CRHV2010AF10M0FKE5

CRHV www.vishay.com Vishay Techno Thick Film Chip Resistors, High Voltage FEATURES • • • • • • • • • • LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models • • • High voltage up to 3000 V Outstanding stability < 0.5 % Available Flow solderable Available Custom sizes available Automatic placement capability Tape and reel packaging available Termination style: 3-sided wraparound termination or single termination flip chip standard; 5-sided wraparound termination available Internationally standardized sizes Suitable for solderable, epoxy bondable, or wire bondable applications Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available Multiple styles, termination materials and configurations, allow wide design flexibility Epoxy bondable or wire bondable non-magnetic terminations available Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details STANDARD ELECTRICAL SPECIFICATIONS GLOBAL MODEL CRHV1206 CRHV1210 CRHV2010 CRHV2510 CRHV2512 CASE SIZE POWER RATING P70 °C W MAXIMUM WORKING VOLTAGE (1) V 1206 0.30 1500 1210 2010 2510 2512 0.45 0.50 0.60 1.0 1750 2000 2500 3000 RESISTANCE RANGE (2) Ω TOLERANCE (3) ±% 2M to 100M 0.5 2M to 1G 1, 2, 5, 10, 20 1.1G to 8G 2, 5, 10, 20 4M to 100M 0.5 4M to 1G 1, 2, 5, 10, 20 1.1G to 10G 2, 5, 10, 20 6M to 100M 0.5 6M to 1G 1, 2, 5, 10, 20 1.1G to 10G 2, 5, 10, 20 11G to 35G 5, 10, 20 10M to 100M 0.5 10M to 1G 1, 2, 5, 10, 20 1.1G to 10G 2, 5, 10, 20 11G to 40G 5, 10, 20 10M to 100M 0.5 10M to 1G 1, 2, 5, 10, 20 1.1G to 10G 2, 5, 10, 20 11G to 50G 5, 10, 20 TEMPERATURE COEFFICIENT (4) (-55 °C to +155 °C) ± ppm/°C 100 100 100 100 100 Notes • For non-standard sizes, lower values or higher power rating requirement, contact factory (1) Continuous working voltage shall be P x R or maximum working voltage, whichever is less (2) Resistance values below 1 GΩ are calibrated at 100 V , and values of 1 GΩ and above are calibrated at 1000 V . Calibration at other DC DC voltages available upon request (3) Contact factory for tighter tolerances (4) Reference only: not for all values specified. Consult factory for your size and value. The TC for “AA” option is typically 200 ppm Revision: 19-May-2021 Document Number: 68002 1 For technical questions, contact: te1resistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRHV www.vishay.com Vishay Techno GLOBAL PART NUMBER INFORMATION New Global Part Numbering: CRHV1206AF100MFKFB (preferred part number format) C R GLOBAL MODEL SIZE CRHV 1206 1210 2010 2510 2512 H V TERMINAL STYLE 1 2 0 TERMINAL MATERIAL 6 A RESISTANCE VALUE A = 3-sided F = nickel barrier M = MΩ B = top only G = non-magnetic G = GΩ C = 5-sided 4M70 = 4.7 MΩ A = palladium 10M0 = 10 MΩ silver 1G00 = 1 GΩ B = platinum gold C = gold D = platinum silver E = platinum palladium gold F 1 0 0 TOLERANCE M K SOLDER TERMINATION TCR D = ± 0.5 % F=±1% G=±2% J=±5% K = ± 10 % M = ± 20 % F K = 100 ppm E = Sn100 L = 150 ppm F = Sn95/Ag5, HSD N = 200 ppm N = No solder R = 250 ppm S = Sn62/Pb36/Ag2, M = 300 ppm HSD W = 350 ppm T = Sn90/Pb10 P = 500 ppm F B PACKAGING B = bulk (250 pcs max.) F = T/R (full reel) 1 = T/R (1000 pcs) 5 = T/R (500 pcs) T = T/R (250 pcs min.) W = waffle tray Historical Part Numbering: CRHV1206AF1006F100e2 (will continue to be accepted) CRHV 1206 A F 1006 F 100 e2 HISTORICAL MODEL SIZE TERM STYLE TERM MATERIAL RESISTANCE VALUE TOLERANCE TCR SOLDER TERMINATION Note • For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543) MECHANICAL SPECIFICATIONS Substrate Glass 96 % alumina Termination Solder-coated nickel barrier or solder coated non-magnetic terminations standard. Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold terminations available. Solder finish Pure tin or tin/lead solder alloys standard. Tin/silver or tin/lead/silver solder alloys available. 10000 120 100 1000 80 1st line 2nd line Encapsulation Axis Title Ruthenium oxide 2nd line Rated Power (%) Resistive element DERATING CURVE 60 100 40 20 ENVIRONMENTAL SPECIFICATIONS Operating temperature -55 -55 °C to +155 °C Short time overload -25 0 25 50 70 100 125 155 175 Ambient Temperature (°C) Less than 0.5 % change when tested at full rated power Life 10 0 Note • Reference only: Not for all values specified. Consult factory for your size and value Less than 0.5 % ΔR VOLTAGE COEFFICIENT OF RESISTANCE CHART SIZE VALUE (Ω) VCR (ppm/V) FURTHER INSTRUCTIONS CRHV1206 2M to 199M 25 Values over 200M, consult factory CRHV1210 4M to 200M 25 Values over 200M, consult factory 6M to 99M 15 100M to 1G 20 10M to 99M 10 100M to 1G 15 10M to 999M 10 1G to 5G 25 CRHV2010 CRHV2510 CRHV2512 Revision: 19-May-2021 Values over 1G, consult factory Values over 1G, consult factory Values over 5G, consult factory Document Number: 68002 2 For technical questions, contact: te1resistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 CRHV www.vishay.com Vishay Techno DIMENSIONS in inches (millimeters) Termination Style B (Top conductor only) Termination Style A (3-sided wraparound) W W L L T T 0.025 (0.635) max. 0.025 (0.635) max. Termination Style C (5-sided wraparound) MODEL CRHV1206 CRHV1210 CRHV2010 CRHV2510 CRHV2512 W L T 0.025 (0.635) max. TERMINATION MATERIAL TYPE Nickel barrier Solderable Non-magnetic Epoxy bondable / solderable Platinum palladium gold Wire bondable / Epoxy bondable Gold Palladium silver (2) Epoxy bondable Platinum gold Platinum silver TERMINATION STYLE 3-sided (wraparound) Top only (flip chip) 5-sided (wraparound) 3-sided (wraparound) Top only (flip chip) 3-sided (wraparound) Top only (flip chip) 5-sided (wraparound) 3-sided (wraparound) Top only (flip chip) 5-sided (wraparound) 3-sided (wraparound) Top only (flip chip) 5-sided (wraparound) 3-sided (wraparound) Top only (flip chip) 5-sided (wraparound) 3-sided (wraparound) Top only (flip chip) 5-sided (wraparound) LENGTH (L) ± 0.006 (0.152) 0.125 0.125 0.200 0.250 0.250 WIDTH (W) ± 0.006 (0.152) 0.063 0.100 0.100 0.100 0.126 TERMINATION STYLE / MATERIAL CODE AF BF CF AG BG AE BE CE AC BC CC AA BA CA AB BB CB AD BD CD THICKNESS (T) ± 0.002 (0.051) 0.025 0.025 0.025 0.025 0.025 SOLDER TERMINATION CODE E or T (standard); F or S (optional) (3) E or T (standard); F or S (optional) (3) N (standard); F or S (optional) (1) N N Notes (1) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting (2) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues (3) Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are also available PERFORMANCE TEST Life High temperature exposure Low temperature operation Resistance to bonding exposure Moisture resistance Solder mounting integrity Solderability CONDITIONS OF TEST MIL-STD-202, method 108, 1000 h rated power at +70 °C MIL-STD-202, method 108 MIL-PRF-55342, paragraph 4.8.5 MIL-STD-202, methods 210 MIL-PRF-55342, paragraph 4.8.9 MIL-PRF-55342, paragraph 4.8.13, 2 kg for 30 s MIL-STD-202, method 208 TEST RESULTS (TYPICAL TEST LOTS) ≤ ± 0.5 % ≤ ± 0.2 % ≤ ± 0.05 % ≤ ± 0.1 % ≤ ± 0.06% No evidence of mechanical damage 95 % coverage Note • This summary is based on testing done on values up to 2 GΩ Revision: 19-May-2021 Document Number: 68002 3 For technical questions, contact: te1resistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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