D/CRCW-HR e3
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Vishay
High Resistance Value Thick Film Chip Resistors
FEATURES
• High resistance values (up to 470 MΩ)
• Pure tin plating provides compatibility with
lead (Pb)-free and lead containing soldering
processing
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
APPLICATIONS
3D 3D
• Voltage dividers
3D Models
• Hybrids
The D/CRCW-HR chip resistor series is the perfect choice
for applications which require high resistance value
components. Typical applications include voltage dividers
and hybrids.
TECHNICAL SPECIFICATIONS
DESCRIPTION
Imperial size
Metric size code
D11/CRCW0603-HR e3
D12/CRCW0805-HR e3
0603
0805
1206
RR1608M
RR2012M
RR3216M
Resistance range
11 MΩ to 470 MΩ
Resistance tolerance
±5%
Temperature coefficient
± 500 ppm/K
Rated dissipation, P70 (1)
0.1 W
Operating voltage, Umax. ACRMS/DC
Voltage coefficient
D25/CRCW1206-HR e3
75 V
0.125 W
0.25 W
150 V
200 V
< 100M: < -0.1 ppm/V
> 100M: < -0.3 ppm/V
(2)
Permissible film temperature, ϑF max. (1)
155 °C
Operating temperature range
-55 °C to +155 °C
Max. resistance change at P70 for
resistance range, |ΔR/R| after:
1000 h
≤2%
8000 h
≤4%
Permissible voltage against ambient (insulation):
1 min, Uins
100 V
Failure rate: FITobserved
200 V
300 V
≤ 0.1 x 10-9/h
Notes
(1) Please refer to APPLICATION INFORMATION below
(2) Voltage coefficient was tested according to 10 V measurements
APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
Revision: 06-Dec-2023
Document Number: 20022
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR e3
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TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
TCR
TOLERANCE
RESISTANCE
E-SERIES
D11/CRCW0603-HR e3
± 500 ppm/K
±5
11 MΩ to 470 MΩ
E24
D12/CRCW0805-HR e3
± 500 ppm/K
±5
11 MΩ to 470 MΩ
E24
D25/CRCW1206-HR e3
± 500 ppm/K
±5
11 MΩ to 470 MΩ
E24
PACKAGING
TYPE / SIZE
CODE
QUANTITY
EA = ET1
5000
PACKAGING STYLE
PITCH
8 mm
4 mm
PACKAGING
DIMENSIONS
180 mm / 7"
D11/CRCW0603-HR e3
EC = ET6
WIDTH
20 000
EA = ET1
330 mm / 13"
Paper tape
according to
IEC 60286-3,
Type 1a
5000
D12/CRCW0805-HR e3
EC = ET6
20 000
EA = ET1
5000
180 mm / 7"
8 mm
4 mm
330 mm / 13"
180 mm / 7"
D25/CRCW1206-HR e3
8 mm
EC = ET6
4 mm
20 000
330 mm / 13"
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW060316M0JPEAHR
C
R
C
W
0
6
0
3
1
6
M
0
J
P
E
A
H
R
MODEL / SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
SPECIAL
CRCW0603
CRCW0805
CRCW1206
M = million
J=±5%
P = ± 500 ppm/K
EA, EC
Up to 2 digits
HR = high value
Product Description: D11/CRCW0603-HR 500 16M 5 % ET1 e3
D11/CRCW0603-HR
500
16M
5%
ET1
e3
MODEL
TCR
RESISTANCE
TOLERANCE
PACKAGING
LEAD (Pb)-FREE
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
± 500 ppm/K
68M = 68 MΩ
227M = 227 MΩ
±5%
ET1, ET6
e3 = pure tin
termination
finish
Revision: 06-Dec-2023
Document Number: 20022
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR e3
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DESCRIPTION
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A cermet film
layer and a glass-over are deposited on a high grade (Al2O3)
ceramic substrate with its prepared inner contacts. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating.
The result of the determined production is verified by an
extensive testing procedure on 100 % of the individual chip
resistors. Only accepted products are laid directly into
the tape in accordance with IEC 60286-3 Type 1a (1).
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
Vishay
The products do not contain any of the banned
substances as per IEC 62474, GADSL, or the SVHC list,
see www.vishay.com/how/leadfree.
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2011/65/EU Restriction of the Use of Hazardous
Substances
Directive
(RoHS)
with
amendment
2015/863/EU
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
Where applicable, the resistors are tested in accordance
with EN 140401-802 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series.
RELATED PRODUCTS
For more information about high voltage products, please
refer to RCV e3 datasheet “High Voltage (Up to 2 kV) Thick
Film Chip Resistors” (www.vishay.com/doc?20054).
The D/CRCW-HR with SnPb termination plating is designed
for applications where lead bearing terminations are
mandatory. For ordering D/CRCW-HR with SnPb
terminations please refer to latest edition of datasheet
D/CRCW-HR (www.vishay.com/doc?20011).
