CRCW0402121KFKED

D/CRCW e3 www.vishay.com Vishay Standard Thick Film Chip Resistors FEATURES • Stability at different environmental conditions ΔR/R ≤ 1 % (1000 h rated power at 70 °C) • 2 mm pitch packaging option for 0603 size • AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS LINKS TO ADDITIONAL RESOURCES • Automotive 3D 3D • Industrial • Telecommunication 3D Models D/CRCW e3 standard thick film chip resistors are the perfect choice for most fields of modern electronics where high reliability and stability are of major concern. Typical applications include automotive, telecommunications, and industrial. TECHNICAL SPECIFICATIONS DESCRIPTION Imperial size Metric size code Resistance range D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 e3 e3 e3 e3 e3 e3 e3 e3 0402 0603 0805 1206 1210 1218 2010 2512 RR1005M RR1608M RR2012M RR3216M RR3225M RR3246M RR5025M RR6332M 1 Ω to 2.2 MΩ; 1 Ω to 10 MΩ; 1 Ω to 10 MΩ; jumper (0 Ω) jumper jumper (0 Ω) (0 Ω) Resistance tolerance Temperature coefficient Rated dissipation, P70 (1) Operating voltage, Umax. ACRMS/DC Permissible film temperature, ± 5 %; ± 1 % ± 200 ppm/K; ± 100 ppm/K 0.063 W 0.10 W 0.125 W 0.25 W 0.5 W 1.0 W 0.75 W 1.0 W 50 V 75 V 150 V 200 V 200 V 200 V 400 V 500 V 300 V 300 V 300 V 300 V 155 °C ϑF max. (1) Operating temperature range Max. resistance change at P70 for resistance range, |ΔR/R|, after (2): 1000 h 8000 h Permissible voltage against ambient (insulation): 1 min, Uins Failure rate: FITobserved -55 °C to +155 °C ≤1% ≤2% 75 V 100 V 200 V 300 V ≤ 0.1 x 10-9/h Notes (1) Please refer to “Application Information” below (2) Apply to components with stability class 1 Revision: 07-Nov-2023 Document Number: 20035 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE D10/CRCW0402 e3 D11/CRCW0603 e3 D12/CRCW0805 e3 D25/CRCW1206 e3 CRCW1210 e3 CRCW1218 e3 CRCW2010 e3 CRCW2512 e3 TCR TOLERANCE RESISTANCE E-SERIES ± 200 ppm/K ±5% 1 Ω to 10 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 10 MΩ E24; E96 Jumper, Imax. = 1.5 A ≤ 20 mΩ 0Ω - ± 200 ppm/K ±5% 1 Ω to 10 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 10 MΩ E24; E96 Jumper, Imax. = 2.0 A ≤ 20 mΩ 0Ω - ± 200 ppm/K ±5% 1 Ω to 10 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 10 MΩ E24; E96 Jumper, Imax. = 2.5 A ≤ 20 mΩ 0Ω - ± 200 ppm/K ±5% 1 Ω to 10 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 10 MΩ E24; E96 Jumper, Imax. = 3.5 A ≤ 20 mΩ 0Ω - ± 200 ppm/K ±5% 1 Ω to 10 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 10 MΩ E24; E96 Jumper, Imax. = 5.0 A ≤ 20 mΩ 0Ω - ± 200 ppm/K ±5% 1 Ω to 2.2 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 2.2 MΩ E24; E96 Jumper, Imax. = 7.0 A ≤ 20 mΩ 0Ω - ± 200 ppm/K ±5% 1 Ω to 10 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 10 MΩ E24; E96 Jumper, Imax. = 6.0 A ≤ 20 mΩ 0Ω - ± 200 ppm/K ±5% 1 Ω to 10 MΩ E24 ± 100 ppm/K ±1% 1 Ω to 10 MΩ E24; E96 Jumper, Imax. = 7.0 A ≤ 20 mΩ 0Ω - Note • The temperature coefficient of resistance (TCR) is not specified for 0 Ω jumpers Revision: 07-Nov-2023 Document Number: 20035 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay PACKAGING TYPE / SIZE D10/CRCW0402 e3 D11/CRCW0603 e3 D12/CRCW0805 e3 D25/CRCW1206 e3 CRCW1210 e3 CRCW1218 e3 CRCW2010 e3 CRCW2512 e3 CODE QUANTITY ED = ET7 EE = EF4 EI = ET2 ED = ET3 EE = ET8 EA = ET1 EC = ET6 EA = ET1 EC = ET6 EA = ET1 EC = ET6 EA = ET1 EC = ET6 EK = ET9 EF = E02 EG = E67 EH = E82 10 000 50 000 5000 10 000 50 000 5000 20 000 