D/CRCW
www.vishay.com
Vishay
Lead (Pb)-Bearing Thick Film Chip Resistors
FEATURES
• Stability at different environmental conditions
ΔR/R ≤ 1 % (1000 h rated power at 70 °C)
• AEC-Q200 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Military
LINKS TO ADDITIONAL RESOURCES
• Industrial
3D 3D
3D Models
The lead (Pb)-bearing D/CRCW thick film chip resistors
series are the perfect choice for most fields of modern
electronics where lead (Pb)-bearing terminations are
mandatory and high reliability and stability are of major
concern.
Typical applications include military and industrial.
TECHNICAL SPECIFICATIONS
DESCRIPTION
Imperial size
Metric size code
Resistance
range
D10/CRCW0402 D11/CRCW0603 D12/CRCW0805 D25/CRCW1206 CRCW1210 CRCW1218 CRCW2010 CRCW2512
0402
0603
0805
1206
1210
1218
2010
2512
RR1005M
RR1608M
RR2012M
RR3216M
RR3225M RR3246M RR5025M RR6332M
1 Ω to
1 Ω to 10 MΩ;
2.2 MΩ;
1 Ω to 10 MΩ; jumper (0 Ω)
jumper
jumper (0 Ω)
(0 Ω)
Resistance
tolerance
Temperature
coefficient
Rated
dissipation, P70 (1)
Operating
voltage,
Umax. ACRMS/DC
Permissible film
temperature,
± 5 %; ± 1 %
± 200 ppm/K; ± 100 ppm/K
0.063 W
0.10 W
0.125 W
0.25 W
0.5 W
1.0 W
0.75 W
1.0 W
50 V
75 V
150 V
200 V
200 V
200 V
400 V
500 V
300 V
300 V
300 V
300 V
155 °C
ϑF max. (1)
Operating
temperature
range
Max. resistance
change at P70 for
resistance range,
|ΔR/R|, after (2):
1000 h
8000 h
Permissible
voltage
against ambient
(insulation):
1 min, Uins
Failure rate:
FITobserved
-55 °C to +155 °C
≤1%
≤2%
75 V
100 V
200 V
300 V
≤ 0.1 x
10-9/h
Notes
(1) Please refer to “Application Information” below
(2) Apply to components with stability class 1
Revision: 29-Nov-2022
Document Number: 20008
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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APPLICATION INFORMATION
When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal
resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted
film temperature is not exceeded.
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift
increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a
functional lifetime.
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE / SIZE
D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
TCR
TOLERANCE
RESISTANCE
E-SERIES
± 200 ppm/K
±5%
1 Ω to 10 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 10 MΩ
E24; E96
Jumper, Imax. = 1.5 A
≤ 20 mΩ
0Ω
-
± 200 ppm/K
±5%
1 Ω to 10 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 10 MΩ
E24; E96
Jumper, Imax. = 2.0 A
≤ 20 mΩ
0Ω
-
± 200 ppm/K
±5%
1 Ω to 10 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 10 MΩ
E24; E96
Jumper, Imax. = 2.5 A
≤ 20 mΩ
0Ω
-
± 200 ppm/K
±5%
1 Ω to 10 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 10 MΩ
E24; E96
Jumper, Imax. = 3.5 A
≤ 20 mΩ
0Ω
-
± 200 ppm/K
±5%
1 Ω to 10 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 10 MΩ
E24; E96
Jumper, Imax. = 5.0 A
≤ 20 mΩ
0Ω
-
± 200 ppm/K
±5%
1 Ω to 2.2 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 2.2 MΩ
E24; E96
Jumper, Imax. = 7.0 A
≤ 20 mΩ
0Ω
-
± 200 ppm/K
±5%
1 Ω to 10 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 10 MΩ
E24; E96
Jumper, Imax. = 6.0 A
≤ 20 mΩ
0Ω
-
± 200 ppm/K
±5%
1 Ω to 10 MΩ
E24
± 100 ppm/K
±1%
1 Ω to 10 MΩ
E24; E96
Jumper, Imax. = 7.0 A
≤ 20 mΩ
0Ω
-
Note
• The temperature coefficient of resistance (TCR) is not specified for 0 Ω jumpers
Revision: 29-Nov-2022
Document Number: 20008
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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PACKAGING
TYPE / SIZE
D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
CODE
QUANTITY
TD = RT7
TE = RF4
TA = RT1
TB = RT5
