IGBRB1000BJAPCT5

IGBR www.vishay.com Vishay Electro-Films Thin Film, High Power Back-Contact Resistor FEATURES • Noise reduction or elimination when used in SiC power modules • Sintering, soldering, and epoxy attachment options • Wire bondable • Small size, high power density • High power rating • Single wire bond assembly LINKS TO ADDITIONAL RESOURCES • Moisture resistant 3D 3D 3D Models • Case size: 0202 to 0808 Videos Infographics Did You Know? Capabilities and Custom Options • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 The high power back-contact resistor (IGBR) series thin film chip resistor utilizes the excellent thermal properties of silicon to allow ultra high power rating with miniature case size for hybrid (chip and wire) assemblies. APPLICATIONS • Gate resistor for SiC based power modules The IGBR requires only one wire bond thus saving hybrid space. • Gate resistor for IGBT based power converters The IGBRs are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. • High power applications The IGBRs are 100 % electrically tested and visually inspected to MIL-STD-883, method 2032 class H, class K, or commercial inspection per internal standards. • Hybrid assemblies • Current limiting for LED lighting applications • Alternative energy TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES, AND TOLERANCES PARAMETER VALUE UNIT Total Resistance Range 1.8 to 25 Ω Standard Tolerances 5, 10, 25 % ± 500 ppm/°C TCR TCR (ppm/°C) BY CASE SIZE AND VALUE Case Size (mil) 20 x 20 n/a 40 x 40 n/a 500 60 x 60 500 80 x 80 1.8 3.3 5 300 300 250 300 350 500 500 8 250 300 10 200 250 15 200 20 22 25 Value (:) Document Number: 61107 1 For technical questions, contact: efi@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Revision: 14-Jun-2023 IGBR www.vishay.com Vishay Electro-Films STANDARD ELECTRICAL SPECIFICATIONS PARAMETER VALUE Operating Film Temperature Range Operating Temperature Range UNIT 200 max. °C -55 to +125 °C 75 max. V Working Voltage Breakdown Voltage 400 max. V Thermal Resistivity (1) Down to 2 K/W DC Power Rating (1)(2) Up to 4 W ± 1 ΔR/R % ± 0.25 ΔR/R % Load Life Stability, 1000 h, Film Temperature 200 °C Short Time Overload, 5 x Rated Power, 25 °C, 5 s ± 1 ΔR/R % Moisture Resistance, MIL-STD-202, Method 106 (3) ± 0.25 ΔR/R % High Temperature Exposure, 100 h, +150 °C ± 0.5 ΔR/R % Low Temperature Operation, -65 °C, 45 min ± 0.5 ΔR/R % Thermal Shock, MIL-STD-202, Method 107 F Notes (1) See table “Power Rating by Case Size” (2) Power rating determined by application specific heat sink properties. Film temperature should not exceed 200 °C. See table “Power Rating by Case Size” for more details (3) Aluminum pads and aluminum wire bonds are sensitive to high moisture environments. Adequate application level packaging is required to protect the components and wire bonds from moisture related damage POWER RATING BY CASE SIZE CHIP SIZE mil (mm) (2) BOND PAD SIZE mil (mm) DIE THICKNESS mil (mm) (2) TYPICAL R THERMAL (1) K/W R MIN. Ω R MAX. Ω 20 x 20 (0.5 x 0.5) 10 x 16 (0.25 x 0.41) 10 (0.25) 10 15 25 CASE SIZE 0202 0404 40 x 40 (1 x 1) 15 x 36 (0.38 x 0.91) 10 (0.25) 7 3.3 25 0606 60 x 60 (1.5 x 1.5) 20 x 56 (0.51 x 1.42) 10 (0.25) 5 1.8 25 0808 80 x 80 (2 x 2) 27 x 76 (0.69 x 1.93) 10 (0.25) 2 1.8 25 Notes (1) (2) Typical R thermal between film and back contact. Does not include die attach joint (epoxy or solder) Dimension tolerances are ± 0.05 mm (± 2 mil) SCHEMATIC R PIN 1 Top contact PIN 2 Back contact Test pad not used during normal operation PIN 1 PIN 2 Back contact Document Number: 61107 2 For technical questions, contact: efi@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Revision: 14-Jun-2023 IGBR www.vishay.com Vishay Electro-Films MATERIAL SPECIFICATIONS PARAMETER Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO2 Film Material Tantalum Nitride Case Size See table “Power Rating by Case Size” Passivation None Number of Pads 1 Top Terminations Suitable for Heavy Gage Aluminum Wire-Bonding Al (2.5 μm min.) P = TiW (500 Å to 1000 Å) Pd (2000 Å to 3000 Å) Au (3000 Å to 5000 Å) N = TiW (500 Å to 1000 Å) Ni (6000 Å to 7000 Å) Au (3000 Å to 5000 Å) Back Termination (for epoxy, lead (Pb)-free solder or silver compression assembly) T = TiW (500 Å to 1000 Å) Au (1000 Å to 3000 Å) Ni (40 μ" minimum) Au (40 μ" minimum) MATERIAL SPECIFICATIONS Conductor material Resistor material Backside connection VERSION A (0202) IGBRA - 15 : to 25 : VERSION B (0404) IGBRB - 3.3 : to 12.9 : IGBRB - 13 : to 25 : Document Number: 61107 3 For technical questions, contact: efi@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Revision: 14-Jun-2023 IGBR www.vishay.com Vishay Electro-Films MATERIAL SPECIFICATIONS Conductor material Resistor material Backside connection VERSION C (0606) IGBRC - 3 : to 5.5 : IGBRC - 1.8 : to 2.9 : IGBRC - 5.6 : to 15.90 : IGBRC - 16 : to 25 : VERSION D (0808) IGBRD - 1.8 : to 5.5 : IGBRD - 5.6 : to 14.9 : IGBRD - 15 : to 24.9 : GLOBAL PART NUMBER INFORMATION Global Part Number: IGBRB3000CJOPCST Global Part Number Description: IGBR 1 mm 3 Ω 5 % 300 ppm/°C PD Commercial Tape I G B R B MODEL SIZE RESISTANCE (Ω) IGBR A = 20 x 20 B = 40 x 40 C = 60 x 60 D = 80 x 80 First 4 digits are significant figures of resistance High power backcontact resistor 3 0 0 RESISTANCE MULTIPLIER CODE TOL. CODE (%) C = 0.001 B = 0.01 A = 0.1 J=5 K = 10 M = 20 L = 25 0 C TCR (ppm/°C) J O BACKSIDE TERMINATION J = ± 500 P = TiW / Pd / Au W = ± 350 N = TiW / Ni / Au T = TiW / Au/ O = ± 300 Ni/Au (1) M = ± 250 P C S T VISUAL CLASS PACKAGING CODE C = commercial H = class H K = class K WS = waffle pack 100 min., 1 mult. ST = diced on tape Note (1) See “Material Specifications” table for metal thickness Document Number: 61107 4 For technical questions, contact: efi@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Revision: 14-Jun-2023 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer's technical experts. Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein. Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of any of the products, services or opinions of the corporation, organization or individual associated with the third-party website. Vishay disclaims any and all liability and bears no responsibility for the accuracy, legality or content of the third-party website or for that of subsequent links. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2023 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2023 1 Document Number: 91000