CRCW0805180MJPEAHR

D/CRCW-HR e3 www.vishay.com Vishay High Resistance Value Thick Film Chip Resistors FEATURES • High resistance values (up to 470 MΩ) • Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processing • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 LINKS TO ADDITIONAL RESOURCES APPLICATIONS 3D 3D • Voltage dividers 3D Models • Hybrids The D/CRCW-HR chip resistor series is the perfect choice for applications which require high resistance value components. Typical applications include voltage dividers and hybrids. TECHNICAL SPECIFICATIONS DESCRIPTION Imperial size Metric size code D11/CRCW0603-HR e3 D12/CRCW0805-HR e3 0603 0805 1206 RR1608M RR2012M RR3216M Resistance range 11 MΩ to 470 MΩ Resistance tolerance ±5% Temperature coefficient ± 500 ppm/K Rated dissipation, P70 (1) 0.1 W Operating voltage, Umax. ACRMS/DC Voltage coefficient D25/CRCW1206-HR e3 75 V 0.125 W 0.25 W 150 V 200 V < 100M: < -0.1 > 100M: < -0.3 (2) Permissible film temperature, ϑF max. (1) 155 °C Operating temperature range -55 °C to +155 °C Max. resistance change at P70 for resistance range, |ΔR/R| after: 1000 h ≤2% 8000 h ≤4% Permissible voltage against ambient (insulation): 1 min, Uins 100 V Failure rate: FITobserved 200 V 300 V ≤ 0.1 x 10-9/h Notes (1) Please refer to APPLICATION INFORMATION below (2) Voltage coefficient was tested according to 10 V measurements APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 09-Feb-2022 Document Number: 20022 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW-HR e3 www.vishay.com Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES D11/CRCW0603-HR e3 ± 500 ppm/K ±5 11 MΩ to 470 MΩ E24 D12/CRCW0805-HR e3 ± 500 ppm/K ±5 11 MΩ to 470 MΩ E24 D25/CRCW1206-HR e3 ± 500 ppm/K ±5 11 MΩ to 470 MΩ E24 PACKAGING TYPE / SIZE D11/CRCW0603-HR e3 D12/CRCW0805-HR e3 D25/CRCW1206-HR e3 CODE QUANTITY EA = ET1 5000 EB = ET5 10 000 EC = ET6 20 000 EA = ET1 5000 EB = ET5 10 000 EC = ET6 20 000 EA = ET1 5000 EB = ET5 10 000 EC = ET6 20 000 PACKAGING STYLE WIDTH PACKAGING DIMENSIONS PITCH 180 mm / 7" 8 mm 4 mm 285 mm / 11.25" 330 mm / 13" 180 mm / 7" Paper tape according to IEC 60286-3, Type 1a 8 mm 4 mm 285 mm / 11.25" 330 mm / 13" 180 mm / 7" 8 mm 4 mm 285 mm / 11.25" 330 mm / 13" PART NUMBER AND PRODUCT DESCRIPTION Part Number: CRCW060316M0JPEAHR C R C W 0 6 0 3 1 6 M 0 J P E A H R MODEL / SIZE RESISTANCE TOLERANCE TCR PACKAGING SPECIAL CRCW0603 CRCW0805 CRCW1206 M = million J=±5% P = ± 500 ppm/K EA EB EC Up to 2 digits HR = high value Product Description: D11/CRCW0603-HR 500 16M 5 % ET1 e3 D11/CRCW0603-HR 500 16M 5% ET1 e3 MODEL TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE D11/CRCW0603-HR D12/CRCW0805-HR D25/CRCW1206-HR ± 500 ppm/K 68M = 68 MΩ 227M = 227 MΩ ±5% ET1 ET5 ET6 e3 = pure tin termination finish Revision: 09-Feb-2022 Document Number: 20022 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW-HR e3 www.vishay.com DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A cermet film layer and a glass-over are deposited on a high grade (Al2O3) ceramic substrate with its prepared inner contacts. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a (1). ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. Vishay The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. APPROVALS Where applicable, the resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1, EN 60115-8 and the variety of environmental test procedures of the IEC 60068 (1) series. RELATED PRODUCTS For more information about high voltage products, please refer to RCV e3 datasheet “High Voltage (Up to 2 kV) Thick Film Chip Resistors” (www.vishay.com/doc?20054). The D/CRCW-HR with SnPb termination plating is designed for applications where lead bearing terminations are mandatory. For ordering D/CRCW-HR with SnPb terminations please refer to latest edition of datasheet D/CRCW-HR (www.vishay.com/doc?20011). MATERIALS Vishay acknowledges the following systems for the regulation