TC = RT6
TA = RT1
TB = RT5
TC = RT6
TA = RT1
TB = RT5
TC = RT6
TA = RT1
TB = RT5
TC = RT6
TK = RT9
TF = R02
TG = R67
TH = R82
10 000
50 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
5000
10 000
20 000
4000
4000
2000
4000
PACKAGING STYLE
Paper tape acc. to
IEC 60286-3, Type 1a
Blister tape acc. to
IEC 60286-3, Type 2a
WIDTH
PITCH
8 mm
2 mm
8 mm
4 mm
8 mm
4 mm
8 mm
4 mm
12 mm
4 mm
12 mm
12 mm
4 mm
4 mm
8 mm
4 mm
12 mm
PACKAGING
DIMENSIONS
Ø 180 mm / 7"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 285 mm / 11.25"
Ø 330 mm / 13"
Ø 180 mm / 7"
Ø 180 mm / 7"
Ø 180 mm / 7"
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW0805562RFKTA
Part Number: CRCW08050000ZSTA
C
R
C
W
0
8
0
5
5
6
2
R
F
K
T
A
TYPE / SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
SPECIAL
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
R = decimal
K = thousand
M = million
0000 = jumper
F=±1%
J=±5%
Z = jumper
K = ± 100 ppm/K
N = ± 200 ppm/K
S = jumper or special
TA, TB, TC,
TD, TE, TF,
TG, TH, TK
Up to 2 digits
Product Description: D12/CRCW0805 100 562R 1 % RT1
Product Description: D12/CRCW0805 0R0 RT1
D12/CRCW0805
100
562R
1%
TYPE / SIZE
TCR
RESISTANCE
TOLERANCE
PACKAGING
D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206
CRCW1210
CRCW1218
CRCW2010
CRCW2512
± 100 ppm/K
± 200 ppm/K
10R = 10 Ω
562R = 562 Ω
10K = 10 kΩ
1M = 1 MΩ
0R0 = jumper
±1%
±5%
RT1, RT5, RT6,
RT7, RF4, R02,
R67, R82, RT9
Revision: 29-Nov-2022
RT1
Document Number: 20008
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DESCRIPTION
MATERIALS
Production is strictly controlled and follows an extensive set
of instructions established for reproducibility. A cermet film
layer and a glass-over are deposited on a high grade (Al2O3)
ceramic substrate with its prepared inner contacts. A
special laser is used to achieve the target value by smoothly
fine trimming the resistive layer without damaging the
ceramics. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a SnPb layer on nickel
plating.
The result of the determined production is verified by an
extensive testing procedure on 100 % of the individual chip
resistors. Only accepted products are laid directly into
the tape in accordance with IEC 60286-3 Type 1a and
Type 2a (1).
Vishay acknowledges the following systems for the
regulation of hazardous substances:
ASSEMBLY
The resistors are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapor phase as shown in
IEC 61760-1 (1). The encapsulation is resistant to all
cleaning solvents commonly used in the electronics
industry, including alcohols, esters and aqueous solutions.
The suitability of conformal coatings, potting compounds
and their processes, if applied, shall be qualified by
appropriate means to ensure the long-term stability of the
whole system.
The resistors with SnPb plating provides compatibility with
lead (Pb)-free and lead (Pb)-containing soldering processes.
Solderability is specified for 2 years after production or
requalification. The permitted storage time is 20 years. The
immunity of the plating against tin whisker growth has been
proven under extensive testing.
• IEC 62474, Material Declaration for Products of and for the
Electrotechnical Industry, with the list of declarable
substances given therein (2)
• The Global Automotive Declarable Substance List
(GADSL) (3)
• The REACH regulation (1907/2006/EC) and the related list
of substances with very high concern (SVHC) (4) for its
supply chain
Except for the intentionally added lead (Pb) in the
termination finish, the products do not contain any of the
banned substances as per IEC 62474, GADSL, or the SVHC
list, see www.vishay.com/how/leadfree.
