CRCW0201715RFNED

D/CRCW e3 Vishay Standard Thick Film Chip Resistors FEATURES  Stability R/R = 1 % for 1000 h at 70 ° C  2 mm pitch packaging option for 0603 size  Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes  Metal glaze on high quality ceramic  AEC-Q200 qualified  Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS SIZE MODEL D10/CRCW0402 INCH METRIC 0402 RR 1005M RATED DISSIPATION P70 °C W 0.063 LIMITING ELEMENT TEMPERATURE TOLERANCE RESISTANCE RANGE COEFFICIENT % VOLTAGE  ppm/K Umax. AC/DC 50 ± 100 ± 200 SERIES ±1 ±5 1R0 to 10M E24; E96 E24 ±1 ±5 1R0 to 10M E24; E96 E24 ±1 ±5 1R0 to 10M E24; E96 E24 ±1 ±5 1R0 to 10M E24; E96 E24 ±1 ±5 1R0 to 10M E24; E96 E24 ±1 ±5 1R0 to 2M2 E24; E96 E24 ±1 ±5 1R0 to 10M E24; E96 E24 ±1 ±5 1R0 to 10M E24; E96 E24 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 1.5 A D11/CRCW0603 0603 RR 1608M 0.10 75 ± 100 ± 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.0 A D12/CRCW0805 0805 RR 2012M 0.125 150 ± 100 ± 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.5 A D25/CRCW1206 1206 RR 3216M 0.25 200 ± 100 ± 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 3.5 A CRCW1210 1210 RR 3225M 0.5 200 ± 100 ± 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 5.0 A CRCW1218 1218 RR 3246M 1.0 200 ± 100 ± 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A CRCW2010 2010 RR 5025M 0.75 400 ± 100 ± 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 6.0 A CRCW2512 2512 RR 6332M 1.0 500 ± 100 ± 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A Notes  These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.  Marking: See data sheet “Surface Mount Resistor Marking” (document number 20020).  Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. www.vishay.com Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com Revision: 04-Jun-12 125 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 Standard Thick Film Chip Resistors Vishay TECHNICAL SPECIFICATIONS D10/ D11/ D12/ D25/ UNIT CRCW0402 CRCW0603 CRCW0805 CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 PARAMETER Rated dissipation P70 (1) W 0.063 0.1 0.125 0.25 0.5 1.0 0.75 1.0 Limiting element voltage Umax. AC/DC V 50 75 150 200 200 200 400 500 Insulation voltage Uins (1 min) V > 75 > 100 > 200 > 300 > 300 > 300 > 300 > 300 Insulation resistance  > 109 Category temperature range °C - 55 to + 155 Failure rate h-1 < 0.1 x 10- 9 Weight mg 29.5 25.5 40.5 0.65 2 5.5 10 16 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded. PART NUMBER AND PRODUCT DESCRIPTION Part Number: CRCW0603562RFKEC C R C W 0 6 0 3 5 6 2 R F K E C MODEL VALUE TOLERANCE TCR PACKAGING SPECIAL CRCW0402 CRCW0603 CRCW0805 CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 R = Decimal K = Thousand M = Million 0000 = Jumper F = ± 1.0 % J = ± 5.0 % Z = Jumper K = ± 100 ppm/K N = ± 200 ppm/K 0 = Jumper EA, EB, EC, ED, EE, EF, EG, EH, EI, EL, EK Up to 2 digits Product Description: D11/CRCW0603 100 562R 1 % ET6 e3 D11/CRCW0603 100 562R 1% ET6 e3 MODEL TCR RESISTANCE VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 ± 200 ppm/K ± 100 ppm/K 10R = 10  562R = 562  10K = 10 k 1M0 = 1 M 0R0 = Jumper ±5% ±1% ET1, ET2, ET3, ET4, ET5, ET6, ET7, ET8, ET9, EF4, E02, E67, E82 e3 = Pure tin termination finish Document Number: 20035 www.vishay.com For technical questions, contact: thickfilmchip@vishay.com 126 Revision: 04-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 Standard Thick Film Chip Resistors Vishay PACKAGING MODEL CODE CRCW0402 CRCW0603 CRCW0805 CRCW1206 CRCW1210 QUANTITY ED = ET7 10 000 EE = EF4 50 000 WIDTH PITCH 8 mm 2 mm REEL DIAMETER 180 mm/7" 330 mm/13" EI = ET2 5000 ED = ET3 10 000 EL = ET4 20 000 EE = ET8 50 000 EA = ET1 5000 EB = ET5 10 000 EC = ET6 20 000 EA = ET1 5000 EB = ET5 10 000 EC = ET6 20 000 EA = ET1 5000 EB = ET5 10 000 EC = ET6 20 000 330 mm/13" EA = ET1 5000 180 mm/7" EB = ET5 10 000 EC = ET6 20 000 CRCW1218 EK = ET9 4000 CRCW2010 EF = E02 4000 EG = E67 2000 EH = E82 4000 CRCW2512 CARRIER TAPE 180 mm/7" 8 mm 180 mm/7" 2 mm 285 mm/11.25" 330 mm/13" 180 mm/7" 8 mm 4 mm 285 mm/11.25" Paper tape acc. to IEC 60068-3 Type I 330 mm/13" 180 mm/7" 8 mm 4 mm 285 mm/11.25" 330 mm/13" 180 mm/7" 8 mm 4 mm 285 mm/11.25" 8 mm 4 mm 285 mm/11.25" 12 mm 4 mm 180 mm/7" 12 mm 4 mm 180 mm/7" 330 mm/13" Blister tape acc. to IEC 60068-3 Type II 8 mm 12 mm 180 mm/7" 4 mm DIMENSIONS SIZE INCH METRIC SOLDER PAD DIMENSIONS in millimeters DIMENSIONS in millimeters L W T2 a b l 0402 1005 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.1 0.4 0.6 0.5 0603 1608 1.55 + 0.10 - 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.2 0.5 0.9 0805 2012 2.0 + 0.20 - 0.10 1.25 ± 0.15 0.45 ± 0.05 + 0.20 - 0.10 0.3 ± 0.2 0.7 1206 3216 3.2 + 0.10 - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1210 3225 3.2 ± 0.2 3.2 H T1 REFLOW SOLDERING 0.3 ± 0.2 0.3 WAVE SOLDERING a b l 1.0 0.9 0.9 1.0 1.3 1.2 0.9 1.3 1.3 0.9 1.7 2.0 1.1 1.7 2.3 2.5 ± 0.2 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2 + 0.10 - 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.2 0.4 ± 0.2 1.05 4.9 1.9 1.25 4.8 1.9 1218 3246 2010 5025 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9 2512 6332 6.3 ± 0.2 3.15 ± 0.15 0.6 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2 www.vishay.com Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com Revision: 04-Jun-12 127 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 Standard Thick Film Chip Resistors Vishay Pulse Load Pmax. (W) FUNCTIONAL PERFORMANCE Single Pulse 1000 2512 1218 2010 1210 1206 0805 0603 0402 100 10 1 0.1 0.01 10-6 10-5 10-4 10-3 10-2 10-1 1 10 100 Pulse Duration t i (s) Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and Û ≤ Ûmax.; for permissible resistance change equivalent to 8000 h operation Continuous Pulse Load Pmax. (W) Continuous Pulse 1000 2512 1218 2010 1210 1206 0805 0603 0402 100 10 1 0.1 0.01 10-6 10-5 10-4 10-3 10-2 10-1 1 10 100 Pulse Duration t i (s) Pulse Voltage Û max. (V) Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑamb) and Û ≤ Ûmax.; for permissible resistance change equivalent to 8000 h operation 2000 1800 2512 1600 1400 2010 1200 1000 800 1206/1210/1218 600 400 0805 0603 200 0402 0 -6 10- 5 10 10- 4 10- 3 10- 2 10- 1 1 10 Pulse Duration t i (s) Maximum pulse voltage, single and continuous pulses; applicable if P ≤ Pmax.; for permissible resistance change equivalent to 8000 h operation Document Number: 20035 www.vishay.com For technical questions, contact: thickfilmchip@vishay.com 128 Revision: 04-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 Standard Thick Film Chip Resistors Vishay Fraction of Rated Dissipation P70 Derating 100 % 50 0 Attenuation of 3rd Harmonic A3 in dB - 50 0 50 100 °C 150 70 Ambient Temperature ϑamb 120 100 80 1206, 2010 0805 60 0603 0402 40 20 0 10 100 1K 10K 100K 1M 10M Current Noise A1 in µV/V Resistance Value R in Ω 100 2 040 3 0 6 0 5 080 6 120 0 201 10 1 0.1 0.01 100 1K 10K 100K 1M 10M Resistance Value R in Ω www.vishay.com Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com Revision: 04-Jun-12 129 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 Standard Thick Film Chip Resistors Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD REQUIREMENTS PERMISSIBLE CHANGE (R) TEST SIZE 0402 to 2512 PROCEDURE STABILITY CLASS 2 OR BETTER