D/CRCW-IF e3
www.vishay.com
Vishay
Pulse Proof Thick Film Chip Resistors
FEATURES
• High pulse performance, up to 10 kW
• High pulse voltage up to 4 kV, 1.2 μs / 50 μs
• Stability at different environmental conditions
R/R 1 % (1000 h rated power at 70 °C)
• AEC-Q200 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
LINKS TO ADDITIONAL RESOURCES
3D 3D
APPLICATIONS
• DC-DC converters
3D Models
• On-board chargers
The pulse proof thick film chip resistor series is the perfect
choice for high pulse load performance resistors. Typical
applications include automotive DC-DC converters and
on-board chargers, lighting ballasts, and storage drivers.
• Lighting ballasts
• Storage drivers
TECHNICAL SPECIFICATIONS
DESCRIPTION
D10/CRCW0402-IFD11/CRCW0603-IFD12/CRCW0805-IFD25/CRCW1206-IFCRCW1210-IFCRCW2010-IFCRCW2512-IF
e3
e3
e3
e3
e3
e3
e3
Imperial size
Metric size code
0402
0603
0805
1206
1210
2010
2512
RR1005M
RR1608M
RR2012M
RR3216M
RR3225M
RR5025M
RR6332M
Resistance range
1 to 100 k
Resistance
tolerance
± 10 %; ± 5 %
Temperature
coefficient
± 200 ppm/K
Rated
dissipation, P70 (1)
0.063 W
0.10 W
0.125 W
0.25 W
0.50 W
0.75 W
1.0 W
Operating
voltage,
Umax. ACRMS/DC
50 V
75 V
150 V
200 V
200 V
400 V
500 V
300 V
300 V
300 V
Permissible film
temperature,
155 °C
F max. (1)
Operating
temperature
range
-55 °C to +155 °C
Max. resistance
change at P70 for
resistance range,
IR/RI after:
1000 h
1.0 %
8000 h
2.0 %
Permissible
voltage against
ambient
(insulation):
1 min, Uins
75 V
100 V
Failure rate:
FITobserved
200 V
300 V
0.1 x 10-9/h
Note
(1) Please refer to “Application Information” below
Revision: 09-Sep-2021
Document Number: 20024
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
TCR
D10/CRCW0402-IF e3
± 200 ppm/K
D11/CRCW0603-IF e3
± 200 ppm/K
D12/CRCW0805-IF e3
± 200 ppm/K
D25/CRCW1206-IF e3
± 200 ppm/K
CRCW1210-IF e3
± 200 ppm/K
CRCW2010-IF e3
± 200 ppm/K
CRCW2512-IF e3
± 200 ppm/K
TOLERANCE
RESISTANCE
E-SERIES
± 10 %
1.0 to 100 k
E24
1.0 to 100 k
E24
1.0 to 100 k
E24
1.0 to 100 k
E24
1.0 to 100 k
E24
1.0 to 100 k
E24
1.0 to 100 k
E24
±5%
± 10 %
±5%
± 10 %
±5%
± 10 %
±5%
± 10 %
±5%
± 10 %
±5%
± 10 %
±5%
PACKAGING
TYPE / SIZE
D10/CRCW0402-IF e3
D11/CRCW0603-IF e3
D12/CRCW0805-IF e3
D25/CRCW1206-IF e3
CRCW1210-IF e3
CRCW2010-IF e3
CRCW2512-IF e3
Revision: 09-Sep-2021
CODE
QUANTITY
ED = ET7
10 000
EE = EF4
50 000
EI = ET2
5000
ED = ET3
10 000
EL = ET4
20 000
EE = ET8
50 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EA = ET1
5000
EB = ET5
10 000
EC = ET6
20 000
EF = E02
4000
EG = E67
2000
EH = E82
4000
PACKAGING STYLE
WIDTH
PITCH
8 mm
2 mm
PACKAGING DIMENSIONS
Ø 180 mm / 7"
Ø 330 mm / 13"
Ø 180 mm / 7"
2 mm
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
8 mm
Ø 180 mm / 7"
4 mm
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Paper tape according to
IEC 60286-3, type 1a
Ø 180 mm / 7"
8 mm
4 mm
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
8 mm
4 mm
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
8 mm
4 mm
12 mm
4 mm
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Blister tape according to
IEC 60286-3 type 2a
12 mm
8 mm
4 mm
Ø 180 mm / 7"
Ø 180 mm / 7"
Document Number: 20024
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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D/CRCW-IF e3
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PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW08051R00JNEAIF
C
R
C
W
0
8
0
5
1
R
0
0
J
N
E
A
I
F
TYPE
VALUE
TOLERANCE
TCR
PACKAGING
SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW2010
CRCW2512
R = decimal
K = thousand
J=±5%
K = ± 10 %
N = ± 200 ppm/K
EA, EB,
EC, ED,
EE, EF,
EG, EH,
EI, EL
Up to 2 digits
IF = pulse proof
Product Description: D12/CRCW0805-IF 200 1R0 5 % ET1 e3
D12/CRCW0805-IF
200
1R0
5%
ET1
e3
TYPE
TCR
RESISTANCE
VALUE
TOLERANCE
PACKAGING
LEAD (Pb)-FREE
D10/CRCW0402-IF
D11/CRCW0603-IF
D12/CRCW0805-IF
D25/CRCW1206-IF
CRCW1210-IF
CRCW2010-IF
CRCW2512-IF
± 200 ppm/K
1R0 = 1
10K = 10 k
±5%
± 10 %
ET1, ET2,
ET3, ET4,
ET5, ET6,
ET7, ET8,
EF4, E02,
E67, E82
e3 = pure tin
termination finish
Revision: 09-Sep-2021
Document Number: 20024
3
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-IF e3
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DESCRIPTION
Vishay
• The Global Automotive Declarable Substance List
(GADSL) (3)
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A cermet film
layer and a glass-over are deposited on a high grade (Al2O3)
ceramic substrate with its prepared inner contacts. The
resistor elements are covered by a protective coating
designed for electrical, mechanical and climatic protection.
