Bulletin I27282 11/06
GB35XF120K
IGBT SIXPACK MODULE
VCES = 1200V
Features
• Low VCE (on) Non Punch Through IGBT Technology
• Low Diode VF
IC =35A @ TC=80°C
• 10μs Short Circuit Capability
• Square RBSOA
• HEXFRED Antiparallel Diode with Ultrasoft
Reverse Recovery Characteristics
• Positive VCE (on) Temperature Coefficient
• Ceramic DBC Substrate
tsc > 10μs @ TJ=150°C
ECONO2 6PACK
VCE(on) typ. = 2.40V
• Low Stray Inductance Design
• TOTALLY LEAD-FREE
Benefits
•
•
•
•
•
•
•
Benchmark Efficiency for Motor Control
Rugged Transient Performance
Low EMI, Requires Less Snubbing
Direct Mounting to Heatsink
PCB Solderable Terminals
Low Junction to Case Thermal Resistance
UL Approved E78996
Absolute Maximum Ratings
Parameter
Max.
VCES
Collector-to-Emitter Voltage
1200
Units
V
IC @ Tc=25°C
Continuous Collector Current
50
A
IC @ Tc=80°C
Continuous Collector Current
35
ICM
Pulsed Collector Current (Ref. Fig. C.T.5)
100
ILM
Clamped Inductive Load Current
100
IF @ Tc=25°C
Diode Continuous Forward Current
50
IF @ Tc=80°C
Diode Continuous Forward Current
35
IFM
Pulsed Diode Maximum Forward Current
100
VGE
Gate-to-Emitter Voltage
±20
V
PD @ Tc=25°C
Maximum Power Dissipation (IGBT and Diode)
284
W
PD @ Tc=80°C
Maximum Power Dissipation (IGBT and Diode)
159
TJ
Maximum Operating Junction Temperature
TSTG
Storage Temperature Range
VISOL
Isolation Voltage
150
°C
-40 to +125
AC 2500 (MIN)
V
Thermal and Mechanical Characteristics
Min
Typical
Maximum
Units
RθJC (IGBT)
Junction-to-Case IGBT
Parameter
-
-
0.44
°C/W
RθJC (Diode)
Junction-to-Case Diode
-
-
0.80
RθCS (Module)
Case-to-Sink, flat, greased surface
Mounting Torque (M5)
Weight
Document Number: 93651
-
0.05
-
2.7
-
3.3
-
170
-
N*m
g
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1
GB35XF120K
Bulletin I27282 11/06
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
BV(CES)
Parameter
Collector-to-Emitter Breakdown Voltage
Min. Typ. Max. Units Conditions
1200 V
VGE = 0 IC = 500μA
ΔV(BR)CES/ΔTJ
Temp. Coefficient of Breakdown Voltage
-
0.7
V CE(ON)
Collector-to-Emitter Voltage
-
2.40 2.60
-
2.75 3.00
IC = 50A VGE = 15V
-
2.80
-
IC = 35A VGE = 15V TJ = 125°C
-
3.30
-
4.0
5.25
6.0
-
V/°C
V
VGE = 0 IC = 1mA (25°C - 125°C)
IC = 35A VGE = 15V
IC =50A VGE = 15V TJ = 125°C
VGE(th)
Gate Threshold Voltage
ΔV GE (th)/ΔT J
Thresold Voltage temp. coefficient
-
-11
-
ICES
Zero Gate Voltage Collector Current
-
-
100
-
500
-
-
1.90 2.35
-
2.15 2.65
-
2.00
-
IF = 35A Tj = 125°C
-
2.35
-
IF = 50A Tj = 125°C
-
-
±200
V FM
IGES
Diode Forward Voltage Drop
Gate-to-Emitter Leakage Current
VCE = VGE IC = 250μA
mV/°C VCE = VGE IC = 1mA (25°C-125°C)
μA
VGE = 0 VCE = 1200V
V
IF = 35A
VGE = 0 VCE = 1200V Tj = 125°C
IF = 50A
nA
VGE = ±20V
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units Conditions
QG
Total Gate Charge (turn-on)
-
255
385
QGE
Gate-to-Emitter Charge (turn-on)
-
25
40
QGC
Gate-to-Collector Charge (turn-on)
-
125
90
EON
Turn-On Switching Loss