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
Revision: 06-Dec-2023
Document Number: 20022
3
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR e3
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FUNCTIONAL PERFORMANCE
Derating
Axis Title
10000
D25/CRCW1206-HR
D12/CRCW0805-HR
D11/CRCW0603-HR
0.3
1000
1st line
2nd line
2nd line
P - Power Dissipation (W)
0.4
0.2
100
0.1
10
0
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
ϑamb - Ambient Temperature (°C)
80
90
100 110 120 130 140 150 160
TESTS AND REQUIREMENTS
All executed tests are carried out in accordance with the
following specifications:
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5201-1.
EN 60115-1, generic specification
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
EN 60115-8, sectional specification
EN 140401-802, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-802. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
Revision: 06-Dec-2023
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days). The components are
mounted for testing on boards in accordance with EN
60115-8, 2.4.2 unless otherwise specified.
Document Number: 20022
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TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC 60068-2
TEST
METHOD
PROCEDURE
(1)
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
STABILITY CLASS 2 OR BETTER
TEST
Stability for product types:
11 MΩ to 470 MΩ
D/CRCW-HR e3
4.5
-
4.8
-
Resistance
-
±5%
Temperature coefficient
At (20 / -55 / 20) °C and
(20 / 125 / 20) °C
± 500 ppm/K
U = P 70 x R ≤ Umax.;
1.5 h on; 0.5 h off;
4.25.1
4.25.3
4.24
4.23
-
Endurance at 70 °C
70 °C; 1000 h
± (2 % R + 0.1 Ω)
70 °C; 8000 h
± (4 % R + 0.1 Ω)
-
Endurance at upper
category temperature
155 °C; 1000 h
± (2 % R + 0.1 Ω)
78 (Cab)
Damp heat, steady state
(40 ± 2) °C; (93 ± 3) % RH;
56 days
± (2 % R + 0.1 Ω)
-
Climatic sequence:
-
4.23.2
2 (Ba)
Dry heat
125 °C; 16 h
4.23.3
30 (Db)
Damp heat, cyclic
55 °C; 24 h; ≥ 90 % RH; 1 cycle
4.23.4
1 (Ab)
Cold
-55 °C; 2 h
4.23.5
13 (M)
Low air pressure
8.5 kPa; 2 h; (25 ± 10) °C
4.23.6
30 (Db)
Damp heat, cyclic
55 °C; 5 days;
> 90 % RH; 5 cycles
4.23.7
-
DC load
U = P 70 x R ≤ Umax.; 1 min
4.19
14 (Na)
Rapid change
of temperature
30 min. at -55 °C and 30 min. at 125 °C;
1000 cycles
± (1 % R + 0.05 Ω)
4.13
-
Short time overload
U = 2.5 x P 70 x R ≤ 2 x Umax.;
whichever is the less severe; 5 s
± (2 % R + 0.05 Ω)
Solder bath method,
Sn60Pb40
non-activated flux; (235 ± 5) °C;
(2 ± 0.2) s
± (2 % R + 0.1 Ω)
Good tinning (≥ 95 % covered);
no visible damage
4.17
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7
non-activated flux;
(245 ± 5) °C or (250 ± 5) °C
(3 ± 0.3) s
4.18
58 (Td)
Resistance to
soldering heat
Solder bath method (260 ± 5) °C;
(10 ± 1) s
± (0.5 % R + 0.05 Ω)
4.29
45 (XA)
Component solvent
resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.32
21 (Uu3)
Shear (adhesion)
D11/CRCW0603-HR: 9
D12/CRCW0805-HR and
D25/CRCW1206-HR: 45 N
No visible damage
4.33
21 (Uu1)
Substrate bending
Depth 2 mm; 3 times
No visible damage,
no open circuit in bent position
± (0.25 % R + 0.05 Ω)
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 06-Dec-2023
Document Number: 20022
5
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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DIMENSIONS
L
T2
W
H
T1
DIMENSIONS AND MASS
L
(mm)
W
(mm)
H
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
D11/CRCW0603-HR e3
1.55 + 0.10 / - 0.05
0.85 ± 0.1
0.45 ± 0.05
0.3 ± 0.20
0.3 ± 0.20
2
D12/CRCW0805-HR e3
2.0 + 0.20 / - 0.10
1.25 ± 0.15
0.5 ± 0.10
0.3 + 0.20 / - 0.10
0.3 ± 0.20
5.5
D25/CRCW1206-HR e3
3.2 + 0.10 / - 0.20
1.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
10
TYPE / SIZE
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
REFLOW SOLDERING
TYPE / SIZE
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
D11/CRCW0603-HR e3
0.65
1.10
1.25
2.85
0.75
0.75
1.00
2.25
D12/CRCW0805-HR e3
0.90
1.30
1.60
3.50
1.00
0.95
1.45
2.90
D25/CRCW1206-HR e3
1.40
1.40
1.95
4.20
1.50
1.05
1.80
3.60
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. Still, the given solder pad dimensions will be found adequate for most general applications
Revision: 06-Dec-2023
Document Number: 20022
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For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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© 2024 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Document Number: 91000
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Revision: 01-Jan-2024