5000 20 000 5000 20 000 5000 20 000 4000 4000 2000 4000 PACKAGING STYLE WIDTH PITCH 8 mm 2 mm PACKAGING DIMENSIONS Ø 180 mm / 7" Ø 330 mm / 13" Ø 180 mm / 7" Ø 180 mm / 7" Ø 330 mm / 13" Ø 180 mm / 7" Ø 330 mm / 13" Ø 180 mm / 7" Ø 330 mm / 13" Ø 180 mm / 7" Ø 330 mm / 13" Ø 180 mm / 7" Ø 330 mm / 13" Ø 180 mm / 7" Ø 180 mm / 7" 2 mm 8 mm 4 mm Paper tape acc. to IEC 60286-3, Type 1a Blister tape acc. to IEC 60286-3, Type 2a 8 mm 4 mm 8 mm 4 mm 8 mm 4 mm 12 mm 12 mm 4 mm 4 mm 8 mm 4 mm 12 mm Ø 180 mm / 7" PART NUMBER AND PRODUCT DESCRIPTION Part Number: CRCW0603562RFKEA Part Number: CRCW06030000Z0EA C R C W 0 6 0 3 5 6 2 R F K E A TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 R = decimal K = thousand M = million 0000 = jumper F=±1% J=±5% Z = jumper K = ± 100 ppm/K N = ± 200 ppm/K 0 = jumper EA, EC, ED, EE, EF, EG, EH, EI, EK Product Description: D11/CRCW0603 100 562R 1% ET1 e3 Product Description: D11/CRCW0603 0R0 ET1 e3 D11/CRCW0603 100 562R 1% ET1 e3 TYPE / SIZE TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512 ± 100 ppm/K ± 200 ppm/K 10R = 10 Ω 562R = 562 Ω 1M = 1 MΩ 0R0 = jumper ±1% ±5% ET1, ET2, ET3, ET6, ET8, ET9, EF4, E02, E67, E82 e3 = pure tin termination finish Revision: 07-Nov-2023 Document Number: 20035 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A cermet film layer and a glass-over are deposited on a high grade (Al2O3) ceramic substrate with its prepared inner contacts. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a and Type 2a (1). Vishay acknowledges the following systems for the regulation of hazardous substances: • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. APPROVALS The resistors are qualified according to AEC-Q200. Where applicable, the resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1, EN 60115-8 and the variety of environmental test procedures of the IEC 60068 (1) series. RELATED PRODUCTS For more information about products with better TCR and tighter tolerance please refer to the “Lead (Pb)-Free Thick Film, Rectangular, Semi-Precision Chip Resistors” datasheet (www.vishay.com/doc?20036). The D/CRCW with SnPb termination plating is designed for applications where lead bearing terminations are mandatory. For ordering D/CRCW with SnPb terminations please refer to latest edition of datasheet D/CRCW (www.vishay.com/doc?20008). Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 07-Nov-2023 Document Number: 20035 4 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE Single Pulse Axis Title 1000 10 1000 1st line 2nd line 100 2nd line ^ Pmax. - Pulse Load (W) 10000 CRCW2512 CRCW1218 CRCW2010 CRCW1210 D25/CRCW1206 D12/CRCW0805 D11/CRCW0603 D10/CRCW0402 1 100 0.1 0.01 0.000001 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 ti - Pulse Duration (s) Maximum pulse load, single pulse; applicable if P → 0 and n < 1000 and Uˆ = Uˆ max.; for permissible resistance change equivalent to 8000 h operation Continuous Pulse Axis Title 10000 CRCW2512 CRCW1218 CRCW2010 CRCW1210 D25/CRCW1206 D12/CRCW0805 D11/CRCW0603 D10/CRCW0402 100 10 1000 1st line 2nd line 2nd line ^ Pmax. - Continuous Pulse Load (W) 1000 1 100 0.1 0.01 0.000001 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 ti - Pulse Duration (s) Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑamb) and Uˆ = Uˆ max.; for permissible resistance change equivalent to 8000 h operation Pulse Voltage Axis Title 2000 1800 1600 1400 1000 1200 1st line 2nd line 2nd line ^ Umax. - Pulse