-
2700 4075
EOFF
Turn-Off Switching Loss
-
2500 3775
ETOT
Total Switching Loss
-
5200 7850
EON
Turn-On Switching Loss
-
3750 5450
EOFF
Turn-Off Switching Loss
-
3675 5100
ETOT
Total Switching Loss
-
7425 10550
td(on)
Turn-On delay time
-
tr
Rise time
-
35
50
VGE = 15V RG = 10Ω L = 400μH
td(off)
Turn-Off delay time
-
415
560
Tj = 125°C
tf
Fall time
-
230
300
Cies
Input Capacitance
-
3475
-
Coes
Output Capacitance
-
615
-
VCC = 30V
Cres
Reverse Transfer Capacitance
-
90
-
f = 1Mhz
RBSOA
Reverse Bias Safe Operating Area
FULL SQUARE
SCSOA
Short Circuit Safe Operating Area
50
65
IC = 35A
nC
VCC = 600A
VGE = 15V
μJ
IC = 35A VCC = 600V
VGE = 15V RG = 10Ω L = 400μH
Tj = 25°C c
μJ
IC = 35A VCC = 600V
VGE = 15V RG = 10Ω L =400μH
Tj = 125°C c
ns
pF
IC = 35A VCC = 600V
VGE = 0
Tj = 150°C IC = 100A
RG = 10Ω VGE = 15V to 0
10
-
-
μs
Tj = 150°C
VCC = 900V VP = 1200V
RG = 10Ω
Irr
Diode Peak Rev. Recovery Current
-
73
-
A
VGE = 15V to 0
Tj = 125°C
VCC = 600V IF = 35A L =400μH
VGE = 15V RG = 10Ω
c Energy losses include "tail" and diode reverse recovery.
Document Number: 93651
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2
GB35XF120K
Bulletin I27282 11/06
70
70
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
60
50
40
ICE (A)
ICE (A)
50
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
60
30
40
30
20
20
10
10
0
0
0
1
2
3
4
5
6
0
1
2
VCE (V)
Fig. 1 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 80μs
20
20
18
18
16
16
5
6
14
12
ICE = 17.5A
10
ICE = 35A
8
ICE = 70A
VCE (V)
VCE (V)
4
Fig. 2 - Typ. IGBT Output Characteristics
TJ = 125°C; tp = 80μs
14
12
ICE = 17.5A
10
ICE = 35A
8
ICE = 70A
6
6
4
4
2
2
0
0
5
10
15
5
20
10
15
20
VGE (V)
VGE (V)
Fig. 3 - Typical VCE vs. VGE
TJ = 25°C
Fig. 4 - Typical VCE vs. VGE
TJ = 125°C
1000
8000
7000
tdOFF
5000
Swiching Time (ns)
EON
6000
Energy (µJ)
3
VCE (V)
EOFF
4000
3000
tF
100
tdON
2000
tR
1000
0
10
0
20
40
60
IC (A)
Fig. 5 - Typ. Energy Loss vs. IC
TJ = 125°C; L=400μH; VCE= 600V
RG= 10Ω; VGE= 15V
Document Number: 93651
80
0
20
40
60
80
IC (A)
Fig. 6 - Typ. Switching Time vs. IC
TJ = 125°C; L=400μH; VCE= 600V
RG= 10Ω; VGE= 15V
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3
GB35XF120K
Bulletin I27282 11/06
7000
10000
6000
EON
Swiching Time (ns)
Energy (µJ)
5000
EOFF
4000
3000
2000
1000
td OFF
tF
100
td ON
1000
tR
10
0
0
10
20
30
40
0
50
10
20
40
50
Fig. 8 - Typ. Switching Time vs. RG
TJ = 125°C; L=400μH; VCE= 600V
ICE= 35A; VGE= 15V
Fig. 7 - Typ. Energy Loss vs. RG
TJ = 125°C; L=400μH; VCE= 600V
ICE= 35A; VGE= 15V
16
10000
Cies
14
400V
12
1000
100
600V
10
Coes
VGE (V)
Capacitance (pF)
30
R G ( Ω)
RG ( Ω)
Cres
8
6
4
2
0
10
0
20
40
60
80
100
VCE (V)
Fig. 9- Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
0
50
100
150
200
250
300
Q G , Total Gate Charge (nC)
Fig. 10 - Typical Gate Charge vs. VGE
ICE = 35A; L = 600µH
60
IC (A)
40
20
0
0
20
40
60
80
100 120 140 160
T C (°C)
Fig. 11 - Maximum DC Collector Current vs.