The terminations receive a final pure tin on nickel plating.
The result of the determined production is verified by an
extensive testing procedure on 100 % of the individual chip
resistors. Only accepted products are laid directly into
the tape in accordance with IEC 60286-3 Type 1a and
Type 2a (1).
The products do not contain any of the banned
substances as per IEC 62474, GADSL, or the SVHC list,
see www.vishay.com/how/leadfree.
ASSEMBLY
• 2011/65/EU Restriction of the Use of Hazardous
Substances
Directive
(RoHS)
with
amendment
2015/863/EU
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS-compliant, the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. Solderability is
specified for 2 years after production or requalification. The
permitted storage time is 20 years. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
MATERIALS
Vishay acknowledges the following systems for the
regulation of hazardous substances:
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
Hence the products fully comply with the following
directives:
• 2000/53/EC End-of-Life Vehicle Directive (ELV) and
Annex II (ELV II)
• 2012/19/EU Waste Electrical and Electronic Equipment
Directive (WEEE)
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are qualified according to AEC-Q200.
Where applicable, the resistors are tested in accordance
with EN 140401-802 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series.
RELATED PRODUCTS
For more information about pulse proof and high power
products please refer to CRCW-HP e3, “Pulse Proof,
High Power Thick Film Chip Resistors” datasheet
(www.vishay.com/doc?20043)
For anti-surge and high power products, please refer to
RCS e3, “Anti-Surge, High Power Thick Film Chip Resistors”
datasheet (www.vishay.com/doc?20065)
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
Revision: 09-Sep-2021
Document Number: 20024
4
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-IF e3
www.vishay.com
Vishay
FUNCTIONAL PERFORMANCE
Single Pulse
Axis Title
100 000
1000
100
1000
1st line
2nd line
10 000
2nd line
^
Pmax. - Pulse Load (W)
10000
CRCW2512-IF
CRCW2010-IF
CRCW1210-IF
D25/CRCW1206-IF
D12/CRCW0805-IF
D11/CRCW0603-IF
D10/CRCW0402-IF
10
100
1
0.1
0.01
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
ti - Pulse Duration (s)
Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and Uˆ = Uˆ max.;
for permissible resistance change equivalent to 8000 h operation
Continuous Pulse
Axis Title
10000
CRCW2512-IF
CRCW2010-IF
CRCW1210-IF
D25/CRCW1206-IF
D12/CRCW0805-IF
D11/CRCW0603-IF
D10/CRCW0402-IF
10 000
1000
100
1000
1st line
2nd line
2nd line
^
Pmax. - Continuous Pulse Load (W)
100 000
10
100
1
0.1
0.01
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
ti - Pulse Duration (s)
Maximum pulse load, continuous pulses; applicable if P P (amb) and Uˆ = Uˆ max.;
for permissible resistance change equivalent to 8000 h operation
Pulse Voltage
Axis Title
2000
10000
CRCW2512-IF
CRCW2010-IF
D25/CRCW1206-IF, CRCW1210-IF
D12/CRCW0805-IF
D11/CRCW0603-IF
D10/CRCW0402-IF
1800
1400
1000
1200
1st line
2nd line
2nd line
^
Umax. - Pulse Voltage (V)
1600
1000
800
100
600
400
200
0
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
ti - Pulse Duration (s)
Maximum pulse voltage, single and continuous pulses; applicable if Pˆ = Pˆ max.;
for permissible resistance change equivalent to 8000 h operation
Revision: 09-Sep-2021
Document Number: 20024
5
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-IF e3
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Derating
Axis Title
1.2
1.0
0.8
1000
