CRCW01003K30FREL

CRCW01005 e3 www.vishay.com Vishay Standard Thick Film Chip Resistors FEATURES • Very small standard size (0.4 mm x 0.2 mm) • Low tolerance (1 %) • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS TYPE CASE SIZE IMPERIAL CASE SIZE METRIC POWER RATING P70 W LIMITING ELEMENT VOLTAGE Umax. ACRMS/DC V TEMPERATURE RESISTANCE TOLERANCE COEFFICIENT RANGE % ppm/K  ±1 ± 250 E24; E96 10.0 to 1M ± 2, ± 5 0.031 CRCW01005 01005 SERIES E24 15 RR0402M ±1 1.0 to 9.76 E24; E96 ± 2, ± 5 1.0 to 9.1 E24 -200/+600 Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 0.5 A Notes • These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance vale drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. • Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. TECHNICAL SPECIFICATIONS PARAMETER UNIT CRCW01005 Rated Dissipation P70 (1) W 0.031 Operating Voltage Umax. ACRMS/DC V 15 Insulation Voltage Uins (1 min) V 30 Insulation Resistance  > 109 Operating Temperature Range °C -55 to +125 Mass mg 0.07 Note The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 125 °C is not exceeded. (1) Revision: 28-Oct-13 Document Number: 20056 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW01005 e3 www.vishay.com Vishay PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: CRCW01001K00FREL C R C W 0 1 0 0 1 K 0 0 F R E L TYPE VALUE TOLERANCE TCR PACKAGING CRCW0100 R = Decimal K = Thousand M = Million 0000 = Jumper F = ± 1.0 % G = ± 2.0 % J = ± 5.0 % Z = Jumper R = ± 250 ppm/K Y = -200 ppm/K/+600 ppm/K 0 = Jumper EL PRODUCT DESCRIPTION: CRCW01005 250 1K0 1 % ET3 e3 CRCW01005 250 1K0 1% ET3 e3 TYPE TCR RESISTANCE VALUE TOLERANCE VALUE PACKAGING LEAD (Pb)-FREE CRCW01005 ± 250 ppm/K -200/+600 ppm/K 1R0 = 1  10R = 10  1K0 = 1 k 10K = 10 k 1M0 = 1 M 0R0 = Jumper ±1% ±2% ±5% ET3 e3 = Pure tin termination finish PACKAGING TYPE CRCW01005 CODE EL = ET3 QUANTITY 20 000 CARRIER TAPE Paper tape acc. to IEC 60286-3, Type 1a WIDTH 8 mm PITCH 2 mm REEL DIAMETER 180 mm/7" DIMENSIONS in millimeters SIZE RECOMMENDED SOLDER PAD DIMENSIONS DIMENSIONS IMPERIAL METRIC L W H T1 T2 a b l 01005 RR0402M 0.4 ± 0.02 0.2 ± 0.02 0.13 ± 0.02 0.10 ± 0.03 0.10 ± 0.03 0.15 0.2 0.2 Note • No marking for 01005 size. Fraction of Rated Dissipation P70 in % DERATING 100 50 0 - 50 Revision: 28-Oct-13 0 50 100 125 150 70 Ambient Temperature ϑamb in °C Document Number: 20056 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW01005 e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS REQUIREMENTS PERMISSIBLE CHANGE (R) IEC 60068-2 TEST METHOD TEST 4.5 - Resistance - ± 1 %; ± 2 %; ± 5 % 4.13 - Short time overload U = 2.5 x P 70 x R  2 x Umax.; duration according to style ± (2 % R + 0.1 ) Solder bath method; Sn60Pb40 non activated flux; (235 ± 5) °C (2 ± 0.2) s Good tinning ( 95 % covered) no visible damage Solder bath method; Sn96.5Ag3Cu0.5 non-activated flux; (235 ± 3) °C (2 ± 0.5) s Good tinning ( 95 % covered) no visible damage EN 60115-1 CLAUSE PROCEDURE STABILITY CLASS 1 OR BETTER Stability for product types: CRCW01005 e3 4.17.2 58 (Td) Solderability 1  to 1 M - Temperature coefficient (20/-55/20) °C and (20/125/20) °C - 200 ppm/K/+600 ppm/K, ± 250 ppm/K 4.33 21 (Uu1) Substrate bending Depth 3 mm; 1 time No visible damage, no open circuit in bent position ± (1 % R + 0.05 ) 4.19 14 (Na) Rapid change of temperature 15 min. at -55 °C; 15 min. at 125 °C; 300 cycles ± (2 % R + 0.1 ) 4.25.1 - Endurance at 70 °C U = P 70 x R  Umax.; 1.5 h on; 0.5 h off; 70 °C; 1000 h ± (5 % R + 0.1 ) 4.18.2 58 (Td) Resistance to soldering heat Solder bath method (260 ± 5) °C; (10 ± 1) s ± (2 % R + 0.1 ) 78 (Cab) Damp heat, steady state (40 ± 2) °C; (90 to 95) % RH; 1000 h ± (5 % R + 0.1 ) - Endurance at upper category temperature 125 °C, 1000 h ± (2 % R + 0.1 ) 45 (XA) Component solvent resistance Isopropyl alcohol; (20 to 25) °C; (5 ± 0.5) min No visible damage 4.8.4.2 4.24 4.25.3 4.29 All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification • EN 140400, sectional specification • EN 140401-802, detail specification • IEC 60068-2-x, environmental test procedures Packaging of components is done in paper tapes according to IEC 60286-3. Revision: 28-Oct-13 Document Number: 20056 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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