTERN (to IPC-7351A) in millimeters Gmin. Xmax. Zmax. CASE SIZE Zmax. Gmin. Xmax. 0502 1.77 0.19 0.83 0505 1.77 0.19 1.38 0603 2.15 0.39 1.03 0805 2.70 0.44 1.38 1005 3.34 1.08 1.38 1010 3.34 1.08 2.77 1020 3.34 1.08 5.31 1206 3.85 1.59 1.85 1505 4.55 2.29 1.38 2010 5.88 3.62 2.77 2208 6.38 4.12 2.18 2512 7.15 4.89 3.43 Revision: 13-Oct-2022 Document Number: 52023 2 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice PACKAGING MECHANICAL SPECIFICATIONS Substrate Alumina Technology Thick film (ruthenium oxide) Protection 0.5 Ω < R < 100 MΩ: epoxy coating R ≤ 0.5 Ω: overglaze protection (no epoxy coating) B (W/A): SnPb over nickel barrier for solder reflow N (W/A): SnAg over nickel barrier for solder reflow F (Flip Chip): SnAg over nickel barrier for solder reflow W (one face) and G (W/A) type: gold over nickel barrier for other applications Terminations Note • Refer to Application Note “Guidelines for Vishay Sfernice Resistive and Inductive Components” (www.vishay.com/doc?52029) for recommended reflow profile. Profile #3 applies CLIMATIC SPECIFICATIONS Operating temperature range -55 °C; +155 °C Note • For temperature up to 215 °C please consult Vishay Sfernice BEST TOL. AND TCR VS. OHMIC VALUE (1) TIGHTEST TOLERANCE (%) BEST TCR (ppm/°C) 0.5 (D) 100 (K) 5 ≤ R ≤ 10M 1 (F) 100 (K) 1 ≤ R ≤ Rmax. 2 (G) 200 (L) 0.5 ≤ R ≤ Rmax. 5 (J) 200 (L) 0.1 ≤ R ≤ Rmax. 5 (J) 300 (M) OHMIC VALUE RANGE (Ω) 10 ≤ R ≤ 5M Note (1) Improved performance on request ESD packaging available: Waffle pack and plastic tape and reel (low conductivity). Paper tapes available on request (ESD only). NUMBER OF PIECES PER PACKAGE SIZE MOQ 0502 WAFFLE PACK 2" × 2" TAPE AND REEL MIN. 400 MAX. 4000 0505 0603 5000 100 0805 0705 8 mm 1005 1206 TAPE WIDTH 221 100 1505 2010 140 60 4000 100 2000 8 mm 1010 100 2500 8 mm 2208 60 4000 8 mm 1020 60 1000 8 mm 2512 50 2000 8 mm PACKAGING RULES Waffle Pack Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other and closed by one single cover. To get “not stacked up” waffle pack in case of ordered quantity > maximum number of pieces per package: Please consult Vishay Sfernice for specific ordering code Tape and Reel CHIPS FOR HIGH FREQUENCY APPLICATIONS The HF performance of flip chip and W/A types can be improved on request. Please ask for HCHP See Part Numbering information to get the quantity desired by tape. Rated Power (%) POWER DERATING CURVE 100 80 60 40 20 0 0 20 40 60 70 80 100 120 140 155 Ambient Temperature in °C Revision: 13-Oct-2022 Document Number: 52023 3 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice TYPICAL HF PERFORMANCE OF HCHP 2.0 2.0 1Ω 1.8 1.6 1.6 10 Ω 10 Ω 1.4 1.4 1.2 1.2 100 Ω 1.0 |Z|/R |Z|/R 1Ω 1.8 200 Ω 0.8 100 Ω 1.0 200 Ω 1 kΩ 0.8 0.6 0.6 1 kΩ 0.4 1 MΩ 0.2 100 kΩ 10 kΩ 0.4 10 kΩ 1 MΩ 0.2 100 kΩ 0 0 1 10 100 1000 Size 0603 (W/A) 1 10 000 10 100 Size 0603 (Flip chip) f (MHz) 1000 10 000 f (MHz) POPULAR OPTIONS For any option it is recommended to