STABILITY CLASS 1 OR BETTER Stability for product types: 1  to 10 M D/CRCW e3 4.5 - Resistance 4.7 - Voltage proof U = 1.4 x Uins; 60 s Short time overload U = 2.5 x P 70 x R  2 x Umax.; duration: Acc. to style 4.13 4.17.2 - 58 (Td) Solderability - 21 (Uu3) Shear (adhesion) RR 1608 and smaller: 9 N RR 2012 and larger: 45 N 4.33 21 (Uu1) Substrate bending Depth 2 mm; 3 times 14 (Na) Rapid change of temperature No visible damage No visible damage, no open circuit in bent position ± (0.25 % R + 0.05 ) 5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) Climatic sequence: 2 (Ba) Dry heat 125 °C; 16 h - 4.23.3 30 (Db) Damp heat, cyclic 4.23.4 1 (Aa) Cold - 55 °C; 2 h 4.23.5 13 (M) Low air pressure 1 kPa; (25 ± 10) °C; 1 h 4.23.6 30 (Db) Damp heat, cyclic 55 °C;  90 % RH; 24 h; 5 cycles 4.23.7 - DC load Endurance at 70 °C ± 200 ppm/K 1000 cycles - - ± 100 ppm/K 30 min. at - 55 °C; 30 min. at 125 °C 55 °C;  90 % RH; 24 h; 1 cycle 4.25.1 ±0.5 % R + 0.05) Good tinning ( 95 % covered) no visible damage 4.32 4.23.2 ±0.25 % R + 0.05) Solder bath method; Sn96.5Ag3Cu0.5 non-activated flux; (245 ± 5) C (3 ± 0.3) s (20/- 55/20) C and (20/125/20) C 4.23 No flashover or breakdown Good tinning ( 95 % covered) no visible damage Temperature coefficient 4.19 ±5% Solder bath method; Sn60Pb40 non activated flux; (235 ± 5) °C (2 ± 0.2) s - 4.8.4.2 ±1% U = P 70 x R U = P 70 x R  Umax.; 1.5 h on; 0.5 h off; 70 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 70 °C; 8000 h ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) Document Number: 20035 www.vishay.com For technical questions, contact: thickfilmchip@vishay.com 130 Revision: 04-Jun-12 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 Standard Thick Film Chip Resistors Vishay TEST PROCEDURES AND REQUIREMENTS IEC EN 60068-2 60115-1 TEST CLAUSE METHOD REQUIREMENTS PERMISSIBLE CHANGE (R) TEST SIZE 0402 to 2512 PROCEDURE STABILITY CLASS 2 OR BETTER STABILITY CLASS 1 OR BETTER Stability for product types: 1  to 10 M D/CRCW e3 58 (Td) Resistance to soldering heat Solder bath method (260 ± 5) C; (10 ± 1) s 4.35 - Flamability, needle flame test IEC 60695-11-5; 10 s No burning after 30 s 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 ) 4.25.3 - Endurance at upper category temperature 155 °C, 1000 h 4.40 - Electrostatic discharge (human body model) IEC 61340-3-1; 3 pos. + 3 neg. discharges; ESD voltage acc. to size ± (1 % R + 0.05 ) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage 4.30 45 (XA) Solvent resistance of marking Isopropyl alcohol; 50 °C; method 1, toothbrush Marking legible, no visible damage 4.22 6 (Fc) Vibration, endurance by sweeping f = 10 Hz to 2000 Hz; x, y, z  1.5 mm; A  200 m/s2; 10 sweeps per axis 4.37 - Periodic electric overload 4.27 - Single pulse high voltage overload, 10 µs/700 µs 4.18.2 ± (0.25 % R + 0.05 ) ± (1 % R + 0.05 ) ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) ± (2 % R + 0.1 ) ± (0.5 % R + 0.05 ) U= 15 x P 70 x R  2 x Umax.; 0.1 s on; 2.5 s off; 1000 cycles Û = 10 x P 70 x R  2 x Umax.; 10 pulses ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) All tests are carried out in accordance with the following specifications:  EN 60115-1, generic specification  EN 140400, sectional specification  EN 140401-802, detail specification  IEC 60068-2-x, environmental test procedures Packaging of components is done in paper or blister tapes according to IEC 60286-3. www.vishay.com Document Number: 20035 For technical questions, contact: thickfilmchip@vishay.com Revision: 04-Jun-12 131 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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