HFA30PB120
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 30 A
FEATURES
•
•
•
•
•
•
•
Base
common
cathode
BENEFITS
•
•
•
•
•
2
1
Anode
1
Ultrafast recovery
Ultrasoft recovery
Very low IRRM
Very low Qrr
Guaranteed avalanche
Specified at operating conditions
Designed and qualified for industrial level
Reduced RFI and EMI
Reduced power loss in diode and switching transistor
Higher frequency operation
Reduced snubbing
Reduced parts count
DESCRIPTION
3
Anode
2
HFA30PB120 is a state of the art center tap ultrafast
recovery diode. Employing the latest in epitaxial construction
and advanced processing techniques it features a superb
combination of characteristics which result in performance
which is unsurpassed by any rectifier previously available.
With basic ratings of 1200 V and 30 A continuous current, the
HFA30PB120 is especially well suited for use as the
companion diode for IGBTs and MOSFETs. In addition to
ultrafast recovery time, the HEXFRED® product line features
extremely low values of peak recovery current (IRRM) and
does not exhibit any tendency to “snap-off” during the
tb portion of recovery. The HEXFRED features combine to
offer designers a rectifier with lower noise and significantly
lower switching losses in both the diode and the switching
transistor. These HEXFRED advantages can help to
significantly reduce snubbing, component count and
heatsink sizes. The HEXFRED HFA30PB120 is ideally
suited for applications in power supplies and power
conversion systems (such as inverters), motor drives, and
many other similar applications where high speed, high
efficiency is needed.
TO-247AC modified
PRODUCT SUMMARY
VR
1200 V
VF at 30 A at 25 °C
4.1 V
IF(AV)
30 A
trr (typical)
47 ns
TJ (maximum)
150 °C
Qrr (typical)
120 nC
dI(rec)M/dt (typical) at 125 °C
240 A/µs
IRRM (typical)
4.7 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Cathode to anode voltage
Maximum continuous forward current
IF
Single pulse forward current
IFSM
Maximum repetitive forward current
IFRM
Maximum power dissipation
PD
Operating junction and storage temperature range
Document Number: 93090
Revision: 25-Aug-08
TEST CONDITIONS
VR
TC = 100 °C
VALUES
UNITS
1200
V
30
120
A
90
TC = 25 °C
350
TC = 100 °C
140
TJ, TStg
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- 55 to + 150
W
°C
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HFA30PB120
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 30 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER
Cathode to anode
breakdown voltage
SYMBOL
VBR
TEST CONDITIONS
IR = 100 µA
IF = 30 A
Maximum forward voltage
VFM
IF = 60 A
See fig. 1
IF = 30 A, TJ = 125 °C
VR = VR rated
MIN.
TYP.
MAX.
1200
-
-
-
2.4
4.1
-
3.1
5.7
-
2.3
4.0
UNITS
V
-
1.3
40
-
1.1
4000
See fig. 3
-
50
75
pF
Measured lead to lead 5 mm from package body
-
8.0
-
nH
MAX.
UNITS
Maximum reverse
leakage current
IRM
Junction capacitance
CT
VR = 200 V
Series inductance
LS
TJ = 125 °C, VR = 0.8 x VR rated
See fig. 2
µA
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER
Reverse recovery time
See fig. 5, 10
Peak recovery current
See fig. 6
Reverse recovery charge
See fig. 7
Peak rate of fall of recovery
current during tb
See fig. 8
SYMBOL
TEST CONDITIONS
MIN.
TYP.
trr
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V
-
47
-
trr1
TJ = 25 °C
-
110
170
trr2
TJ = 125 °C
-
170
260
IRRM1
TJ = 25 °C
-
10
15
IRRM2
TJ = 125 °C
-
16
24
Qrr1
TJ = 25 °C
Qrr2
TJ = 125 °C
dI(rec)M/dt1
dI(rec)M/dt2
IF = 30 A
dIF/dt = 200 A/µs
VR = 200 V
ns
A
-
650
980
-
1540
2310
TJ = 25 °C
-
270
-
TJ = 125 °C
-
240
-
MIN.
TYP.
MAX.
UNITS
-
-
300
°C
-
-
0.36
nC
A/µs
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
Lead temperature
Tlead
Thermal resistance,
junction to case
RthJC
Thermal resistance,
junction to ambient
RthJA
Typical socket mount
-
-
80
Thermal resistance,
case to heatsink
RthCS
Mounting surface, flat, smooth and greased
-
0.50
-
-
2.0
-
g
-
0.07
-
oz.
6.0
(5.0)
-
12
(10)
kgf · cm
(lbf · in)
0.063" from case (1.6 mm) for 10 s
Weight
Mounting torque
Marking device
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Case style TO-247AC modified (JEDEC)
For technical questions, contact: diodes-tech@vishay.com
°C/W
HFA30PB120
Document Number: 93090
Revision: 25-Aug-08
HFA30PB120
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 30 A
Reverse Current - I R (µA)
10
100
T J = 125°C
1
T J = 25°C
0.1
200
400
600
800
1000
1200
Reverse Voltage - V R (V)
10
Fig. 2 - Typical Reverse Current vs.