1st line
2nd line
2nd line
P - Power Dissipation (W)
10000
CRCW2512-IF
CRCW2010-IF
CRCW1210-IF
D25/CRCW1206-IF
D12/CRCW0805-IF
D11/CRCW0603-IF
D10/CRCW0402-IF
0.6
100
0.4
0.2
10
0
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
ϑamb - Ambient Temperature (°C)
80
90
100 110 120 130 140 150 160
1.2 μs / 50 μs Pulse
Axis Title
10 000
10000
CRCW2512-IF
CRCW2010-IF
CRCW1210-IF
D25/CRCW1206-IF
D12/CRCW0805-IF
D11/CRCW0603-IF
D10/CRCW0402-IF
1000
1st line
2nd line
2nd line
Peak Voltage (V)
1000
100
100
10
1
1
10
100
1000
10 000
10
100 000
Resistance Value (Ω)
Pulse load rating in accordance to EN 60115-1, 4.27; 1.2 μs / 50 μs;
5 pulses at 12 s intervals; for permissible resistance change 1 %
10 μs / 700 μs Pulse
Axis Title
10 000
1000
1st line
2nd line
1000
2nd line
Peak Voltage (V)
10000
CRCW2512-IF
CRCW2010-IF
CRCW1210-IF
D25/CRCW1206-IF
D12/CRCW0805-IF
D11/CRCW0603-IF
D10/CRCW0402-IF
100
100
10
1
1
10
100
1000
10 000
10
100 000
Resistance Value (Ω)
Pulse load rating in accordance to EN 60115-1, 4.27; 10 μs / 700 μs;
10 pulses at 1 min intervals; for permissible resistance change 1 %
Revision: 09-Sep-2021
Document Number: 20024
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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D/CRCW-IF e3
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TESTS AND REQUIREMENTS
All executed tests are carried out in accordance with the
following specifications:
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5201-1.
EN 60115-1, generic specification
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
EN 60115-8
specification
(successor
of
EN 140400),
sectional
EN 140401-802, detail specification
Temperature: 15 °C to 35 °C
IEC 60068-2-xx, test methods
Relative humidity: 25 % to 75 %
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-802. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days). The components are
mounted for testing on boards in accordance with EN
60115-8, 2.4.2 unless otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 IEC 60068-2 (1)
CLAUSE
TEST METHOD
PROCEDURE
STABILITY CLASS 2 OR BETTER
TEST
Stability for product types:
D/CRCW-IF e3
4.5
-
4.8
-
REQUIREMENTS PERMISSIBLE
CHANGE (R)
1 to 100 k
Resistance
-
± 5 %; ± 10 %
Temperature coefficient
At (20 / -55 / 20) °C and
(20 / 125 / 20) °C
± 200 ppm/K
U = P 70 x R Umax.
1.5 h on; 0.5 h off
4.25.1
-
Endurance at 70 °C
-
Endurance at upper
category temperature
4.24
78 (Cab)
4.37
70 °C; 1000 h
± (1 % R + 0.05 )
70 °C; 8000 h
± (2 % R + 0.1 )
155 °C; 1000 h
± (1 % R + 0.05 )
Damp heat, steady state
(40 ± 2) °C;
(93 ± 3) % RH;
56 days
± (1 % R + 0.05 )
67 (Cy)
Damp heat, steady state,
accelerated
(85 ± 2) °C; (85 ± 5) % RH;
U = 0.1 x P 85 x R ; U 100 V;
1000 h
± (1 % R + 0.05 )
4.23
4.23.2
2 (Ba)
Climatic sequence:
Dry heat
125 °C; 16 h
4.23.3
30 (Db)
Damp heat, cyclic
55 °C; 24 h; 90 % RH; 1 cycle
4.23.4
4.23.5
4.23.6
4.23.7
1 (Ab)
13 (M)
30 (Db)
-
Cold
Low air pressure
Damp heat, cyclic
DC load
-55 °C; 2 h
8.5 kPa; 2 h; (25 ± 10) °C
55 °C; 5 days; > 90 % RH; 5 cycles
U = P 70 x R Umax.; 1 min
± (1 % R + 0.05 )
4.25.3
1 (Aa)
Cold
-55 °C; 2 h
± (0.25 % R + 0.05 )
4.19
14 (Na)
Rapid change
of temperature
± (1 % R + 0.05 )
4.13
-
Short time overload
30 min. at -55 °C and 30 min. at 125 °C
1000 cycles
U = 2.5 x P 70 x R 2 x Umax.;
whichever is the less severe; 5 s
-
Single pulse high
voltage overload
-
4.27
Revision: 09-Sep-2021
Severity no. 4:
U = 10 x P 70 x R
or U 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs / 700 μs
± (2 % R + 0.05 )
± (1 % R + 0.05 )
Document Number: 20024