Voltage (V) 10000 CRCW2512 CRCW2010 D25/CRCW1206, CRCW1210, CRCW1218 D12/CRCW0805 D11/CRCW0603 D10/CRCW0402 1000 800 100 600 400 200 0 0.000001 10 0.00001 0.0001 0.001 0.01 0.1 1 10 ti - Pulse Duration (s) Maximum pulse voltage, single and continuous pulses; applicable if Pˆ = Pˆ max.; for permissible resistance change equivalent to 8000 h operation Revision: 07-Nov-2023 Document Number: 20035 5 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay Derating Axis Title 1.2 1.0 0.8 1000 1st line 2nd line 2nd line P - Power Dissipation (W) 10000 CRCW2512, CRCW1218 CRCW2010 CRCW1210 D25/CRCW1206 D12/CRCW0805 D11/CRCW0603 D10/CRCW0402 0.6 100 0.4 0.2 10 0 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 ϑamb - Ambient Temperature (°C) 80 90 100 110 120 130 140 150 160 Non-Linearity Axis Title 10000 D25/CRCW1206, CRCW2010 D12/CRCW0805 D11/CRCW0603 D10/CRCW0402 100 1000 80 1st line 2nd line 2nd line Attenuation of 3rd Harmoinc A3 (dB) 120 60 100 40 20 0 10 100 1K 10K 100K 1M 10 10M R - Resistance Value (Ω) Current Noise Axis Title 10 10000 D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 CRCW2010 1000 1st line 2nd line 2nd line Current Noise A1 (μV/V) 100 1 100 0.1 0.01 100 1K 10K 100K 1M 10 10M R - Resistance Value (Ω) Revision: 07-Nov-2023 Document Number: 20035 6 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the following specifications: The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: EN 60115-8 specification (successor of EN 140400), sectional EN 140401-802, detail specification Temperature: 15 °C to 35 °C IEC 60068-2-xx, test methods Relative humidity: 25 % to 75 % The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on boards in accordance with EN 60115-8, 2.4.2 unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD PROCEDURE TEST REQUIREMENTS PERMISSIBLE CHANGE (ΔR) STABILITY CLASS 1 STABILITY CLASS 2 OR BETTER OR BETTER Stability for product types: 1 Ω to 10 MΩ D/CRCW e3 4.5 - 4.8 - 4.25.1 - Resistance - ±1% ±5% Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C ± 100 ppm/K ± 200 ppm/K 70 °C; 1000 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) Endurance at 70 °C U = P 70 x R or U = Umax. whichever is the less severe; 1.5 h on; 0.5 h off 70 °C; 8000 h ± (2 % R + 0.1 Ω) ± (4 % R + 0.1 Ω) - Endurance at upper category temperature 155 °C; 1000 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH 4.37 67 (Cy) Damp heat, steady state, accelerated (85 ± 2) °C; (85 ± 5) % RH; U = 0.1 x P 85 x R ≤ 100 V; 1000 h 4.23 4.23.2 4.23.3 4.23.4 4.23.5 2 (Bb) 30 (Db) 1 (Ab) 13 (M) Climatic sequence: Dry heat Damp Cold Low air pressure 4.23.6 30 (Db) Damp heat, cyclic 4.23.7 - 1 (Aa) DC load Cold Rapid change of temperature 4.25.3 4.19 14 (Na) 4.13 - Short time overload 4.27 - Single pulse high voltage overload Revision: 07-Nov-2023 ± (1 % R + 0.05 Ω) ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 125 °C; 16 h 55 °C; 24 h; ≥ 90 % RH; 1 cycle -55 °C; 2 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 8.5 kPa; 2 h; (25 ± 10) °C 55 °C; 5 days; > 90 % RH; 5 cycles U = P 70 x R ≤ Umax.; 1 min -55 °C; 2 h ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) 30 min. at -55 °C and 30 min. at 125 °C ± (1 % R + 0.05 Ω) 1000 cycles no visible damage U = 2.5 x P 70 x R ≤ 2 x Umax.; ± (2 % R + 0.05 Ω) whichever is the less severe; 5 s Severity no. 4: U = 10 x P 70 x R ± (1 % R + 0.05 Ω) or U = 2 x Umax.; no visible damage whichever is the less severe; 10 pulses 10 