Vishay pursues the elimination of conflict minerals from its
supply chain, see the Conflict Minerals Policy at
www.vishay.com/doc?49037.
APPROVALS
The resistors are qualified according to AEC-Q200.
Where applicable, the resistors are tested in accordance
with EN 140401-802 which refers to EN 60115-1,
EN 60115-8 and the variety of environmental test
procedures of the IEC 60068 (1) series.
RELATED PRODUCTS
The D/CRCW e3 with lead (Pb)-free termination plating is
designed for applications where lead (Pb)-free terminations
are mandatory. For ordering D/CRCW with lead (Pb)-free
terminations please refer to latest edition of datasheet
D/CRCW e3 (www.vishay.com/doc?20035).
For more information about products with better TCR and
tighter tolerance please refer to the “Lead (Pb)-Bearing
Thick Film, Rectangular, Semi-Precision Chip Resistors”
datasheet (www.vishay.com/doc?20009).
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
(2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474
(3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org
(4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table
Revision: 29-Nov-2022
Document Number: 20008
4
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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FUNCTIONAL PERFORMANCE
Single Pulse
Axis Title
1000
10
1000
1st line
2nd line
100
2nd line
^
Pmax. - Pulse Load (W)
10000
CRCW2512
CRCW1218
CRCW2010
CRCW1210
D25/CRCW1206
D12/CRCW0805
D11/CRCW0603
D10/CRCW0402
1
100
0.1
0.01
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
ti - Pulse Duration (s)
Maximum pulse load, single pulse; applicable if P → 0 and n < 1000 and Uˆ = Uˆ max.;
for permissible resistance change equivalent to 8000 h operation
Continuous Pulse
Axis Title
10000
CRCW2512
CRCW1218
CRCW2010
CRCW1210
D25/CRCW1206
D12/CRCW0805
D11/CRCW0603
D10/CRCW0402
100
10
1000
1st line
2nd line
2nd line
^
Pmax. - Continuous Pulse Load (W)
1000
1
100
0.1
0.01
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
100
ti - Pulse Duration (s)
Maximum pulse load, continuous pulses; applicable if P ≤ P (ϑamb) and Uˆ = Uˆ max.;
for permissible resistance change equivalent to 8000 h operation
Pulse Voltage
Axis Title
2000
1800
1600
1400
1000
1200
1st line
2nd line
2nd line
^
Umax. - Pulse Voltage (V)
10000
CRCW2512
CRCW2010
D25/CRCW1206, CRCW1210, CRCW1218
D12/CRCW0805
D11/CRCW0603
D10/CRCW0402
1000
800
100
600
400
200
0
0.000001
10
0.00001
0.0001
0.001
0.01
0.1
1
10
ti - Pulse Duration (s)
Maximum pulse voltage, single and continuous pulses; applicable if Pˆ = Pˆ max.;
for permissible resistance change equivalent to 8000 h operation
Revision: 29-Nov-2022
Document Number: 20008
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Derating
Axis Title
1.2
1.0
0.8
1000
1st line
2nd line
2nd line
P - Power Dissipation (W)
10000
CRCW2512, CRCW1218
CRCW2010
CRCW1210
D25/CRCW1206
D12/CRCW0805
D11/CRCW0603
D10/CRCW0402
0.6
100
0.4
0.2
10
0
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
ϑamb - Ambient Temperature (°C)
80
90
100 110 120 130 140 150 160
Non-Linearity
Axis Title
10000
D25/CRCW1206, CRCW2010
D12/CRCW0805
D11/CRCW0603
D10/CRCW0402
100
1000
80
1st line
2nd line
2nd line
Attenuation of 3rd Harmoinc A3 (dB)
120
60
100
40
20
0
10
100
1K
10K
100K
1M
10
10M
R - Resistance Value (Ω)
Current Noise
Axis Title
10
10000
D10/CRCW0402
D11/CRCW0603
D12/CRCW0805
D25/CRCW1206
CRCW2010
1000
1st line
2nd line
2nd line
Current Noise A1 (μV/V)
100
1
100
0.1
0.01
100
1K
10K
100K
1M
10
10M
R - Resistance Value (Ω)
Revision: 29-Nov-2022
Document Number: 20008
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TESTS AND REQUIREMENTS
All executed tests are carried out in accordance with the
following specifications:
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5201-1.