Reverse Voltage
1000
Tj = 125°C
Junction Capacitance - CT (pF)
IF, Instantaneous Forward Current (A)
Tj = 175°C
T J = 150°C
Tj = 25°C
1
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
VF, Forward Voltage Drop (V)
100
TJ = 25°C
10
1
10
100
1000
Reverse Voltage - V R (V)
Fig. 1 - Typical Forward Voltage Drop vs.
Instantaneous Forward Current
Fig. 3 - Typical Junction Capacitance vs.
Reverse Voltage
Thermal Response ( Z thJC )
1
D = 0.50
0.1
0.20
0.10
τJ
0.05
0.01
0.02
0.01
SINGLE PULSE
( THERMAL RESPONSE )
R1
R1
τJ
τ1
τ1
R2
R2
τ2
R3
R3
τ3
τ2
τC
τ
τ3
Ri (°C/W) τi (sec)
0.234
0.000100
0.069
0.000434
0.056
Ci= τi/Ri
Ci i/Ri
0.002202
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
1E-006
1E-005
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics
Document Number: 93090
Revision: 25-Aug-08
For technical questions, contact: diodes-tech@vishay.com
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HFA30PB120
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 30 A
3000
300
VR = 390V
T J = 25°C _____
275
IF = 60A
T J = 125°C ----------
250
IF = 30A
2500
VR = 390V
I = 60A
TJ = 25°C _____ F
I
TJ = 125°C ---------- F = 30A
IF = 15A
IF = 15A
225
2000
200
trr (ns)
Qrr (nC)
175
150
125
1500
1000
100
75
500
50
25
0
0
100 150 200 250 300 350 400 450 500
100
300
400
500
diF /dt (A/µs)
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt
(Per Leg)
Fig. 7 - Typical Stored Charge vs. dIF/dt
(Per Leg)
35
900
V = 390 V
R
T = 25 °C _____
J
800
T = 125 °C ----------
30
J
IF
25
VR = 390V
TJ = 25°C _____
TJ = 125°C ----------
700
= 60 A
di(rec)M / dt (A/µs)
IF = 30 A
IF = 15 A
IR R M (A)
200
diF /dt (A/µs)
20
15
IF 15 A
600
500
400
IF = 30 A
300
10
IF = 60 A
200
5
100
0
0
100 150 200 250 300 350 400 450 500
100 150 200 250 300 350 400 450 500
diF /dt (A/µs)
diF /dt (A/µs)
Fig. 6 - Typical Recovery Current vs. dIF/dt (Per Leg)
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt
(Per Leg)
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For technical questions, contact: diodes-tech@vishay.com
Document Number: 93090
Revision: 25-Aug-08
HFA30PB120
HEXFRED®
Vishay High Power Products
Ultrafast Soft Recovery Diode, 30 A
VR = 200 V
0.01 Ω
L = 70 µH
D.U.T.
dIF/dt
adjust
D
IRFP250
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit
(3)
trr
IF
ta
tb
0
Qrr
(2)
IRRM
(4)
0.5 IRRM
dI(rec)M/dt (5)
0.75 IRRM
(1) dIF/dt
(4) Qrr - area under curve defined by trr
and IRRM
(1) dIF/dt - rate of change of current
through zero crossing
(2) IRRM - peak reverse recovery current
Qrr =
(3) trr - reverse recovery time measured
from zero crossing point of negative
going IF to point where a line passing
through 0.75 IRRM and 0.50 IRRM
extrapolated to zero current.
trr x IRRM
2
(5) dI(rec)M/dt - peak rate of change of
current during tb portion of trr
Fig. 10 - Reverse Recovery Waveform and Definitions
L = 100 µH
High-speed
switch
D.U.T.
Rg = 25 Ω
Current
monitor
IL(PK)
Freewheel
diode
+
Decay
time
Vd = 50 V
V(AVAL)
VR(RATED)
Fig. 11 - Avalanche Test Circuit and Waveforms
Document Number: 93090
Revision: 25-Aug-08
For technical questions, contact: diodes-tech@vishay.com
www.vishay.com
5
HFA30PB120
Vishay High Power Products
HEXFRED®
Ultrafast Soft Recovery Diode, 30 A
ORDERING INFORMATION TABLE
Device code
HF
A
30
PB
120
-
1
2
3
4
5
6
1
-
HEXFRED® family
2
-
Process designator: A = Electron irradiated
B = Platinum diffused
3
-
Current rating (30 = 30 A)
4
-
Package outline (PB = TO-247, 2 pins)
5
-
Voltage rating (120 = 1200 V)
6
-
None = Standard production
PbF = Lead (Pb)-free
LINKS TO RELATED DOCUMENTS
Dimensions
http://www.vishay.com/doc?95253
Part marking information
http://www.vishay.com/doc?95255
SPICE model
http://www.vishay.com/doc?95358
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For technical questions, contact: diodes-tech@vishay.com
Document Number: 93090
Revision: 25-Aug-08
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Disclaimer
All product specifications and data are subject to change without notice.
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or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
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Document Number: 91000
Revision: 18-Jul-08
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