consult Vishay Sfernice for availability first. Option: Enlarged terminations: 0063 For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA Arrays, CHP Thick Film) www.vishay.com/doc?53048. Option to order: 0063 (applies to size 1206 / 1505 / 1020 / 2010 / 2512). DIMENSIONS (Option 0063) in millimeters Bottom view for mounting Uncoated ceramic Enlarged termination C E D B A CASE SIZE A B C D E ± 0.152 ± 0.127 ± 0.127 ± 0.127 ± 0.127 1206 3.00 1.73 0.38 0.40 1.19 1505 3.70 1.25 0.50 0.50 1.54 2010 5.03 2.64 0.50 0.50 2.20 1020 2.49 5.18 0.50 0.31 0.93 2208 5.53 2.05 0.50 0.50 2.45 2512 6.30 3.30 0.50 0.50 2.84 Revision: 13-Oct-2022 Document Number: 52023 4 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CHP, HCHP www.vishay.com Vishay Sfernice SUGGESTED LAND PATTERN (Option 0063) Gmin. Xmax. Zmax. DIMENSIONS (in millimeters) CASE SIZE Zmax. Gmin. Xmax. 1206 3.85 0.50 1.86 1505 4.55 0.50 1.38 2010 5.88 0.50 2.77 1020 3.34 0.50 5.31 2208 6.38 0.50 2.18 2512 7.15 0.50 3.43 OPTION: MARKING Option to order 0013: Marking of ohmic value and tolerance: Sizes: 0805 to 1005: 3 digits marking (according to EIA-96) Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure) Tolerance indicated by a color dot. Option to order 0014: Marking of ohmic value: Sizes 0805 to 1005: 3 digits marking (according to EIA-96) Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure) No standard marking available for smaller sizes. A price adder will apply to the unit price of the parts for options 0013 and 0014. PERFORMANCE TESTS Termination adhesion Resistance to solder heat Rapid temperature change Climatic sequence CONDITIONS REQUIREMENTS TYPICAL VALUES AND DRIFTS 5N for 10 s ± (0.25 % + 0.05 Ω) < ± 0.1 % Immersion 10 s in Sn/Pb 60/40 at +260 °C ± (0.25 % + 0.05 Ω) < ± 0.1 % ± (0.25 % + 0.05 Ω) < ± 0.1 % Phase A dry heat Phase B damp heat Phase C cold -55 °C Phase D damp heat 5 cycles ± (1 % + 0.05 Ω) < ± 0.2 % 5 cycles -55 °C +155 °C 56 days ± (1 % + 0.05 Ω) < ± 0.2 % Moisture resistance AEC-Q200 85 °C / 85 % RH / Pn / 10 1000 h 5 % + 0.05 Ω Max. < 3 % + 0.05 Ω Short time overload 6.25 Pr for 2 s ± (0.25 % + 0.05 Ω) < ± 0.1 % 1000 h at rated power 90’/30’ at +70 °C 1000 h ± (1 % + 0.05 Ω) Humidity (steady state) Load life Revision: 13-Oct-2022 1000 h < 0.25 % 2000 h < 0.5 % 10 000 h
CHP2512L75R0JNT
物料型号包括CHP和HCHP系列,其中CHP是工业、专业和军事应用的标准钝化版本,而HCHP适用于高频应用。电阻芯片的尺寸范围从0502到2512,额定功率从0.050W到2.000W不等。电阻值范围从0.1Ω到100MΩ,公差紧密到0.5%。温度系数在100ppm/°C到200ppm/°C之间,单位重量从1mg到42mg不等。

封装信息包括各种尺寸的详细尺寸数据,以及建议的焊盘图案,符合IPC-7351A标准。机械规格方面,基板材料为氧化铝,采用厚膜钌氧化物技术,保护层为环氧涂层。端接材料包括B(W/A)、N(W/A)、F(单面)、G(W/A)和W(单面)类型,适用于不同的组装方式。

电气规格提供了详细的电阻型号、尺寸、额定功率、限制元件电压、最大过载电压、电阻范围、公差、温度系数和单位重量。此外,还提供了不同尺寸电阻芯片的最佳公差和温度系数与电阻值范围的比较。

性能测试包括端接附着力、耐焊热性、快速温度变化、气候序列、湿度(稳态)、耐湿性、短时过载和负载寿命等测试的条件和要求,以及典型值和漂移。

此外,文档还提供了有关包装、机械规格、气候规格、高频性能、流行选项、尺寸选项、标记选项、性能测试结果、全球零件编号信息、包装编码、尺寸编码和选项编码的详细信息。
CHP2512L75R0JNT 价格&库存

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