EN 60115-1, generic specification
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
EN 60115-8, sectional specification
EN 140401-802, detail specification
Temperature: 15 °C to 35 °C
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140401-802. The table presents only
the most important tests, for the full test schedule refer to
the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days). The components are
mounted for testing on boards in accordance with EN
60115-8, 2.4.2 unless otherwise specified.
TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
(1) TEST
METHOD
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
PROCEDURE
STABILITY CLASS 1 STABILITY CLASS 2
OR BETTER
OR BETTER
TEST
Stability for product types:
1 Ω to 10 MΩ
D/CRCW
4.5
-
4.8
-
Resistance
-
±1%
±5%
Temperature coefficient
At (20 / -55 / 20) °C and
(20 / 155 / 20) °C
± 100 ppm/K
± 200 ppm/K
70 °C; 1000 h
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
U = P 70 x R ≤ Umax.
1.5 h on; 0.5 h off
4.25.1
-
Endurance at 70 °C
70 °C; 8000 h
± (2 % R + 0.1 Ω)
± (4 % R + 0.1 Ω)
-
Endurance at upper
category temperature
155 °C; 1000 h
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
4.24
78 (Cab)
Damp heat, steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
4.37
67 (Cy)
Damp heat, steady state,
accelerated
(85 ± 2) °C; (85 ± 5) % RH;
U = 0.1 x P 85 x R ≤ 100 V;
1000 h
4.23
4.23.2
2 (Ba)
Climatic sequence:
Dry heat
125 °C; 16 h
4.23.3
30 (Db)
Damp heat, cyclic
55 °C; 24 h; ≥ 90 % RH; 1 cycle
4.23.4
4.23.5
1 (Ab)
13 (M)
Cold
Low air pressure
4.23.6
30 (Db)
Damp heat, cyclic
-
DC load
-55 °C; 2 h
8.5 kPa; 2 h; (25 ± 10) °C
55 °C; 5 days;
> 90 % RH; 5 cycles
U = P 70 x R ≤ Umax.; 1 min
4.25.3
4.23.7
± (1 % R + 0.05 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
± (1 % R + 0.05 Ω)
± (2 % R + 0.1 Ω)
1 (Aa)
Cold
-55 °C; 2 h
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
4.19
14 (Na)
Rapid change
of temperature
30 min. at -55 °C and 30 min. at 125 °C
1000 cycles
± (1 % R + 0.05 Ω)
no visible damage
4.13
-
Short time overload
U = 2.5 x P 70 x R ≤ 2 x Umax.;
whichever is the less severe; 5 s
± (2 % R + 0.05 Ω)
-
Single pulse high voltage
overload
Severity no. 4:
U = 10 x P 70 x R
or U ≤ 2 x Umax.;
whichever is the less severe;
10 pulses 10 μs / 700 μs
± (1 % R + 0.05 Ω)
no visible damage
-
4.27
Revision: 29-Nov-2022
Document Number: 20008
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TEST PROCEDURES AND REQUIREMENTS
EN
60115-1
CLAUSE
IEC
60068-2
(1) TEST
METHOD
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
PROCEDURE
STABILITY CLASS 1 STABILITY CLASS 2
OR BETTER
OR BETTER
TEST
Stability for product types:
1 Ω to 10 MΩ
D/CRCW
4.39
-
Periodic electric overload
U = 15 x P 70 x R
or ≤ 2 x Umax.;
whichever is the less severe;
0.1 s on; 2.5 s off; 1000 cycles
± (1 % R + 0.05 Ω)
no visible damage
4.38
-
Electrostatic discharge
(human body model)
IEC 61340-3-1 (1);
3 positive + 3 negative discharges;
ESD voltage acc. to size
± (1 % R + 0.05 Ω)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude ≤ 1.5 mm or ≤ 200 m/s2;
7.5 h