μs / 700 μs Document Number: 20035 7 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD PROCEDURE TEST REQUIREMENTS PERMISSIBLE CHANGE (ΔR) STABILITY CLASS 1 STABILITY CLASS 2 OR BETTER OR BETTER Stability for product types: 1 Ω to 10 MΩ D/CRCW e3 U= 15 x P 70 x R or U = 2 x Umax.; whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles IEC 61340-3-1 (1); 3 positive + 3 negative discharges; ESD voltage acc. to size Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude ≤ 1.5 mm or ≤ 200 m/s2; 7.5 h Solder bath method, SnPb40; non-activated flux (235 ± 5) °C; (2 ± 0.2) s Solder bath method, Sn96.5Ag3Cu0.5; non-activated flux (245 ± 5) °C; (3 ± 0.3) s Soldering bath method; (260 ± 5) °C; (10 ± 1) s Isopropyl alcohol; +50 °C; method 2 CRCW0402 and CRCW0603: 9 N CRCW0805 to CRCW2512: 45 N 4.39 - Periodic electric overload 4.38 - Electrostatic discharge (human body model) 4.22 6 (Fc) Vibration 4.17 58 (Td) Solderability 4.18 58 (Td) 4.29 45 (XA) 4.32 21 (Uu3) Shear (adhesion) 4.33 21 (Ue1) Substrate bending Depth 2 mm; 3 times 4.7 - 4.35 - Voltage proof Flammability, needle flame test U = 1.4 x Uins; 60 s IEC 60695-11-5 (1); 10 s Resistance to soldering heat Component solvent resistance ± (1 % R + 0.05 Ω) no visible damage ± (1 % R + 0.05 Ω) ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) no visible damage no visible damage Good tinning (≥ 95 % covered); no visible damage ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) No visible damage No visible damage ± (0.25 % R + 0.05 Ω) no visible damage, no open circuit in bent position No flashover or breakdown No burning after 30 s Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 07-Nov-2023 Document Number: 20035 8 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW e3 www.vishay.com Vishay DIMENSIONS L T2 W H T1 DIMENSIONS AND MASS TYPE / SIZE D10/CRCW0402 e3 L (mm) 1.0 ± 0.05 W (mm) H (mm) T1 (mm) T2 (mm) MASS (mg) 0.65 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.10 0.2 ± 0.10 D11/CRCW0603 e3 1.55 + 0.10 / - 0.05 0.85 ± 0.10 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2 D12/CRCW0805 e3 2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.5 ± 0.10 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5 D25/CRCW1206 e3 3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 10 CRCW1210 e3 3.2 ± 0.20 2.5 ± 0.20 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 16 CRCW1218 e3 3.2 + 0.10 / - 0.20 4.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 29.5 CRCW2010 e3 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 25.5 CRCW2512 e3 6.3 ± 0.20 3.15 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.6 ± 0.20 40.5 SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING TYPE / SIZE G (mm) Y (mm) X (mm) REFLOW SOLDERING Z (mm) G (mm) Y (mm) X (mm) Z (mm) D10/CRCW0402 e3 - - - - 0.45 0.6 0.6 1.65 D11/CRCW0603 e3 0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.25 D12/CRCW0805 e3 0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90 D25/CRCW1206 e3 1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60 CRCW1210 e3 1.80 1.45 2.95 4.70 1.70 1.10 2.80 3.90 CRCW1218 e3 1.80 1.30 5.10 4.40 1.90 1.10 4.90 4.10 CRCW2010 e3 3.40 1.65 2.85 6.70 3.50 1.45 2.80 6.40 CRCW2512 e3 4.60 1.60 3.65 7.80 4.75 1.45 3.50 7.65 Note • The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications Revision: 07-Nov-2023 Document Number: 20035 9 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Revision: 01-Jan-2024