CRCW080525R5FKEBC

CRCW...C e3 www.vishay.com Vishay Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors FEATURES • High volume product suitable for commercial applications • Stability (R/R  1 % for 1000 h at 70 °C) • Lead (Pb)-free solder contacts on Ni barrier layer • Metal glaze on ceramic • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 STANDARD ELECTRICAL SPECIFICATIONS MODEL CASE SIZE INCH CRCW0402...C 0402 CASE SIZE METRIC POWER RATING P70 °C W LIMITING ELEMENT VOLTAGE MAX. V  0.063 50 RR 1005M TEMPERATURE COEFFICIENT ppm/K TOLERANCE % RESISTANCE RANGE  E-SERIES ± 100 ±1 1R0 to 10M E24; E96 ± 200 ±5 1R0 to 10M E24 ± 100 ±1 1R0 to 10M E24; E96 ± 200 ±5 1R0 to 10M E24 ± 100 ±1 1R0 to 10M E24; E96 ± 200 ±5 1R0 to 10M E24 ± 100 ±1 1R0 to 10M E24; E96 ± 200 ±5 1R0 to 10M E24 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 1.5 A CRCW0603...C 0603 0.10 RR 1608M 75 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.0 A CRCW0805...C 0805 0.125 RR 2012M 150 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.5 A CRCW1206...C 1206 0.25 RR 3216M 200 Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 3.5 A Notes • These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime • Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material TECHNICAL SPECIFICATIONS PARAMETER UNIT CRCW0402...C CRCW0603...C CRCW0805...C CRCW1206...C Rated dissipation at 70°C (1) W 0.063 0.10 0.125 0.25 Limiting element voltage Umax. AC/DC V 50 75 150 200 Insulation voltage Uins. (1 min) V > 75 > 100 > 200 > 300 Insulation resistance  > 109 Category temperature range °C - 55 to + 155 Failure rate h-1 0.1 x 10-9 5.5 10 Weight/1000 pieces g 0.65 2 Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded Revision: 02-Nov-17 Document Number: 28773 1 For technical questions, contact: ff3aresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW...C e3 www.vishay.com Vishay PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: CRCW0603562RFKECC C R C W 0 6 0 3 5 6 2 R F K E C C MODEL/SIZE VALUE TOLERANCE TCR PACKAGING SPECIAL CRCW0402 CRCW0603 CRCW0805 CRCW1206 R = decimal K = thousand M = million 0000 = jumper F = ± 1.0 % J = ± 5.0 % Z = jumper K = ± 100 ppm/K N = ± 200 ppm/K 0 = jumper EA, EB, EC, ED, EE Up to 2 digits C = commodity PRODUCT DESCRIPTION: CRCW0603-C 100 562R 1 % ET6 E3 CRCW0603-C 100 562R 1% ET6 e3 MODEL TCR RESISTANCE VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE CRCW0402-C CRCW0603-C CRCW0805-C CRCW1206-C ± 200 ppm/K ± 100 ppm/K ±5% ±1% ET1, ET5, ET6, ET7, EF4 e3 = pure tin termination finish 10R = 10  562R = 562  10K = 10.0 k 1M = 1 M 0R0 = jumper PACKAGING TYPE / SIZE CRCW0402…C CRCW0603…C CRCW0805…C CRCW1206…C CODE QUANTITY ED = ET7 EE = EF4 EA = ET1 EB = ET5 EC = ET6 EA = ET1 EB = ET5 EC = ET6 EA = ET1 EB = ET5 EC = ET6 10 000 50 000 5000 10 000 20 000 5000 10 000 20 000 5000 10 000 20 000 PACKAGING STYLE WIDTH PACKAGING DIMENSIONS Ø 180 mm/7" Ø 330 mm/13" Ø 180 mm/7" Ø 254 mm/10" Ø 330 mm/13" Ø 180 mm/7" Ø 254 mm/10" Ø 330 mm/13" Ø 180 mm/7" Ø 254 mm/10" Ø 330 mm/13" PITCH 2 mm 4 mm Paper tape acc. to IEC 60286-3, Type 1a 8 mm 4 mm 4 mm DIMENSIONS SIZE DIMENSIONS (in