Case Temperature
Document Number: 93651
Fig. 12 - Power Dissipation vs. Case
Temperature
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GB35XF120K
Bulletin I27282 11/06
1000
1000
100
100
10
IC (A)
IC (A)
20 µs
100 µs
10
1 ms
10 ms
1
DC
0.1
1
1
10
100
1000
10000
10
VCE (V)
1000
10000
VCE (V)
Fig. 14 - Reverse Bias SOA
TJ = 150°C; VGE =15V
Fig. 13 - Forward SOA
TC = 25°C; TJ ≤ 150°C
70
400
T J = 25°C
350
25°C
125°C
60
T J = 125°C
300
50
IF (A)
250
ICE (A)
100
200
40
30
150
20
100
10
50
0
0
0
5
10
15
0.0
20
2.0
3.0
4.0
VGE (V)
V F (V)
Fig. 15 - Typ. Transfer Characteristics
VCE = 50V; tp = 10µs
Fig. 16 - Typ. Diode Forward Characteristics
tp = 80µs
100
90
RG = 4.7 Ω
90
80
80
70
RG = 10 Ω
70
60
60
IRR (A)
IRR (A)
1.0
RG = 22 Ω
50
40
RG = 47 Ω
30
50
40
30
20
20
10
10
0
0
0
20
40
IF (A)
60
Fig. 17 - Typical Diode IRR vs. IF
TJ = 125°C
Document Number: 93651
80
0
10
20
30
40
50
RG ( Ω)
Fig. 18 - Typical Diode IRR vs. RG
TJ = 125°C, IF = 35A
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5
GB35XF120K
Bulletin I27282 11/06
90
80
70
IRR (A)
60
50
40
30
20
10
0
0
500
1000
1500
2000
2500
diF /dt (A/µs)
Fig. 19- Typical Diode IRR vs. diF/dt; VCC= 600V;
VGE= 15V; ICE= 35A; TJ = 125°C
1
Thermal Response ( Z thJC )
D = 0.50
0.20
0.1
0.10
0.05
0.01
0.02
0.01
τJ
R1
R1
τJ
τ1
R2
R2
τ2
τ1
Ri (°C/W) τi (sec)
0.086
0.000561
τC
τ
0.354
τ2
0.039382
Ci= τi/Ri
Ci i/Ri
0.001
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-6
1E-5
1E-4
1E-3
1E-2
1E-1
1E+0
t1 , Rectangular Pulse Duration (sec)
Fig 20. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
1
Thermal Response ( Z thJC )
D = 0.50
0.20
0.10
0.05
0.1
0.01
0.02
0.01
τJ
R1
R1
τJ
τ1
τ1
R2
R2
τ2
R3
R3
τC
τ
τ2
Ci= τi/Ri
Ci= i/Ri
0.001
τ3
τ3
Ri (°C/W) τi (sec)
0.049
0.00006
0.154
0.00077
0.597
0.038148
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
1E-6
1E-5
1E-4
1E-3
1E-2
1E-1
1E+0
t1 , Rectangular Pulse Duration (sec)
Fig 21. Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
Document Number: 93651
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6
GB35XF120K
Bulletin I27282 11/06
L
L
VCC
DUT
80 V
DUT
1000V
Rg
1K
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
R=
diode clamp /
DUT
Driver
900V
D
C
L
- 5V
DUT
DUT /
DRIVER
DUT
VCC
Fig.C.T.4 - Switching Loss Circuit
Fig.C.T.3 - S.C. SOA Circuit
900
800
90% ICE
120
40
700
105
600
90
500
25
tf
20
300
15
5% V CE
200
10
5% ICE
100
0
500
75
TEST CURRENT
V CE (V)
30
ICE (A)
V CE (V)
800
600
400
400
60
90% test current
300
45
200
5
100
0
0
30
10% test current
tr
5% V CE
0.00
1.00
2.00
-5
3.00
Time(µs)
Fig. WF1- Typ. Turn-off Loss Waveform
@ TJ = 125°C using Fig. CT.4
Document Number: 93651
-100
10.00
10.20
10.40
15
0
Eon Loss
Eoff Loss
-100
-1.00
Fig.C.T.5 - Resistive Load Circuit
45
35
VCC
Rg
Rg
700
VCC
ICM
ICE (A)
0
10.60
-15
10.80
Time (µs)
Fig. WF2- Typ. Turn-on Loss Waveform
@ TJ = 125°C using Fig. CT.4
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GB35XF120K
Bulletin I27282 11/06
Econo2 6Pak Package Outline
Dimensions are shown in millimeters (inches)
Econo2 6Pak Part Marking Information
LOT
GB35XF120K
Made in Italy
Data and specifications subject to change without notice.
This product has been designed and qualified for Industrial market.
Qualification Standards can be found on IR's Web site.
Document Number: 93651
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
11/06
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8
Legal Disclaimer Notice
Vishay
Notice
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
International Rectifier®, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN®
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product
names noted herein may be trademarks of their respective owners.
Document Number: 99901
Revision: 12-Mar-07
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