of hazardous substances: • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 09-Feb-2022 Document Number: 20022 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW-HR e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE Derating Axis Title 10000 D25/CRCW1206-HR D12/CRCW0805-HR D11/CRCW0603-HR 0.3 1000 1st line 2nd line 2nd line P - Power Dissipation (W) 0.4 0.2 100 0.1 10 0 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 ϑamb - Ambient Temperature (°C) 80 90 100 110 120 130 140 150 160 TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the following specifications: The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: EN 60115-8, sectional specification EN 140401-802, detail specification IEC 60068-2-xx, test methods The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. Revision: 09-Feb-2022 Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on boards in accordance with EN 60115-8, 2.4.2 unless otherwise specified. Document Number: 20022 4 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW-HR e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD PROCEDURE (1) REQUIREMENTS PERMISSIBLE CHANGE (ΔR) STABILITY CLASS 2 OR BETTER TEST Stability for product types: 11 MΩ to 470 MΩ D/CRCW-HR e3 4.5 - 4.8 - Resistance - ±5% Temperature coefficient At (20 / -55 / 20) °C and (20 / 125 / 20) °C ± 500 ppm/K U = P 70 x R ≤ Umax.; 1.5 h on; 0.5 h off; 4.25.1 4.25.3 4.24 4.23 - Endurance at 70 °C 70 °C; 1000 h ± (2 % R + 0.1 Ω) 70 °C; 8000 h ± (4 % R + 0.1 Ω) - Endurance at upper category temperature 155 °C; 1000 h ± (2 % R + 0.1 Ω) 78 (Cab) Damp heat, steady state (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (2 % R + 0.1 Ω) - Climatic sequence: - 4.23.2 2 (Ba) Dry heat 125 °C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h; ≥ 90 % RH; 1 cycle 4.23.4 1 (Ab) Cold -55 °C; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 5 days; > 90 % RH; 5 cycles 4.23.7 - DC load U = P 70 x R ≤ Umax.; 1 min 4.19 14 (Na) Rapid change of temperature 30 min. at -55 °C and 30 min. at 125 °C; 1000 cycles ± (1 % R + 0.05 Ω) 4.13 - Short time overload U = 2.5 x P 70 x R ≤ 2 x Umax.; whichever is the less severe; 5 s ± (2 % R + 0.05 Ω) Solder bath method, Sn60Pb40 non-activated flux; (235 ± 5) °C; (2 ± 0.2) s ± (2 % R + 0.1 Ω) Good tinning (≥ 95 % covered); no visible damage 4.17 58 (Td) Solderability Solder bath method; Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7 non-activated flux; (245 ± 5) °C or (250 ± 5) °C (3 ± 0.3) s 4.18 58 (Td) Resistance to soldering heat Solder bath method (260 ± 5) °C; (10 ± 1) s ± (0.5 % R + 0.05 Ω) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol; 50 °C; method 2 No visible damage 4.32 21 (Uu3) Shear (adhesion) D11/CRCW0603-HR: 9 D12/CRCW0805-HR and D25/CRCW1206-HR: 45 N No visible damage 4.33 21 (Uu1) Substrate bending Depth 2 mm; 3 times No visible damage, no open circuit in bent position ± (0.25 % R + 0.05 Ω) Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 09-Feb-2022 Document Number: 20022 5 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 D/CRCW-HR e3 www.vishay.com Vishay DIMENSIONS L T2 W H T1 DIMENSIONS AND MASS L (mm) W (mm) H (mm) T1 (mm) T2 (mm) MASS (mg) D11/CRCW0603-HR e3 1.55 + 0.10 / - 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2 D12/CRCW0805-HR e3 2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5 D25/CRCW1206-HR e3 3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 10 TYPE / SIZE SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) D11/CRCW0603-HR e3 0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.25 D12/CRCW0805-HR e3 0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90 D25/CRCW1206-HR e3 1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60 Note • The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications Revision: 09-Feb-2022 Document Number: 20022 6 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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