millimeters) INCH METRIC 0402 1005 0603 1608 0805 2012 L 1.0 ± 0.10 1.60 ± 0.10 2.0 ± 0.10 W 0.5 ± 0.05 0.80 ± 0.10 1.25 ± 0.15 H T1 0.30 ± 0.05 0.25 ± 0.10 0.45 ± 0.10 0.3 ± 0.2 0.50 ± 0.10 0.35 ± 0.15 1206 3.05 ± 0.10 1.55 ± 0.10 0.55 3216 + 0.10 - 0.05 0.35 ± 0.15 T2 0.2 ± 0.1 0.3 ± 0.2 0.35 ± 0.2 0.45 ± 0.2 SOLDER PAD DIMENSIONS (1) (in millimeters) REFLOW SOLDERING WAVE SOLDERING a b l a b l 0.4 0.6 0.5 0.5 0.9 1.0 0.9 0.9 1.0 0.7 1.3 1.2 0.9 1.3 1.3 0.9 1.7 2.0 1.1 1.7 2.3 Note (1) The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials maybe required to maintain the reliability of the assembly. Specified power rating above 125 °C requires dedicated heat-sink pads, which depend on board materials. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still the given solder pad dimensions will be found adequate for most general applications Revision: 02-Nov-17 Document Number: 28773 2 For technical questions, contact: ff3aresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW...C e3 www.vishay.com Vishay Rated Power in % FUNCTIONAL PERFORMANCE 120 100 80 60 40 20 0 - 55 - 25 0 25 50 Derating 75 100 125 155 175 70 Ambient Temperature in °C TEST PROCEDURES AND REQUIREMENTS IEC 60068-2 EN 60115-1 TEST CLAUSE METHOD REQUIREMENTS PERMISSIBLE CHANGE (R) TEST PROCEDURE STABILITY CLASS 1 OR BETTER STABILITY CLASS 2 OR BETTER Stability for product types: 1  to 10 M 1  to 10 M 4.5 - Resistance - ±1% ±5% 4.8.4.2 - Temperature coefficient (20/- 55/20) °C and (20/125/20) °C ± 100 ppm/K ± 200 ppm/K 4.13 - Short time overload CRCW...C e3 4.17.5 58 (Td) Solderability U = 2.5 x P 70 x R  2 x Umax.; 5 s Pre-aging 4 h at 155 °C, dryheat ± (2 % R + 0.1 ) Solder bath method; Sn60Pb40 non activated flux; (235 ± 5) °C (2 ± 0.2) s Good tinning ( 95 % covered) no visible damage Solder bath method; Sn96.5Ag3Cu0.5 non activated flux; (245 ± 5) °C (3 ± 0.3) s Good tinning ( 95 % covered) no visible damage 4.18.2 58 (Td) Resistance to soldering heat Solder bath method (260 ± 5) °C; (10 ± 1) s 4.19 14 (Na) Rapid change of temperature 30 min. at - 55 °C; 30 min. at 125 °C; 5 cycles ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 4.36 - Operation at low temperature -55 °C, 1 h 4.25.1 4.25.3 Revision: 02-Nov-17 - - Endurance at 70 °C Endurance at upper category temperature ± (1% R + 0.05 ) ± (1 % R + 0.05 ) U = P 70 x R  Umax.; 1.5 h on; 0.5 h off; 70 °C; 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 70 °C; 8000 h ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) 155 °C, 1000 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) Document Number: 28773 3 For technical questions, contact: ff3aresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRCW...C e3 www.vishay.com Vishay APPLICABLE SPECIFICATIONS • EN 60115-1 Generic specification • EN 140400 Sectional specification • EN 140401-802 Detail specification • IEC 60068-2-X Variety of environmental test procedures • IEC 60286-3 Packaging of SMD components Revision: 02-Nov-17 Document Number: 28773 4 For technical questions, contact: ff3aresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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