CRCW0201180KJNED

CRCW0201 e3 www.vishay.com Vishay Lead (Pb)-Free Commodity Thick Film Chip Resistors FEATURES • High volume product suitable for commercial applications • Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes • Metal glaze on high quality ceramic • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS MODEL CASE SIZE INCH CASE SIZE METRIC POWER RATING P70 W LIMITING ELEMENT VOLTAGE Umax. ACRMS/DC V TEMPERATURE COEFFICIENT ppm/K TOLERANCE % ± 200 RESISTANCE RANGE Ω 10.0 to 10M ± 0.5 0.05 CRCW0201 0201 30 E24; E96 -200 / +400 1.0 to 9.76 ± 100 47.0 to 1M ± 200 SERIES ±1 10.0 to 10M E24; E96 RR 0603M -200 / +400 1.0 to 9.76 ± 200 10.0 to 10M ±5 E24 -200 / +400 1.0 to 9.1 Zero-ohm-resistor: Rmax. = 50 mΩ, Imax. at 70 °C = 1.0 A Notes • These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime • Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material TECHNICAL SPECIFICATIONS PARAMETER UNIT CRCW0201 Rated Dissipation at 70 °C (1) W 0.05 Operating Voltage Umax. ACRMS/DC V 30 Insulation Voltage Uins (1 min) V 50 Insulation Resistance Ω > 109 Operating Temperature Range °C -55 to +155 Weight mg 0.17 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded Revision: 05-Jan-2021 Document Number: 20052 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW0201 e3 www.vishay.com Vishay PART NUMBER AND PRODUCT DESCRIPTION Part Number: CRCW02011K00FNED C R C W 0 2 0 1 1 K 0 0 F K E D MODEL VALUE TOLERANCE TCR PACKAGING CRCW0201 R = decimal K = thousand M = million 0000 = jumper D = ± 0.5 % F = ± 1.0 % J = ± 5.0 % Z = jumper K = ± 100 ppm/K N = ± 200 ppm/K X = -200 ppm/K / +400 ppm/K 0 = jumper ED EE EI Product Description: CRCW0201 100 1K0 1 % ET7 e3 CRCW0201 100 562R 1% ET7 e3 MODEL TCR RESISTANCE VALUE TOLERANCE VALUE PACKAGING LEAD (Pb)-FREE CRCW0201 ± 200 ppm/K ± 100 ppm/K - 200/+ 400 ppm/K 1R0 = 1 Ω 10R = 10 Ω 1K0 = 1 kΩ 10K = 10 kΩ 1M0 = 1 MΩ 0R0 = jumper ± 0.5 % ±1% ±5% ET7 EF4 ET2 e3 = pure tin termination finish PACKAGING MODEL CODE QUANTITY ED = ET7 10 000 CRCW0201 EI = ET2 20 000 EE = EF4 50 000 CARRIER TAPE WIDTH PITCH REEL DIAMETER 180 mm / 7" Paper tape according to IEC 60068-3 type I 8 mm 2 mm 254 mm / 10" 330 mm / 13" DIMENSIONS in millimeters L T2 a T1 SIZE b l W H DIMENSIONS SOLDER PAD DIMENSIONS INCH METRIC L W H T1 T2 a b l 0201 0603 0.6 ± 0.05 0.3 ± 0.03 0.23 ± 0.03 0.15 ± 0.05 0.10 ± 0.05 0.28 0.43 0.23 Note • No marking for 0201 size Revision: 05-Jan-2021 Document Number: 20052 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW0201 e3 www.vishay.com Vishay DERATING Axis Title 2nd line P70 - Fraction of Rated Dissipation (%) 10000 100 1st line 2nd line 1000 50 100 10 0 -60 -50 -40 -20 0 20 40 50 60 80 70 ϑamb - Ambient Temperature (°C) 100 120 140 150 160 TEST PROCEDURES AND REQUIREMENTS IEC 60068-2 TEST METHOD TEST 4.5 - Resistance 4.7 - Voltage proof EN 60115-1 CLAUSE 4.13 58 (Td) 4.33 Stability for product types: CRCW0201 e3 Solderability REQUIREMENTS PERMISSIBLE CHANGE (ΔR) 1 Ω to 10 MΩ - ± 0.5 %; ± 1 %; ± 5 % U = 1.4 x Uins; 60 s No flashover or breakdown Solder bath method; Sn60Pb40 non activated flux; (235 ± 5) °C (2 ± 0.2) s Good tinning (≥ 95 % covered) no visible damage Solder bath method; Sn96.5Ag3Cu0.5 non-activated flux; (245 ± 5) °C (3 ± 0.3) s Good tinning (≥ 95 % covered) no visible damage ± 100 ppm/K, ± 200 ppm/K, -200 ppm/K / +400 ppm/K - Temperature coefficient (20 / -55 / 20) °C and (20 / 125 / 20) °C 21 (Uu3) Shear (adhesion) 9N No visible damage Depth 2 mm; 3 times No visible damage, no open circuit in bent position ± (0.5 % R + 0.05 Ω) 4.8.4.2 4.32 PROCEDURE 21 (Uu1) Substrate bending 4.19 14 (Na) Rapid change of temperature 4.23 - Climatic sequence: 30 min. at -55 °C; 30 min. at 125 °C 5 cycles ± (0.5 % R + 0.05 Ω) 1000 cycles ± (1 % R + 0.05 Ω) - 4.23.2 2 (Ba) Dry heat 125 °C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; ≥ 90 % RH; 24 h; 1 cycle 4.23.4 1 (Aa) Cold -55 °C; 2 h 4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h 4.23.6 30 (Db) Damp heat, cyclic 55 °C; ≥ 90 % RH; 24 h; 5 cycles 4.23.7 - DC load Revision: 05-Jan-2021 U= ± (2 % R + 0.1 Ω) P 70 x R ≤ Umax. Document Number: 20052 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW0201 e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD PROCEDURE TEST REQUIREMENTS PERMISSIBLE CHANGE (ΔR) Stability for product types: CRCW0201 e3 1 Ω to 10 MΩ U = P 70 x R ≤ Umax.; 1.5 h on; 0.5 h off; 4.25.1 - Endurance at 70 °C 70 °C; 1000 h ± (2 % R + 0.1 Ω) 70 °C; 8000 h ± (4 % R + 0.1 Ω) 58 (Td) Resistance to soldering heat Solder bath method (260 ± 5) °C; (10 ± 1) s ± (1 % R + 0.05 Ω) 4.35 - Flammability, needle flame test IEC 60695-11-5; 10 s No burning after 30 s 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (2 % R + 0.1 Ω) - Endurance at upper category temperature 155 °C, 1000 h ± (2 % R + 0.1 Ω) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage 4.22 6 (Fc) Vibration, endurance by sweeping f = 10 Hz to 2000 Hz; x, y, z ≤ 1.5 mm; A ≤ 200 m/s2; 10 sweeps per axis ± (0.5 % R + 0.05 Ω) 4.18.2 4.25.3 All tests are carried out in accordance with the following specifications: • EN 60115-1, generic specification • EN 140400, sectional specification • EN 140401-802, detail specification • IEC 60068-2-x, environmental test procedures Packaging of components is done in paper tapes according to IEC 60286-3. Revision: 05-Jan-2021 Document Number: 20052 4 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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