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D/CRCW-IF e3
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TEST PROCEDURES AND REQUIREMENTS
EN 60115-1 IEC 60068-2 (1)
CLAUSE
TEST METHOD
PROCEDURE
REQUIREMENTS PERMISSIBLE
CHANGE (R)
STABILITY CLASS 2 OR BETTER
TEST
Stability for product types:
1 to 100 k
D/CRCW-IF e3
4.39
-
Periodic electric overload
U = 15 x P 70 x R
U 2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off; 1000 cycles
± (1 % R + 0.05 )
no visible damage
4.38
-
Electrostatic discharge
(human body model)
IEC 61340-3-1 (1);
3 positive + 3 negative discharges;
ESD voltage according to the size
± (1 % R + 0.05 )
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or 200 m/s2;
7.5 h
± (0.25 % R + 0.05 )
no visible damage
4.22
6 (Fc)
Good tinning ( 95 % covered);
no visible damage
4.17
58 (Td)
4.18
58 (Td)
4.29
45 (XA)
4.32
21 (Ue3)
Shear (adhesion)
4.33
21 (Ue1)
Substrate bending
Depth 2 mm; 3 times
± (0.25 % R + 0.05 )
no visible damage,
no open circuit in bent position
4.7
-
Voltage proof
U = 1.4 x Uins; 60 s
No flashover or breakdown
-
Flammability,
needle flame test
IEC 60695-11-5 (1);
10 s
No burning after 30 s
4.35
Solderability
Solder bath method,
Sn60Pb40; non-activated flux
(235 ± 5) °C; (2 ± 0.2) s
Solder bath method,
Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7;
non-activated flux
(245 ± 5) °C or (250 ± 5) °C;
(3 ± 0.3) s
Soldering bath method;
(260 ± 5) °C; (10 ± 1) s
Isopropyl alcohol;
+50 °C; method 2
CRCW0402-IF: 9 N
CRCW0603-IF to CRCW2512-IF: 17.7 N
Resistance to
soldering heat
Component solvent
resistance
± (0.25 % R + 0.05 )
No visible damage
No visible damage
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 09-Sep-2021
Document Number: 20024
8
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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D/CRCW-IF e3
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DIMENSIONS
L
T2
W
H
T1
DIMENSIONS AND MASS
L
(mm)
W
(mm)
H
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
D10/CRCW0402-IF e3
1.0 ± 0.05
0.5 ± 0.05
0.35 ± 0.05
0.25 ± 0.05
0.2 ± 0.10
0.65
D11/CRCW0603-IF e3
1.55 + 0.10 / - 0.05
0.85 ± 0.1
0.45 ± 0.05
0.3 ± 0.20
0.3 ± 0.20
2
D12/CRCW0805-IF e3
2.0 + 0.20 / - 0.10
1.25 ± 0.15
0.45 ± 0.05
0.3 + 0.20 / - 0.10
0.3 ± 0.20
5.5
D25/CRCW1206-IF e3
TYPE / SIZE
3.2 + 0.10 / - 0.20
1.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
10
CRCW1210-IF e3
3.2 ± 0.20
2.5 ± 0.2
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
16
CRCW2010-IF e3
5.0 ± 0.15
2.5 ± 0.15
0.6 ± 0.10
0.6 ± 0.20
0.6 ± 0.20
25.5
CRCW2512-IF e3
6.3 ± 0.20
3.15 ± 0.15
0.6 ± 0.10
0.6 ± 0.20
0.6 ± 0.20
40.5
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE / SIZE
REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
D10/CRCW0402-IF e3
-
-
-
-
0.45
0.60
0.60
1.65
D11/CRCW0603-IF e3
0.65
1.10
1.25
2.85
0.75
0.75
1.00
2.25
D12/CRCW0805-IF e3
0.90
1.30
1.60
3.50
1.00
0.95
1.45
2.90
D25/CRCW1206-IF e3
1.40
1.40
1.95
4.20
1.50
1.05
1.80
3.60
CRCW1210-IF e3
1.80
1.45
2.95
4.70
1.70
1.10
2.80
3.90
CRCW2010-IF e3
3.40
1.65
2.85
6.70
3.50
1.45
2.80
6.40
CRCW2512-IF e3
4.60
1.60
3.65
7.80
4.75
1.45
3.50
7.65
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. Still, the given solder pad dimensions will be found adequate for most general applications
Revision: 09-Sep-2021
Document Number: 20024
9
For technical questions, contact: thickfilmchip@vishay.com
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Revision: 09-Jul-2021
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Document Number: 91000