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
no visible damage
no visible damage
4.22
6 (Fc)
± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω)
Isopropyl alcohol; +50 °C; method 2
No visible damage
Isopropyl alcohol; +50 °C; method 1,
toothbrush
D11/CRCW0603 and smaller: 9 N
D12/CRCW0805 to CRCW2512: 45 N
Marking legible,
no visible damage
Good tinning (≥ 95 % covered);
no visible damage
4.17
58 (Td)
4.18
58 (Td)
4.29
45 (XA)
4.30
45 (XA)
4.32
21 (Ue3)
Shear (adhesion)
4.33
21 (Uu1)
Substrate bending
Depth 2 mm; 3 times
± (0.25 % R + 0.05 Ω)
no visible damage,
no open circuit in bent position
4.7
-
Voltage proof
U = 1.4 x Uins; 60 s
No flashover or breakdown
-
Flammability,
needle flame test
IEC 60695-11-5 (1);
10 s
No burning after 30 s
4.35
Solderability
Solder bath method,
Sn60Pb40; non-activated flux
(235 ± 5) °C; (2 ± 0.2) s
Solder bath method,
Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7
non-activated flux
(245 ± 5) °C; (3 ± 0.3) s
Soldering bath method;
(260 ± 5) °C; (10 ± 1) s
Resistance to
soldering heat
Component solvent
resistance
Solvent resistance
of marking
No visible damage
Note
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents
Revision: 29-Nov-2022
Document Number: 20008
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DIMENSIONS
L
T2
W
H
T1
DIMENSIONS AND MASS
TYPE / SIZE
L
(mm)
W
(mm)
H
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
0.65
D10/CRCW0402
1.0 ± 0.05
0.5 ± 0.05
0.35 ± 0.05
0.25 ± 0.10
0.2 ± 0.10
D11/CRCW0603
1.55 + 0.10 / - 0.05
0.85 ± 0.10
0.45 ± 0.05
0.3 ± 0.20
0.3 ± 0.20
2
D12/CRCW0805
2.0 + 0.20 / - 0.10
1.25 ± 0.15
0.45 ± 0.05
0.3 + 0.20 / - 0.10
0.3 ± 0.20
5.5
D25/CRCW1206
10
3.2 + 0.10 / - 0.20
1.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
CRCW1210
3.2 ± 0.20
2.5 ± 0.20
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
16
CRCW1218
3.2 + 0.10 / - 0.20
4.6 ± 0.15
0.55 ± 0.05
0.45 ± 0.20
0.4 ± 0.20
29.5
CRCW2010
5.0 ± 0.15
2.5 ± 0.15
0.6 ± 0.10
0.6 ± 0.20
0.6 ± 0.20
25.5
CRCW2512
6.3 ± 0.20
3.15 ± 0.15
0.6 ± 0.10
0.6 ± 0.20
0.6 ± 0.20
40.5
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
TYPE / SIZE
G
(mm)
Y
(mm)
X
(mm)
REFLOW SOLDERING
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
D10/CRCW0402
-
-
-
-
0.45
0.60
0.60
1.65
D11/CRCW0603
0.65
1.10
1.25
2.85
0.75
0.75
1.00
2.25
D12/CRCW0805
0.90
1.30
1.60
3.50
1.00
0.95
1.45
2.90
D25/CRCW1206
1.40
1.40
1.95
4.20
1.50
1.05
1.80
3.60
CRCW1210
1.80
1.45
2.95
4.70
1.70
1.10
2.80
3.90
CRCW1218
1.80
1.30
5.10
4.40
1.90
1.10
4.90
4.10
CRCW2010
3.40
1.65
2.85
6.70
3.50
1.45
2.80
6.40
CRCW2512
4.60
1.60
3.65
7.80
4.75
1.45
3.50
7.65
Note
• The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain
the reliability of the assembly.
The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or
in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many
other parameters. Still, the given solder pad dimensions will be found adequate for most general applications
Revision: 29-Nov-2022
Document Number: 20008
9
For technical questions, contact: thickfilmchip@vishay.com
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