M251206BB2200JP500

M25SI www.vishay.com Vishay Draloric Fusible Thin Film Chip Resistors FEATURES • Metal film on high quality ceramic • Special protective top coat • Flame retardant • Sn solder contacts on Ni barrier layer • Fusible resistor for constant voltage • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 M25SI fusible thin film chip resistors are designed for overload protection in modern professional electronics. Typical applications include automotive, telecommunication and industrial equipment. TECHNICAL SPECIFICATIONS DESCRIPTION M25SI Imperial size 1206 Metric size code RR3216M Resistance range 5 Ω to 3.9 kΩ ± 5 % (2) Resistance tolerance Temperature coefficient ± 100 ppm/K Rated dissipation, P70 (1) 0.250 W Operating voltage, Umax. ACRMS/DC P x R Permissible film temperature, ϑF max. (1) 125 °C Operating temperature range (1) -55 °C to 125 °C Permissible voltage against ambient (insulation): 1 min; Uins > 300 V ≤ 1 x 10-9/h Failure rate: FITobserved Notes (1) Please refer to APPLICATION INFORMATION below. (2) Tolerance 1 % on request. APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. PULSE TEST DATA Pulse power (square pulse) 0.9 W 0.3 W Pulse duration ti 100 μs 100 ms Pulse pause tp 100 ms 1s 105 105 < 0.1 % < 0.1 % Number of pulses Drift after pulse test Revision: 11-Nov-15 Document Number: 20031 1 For technical questions, contact: thinfilmchip@vishay,com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 M25SI www.vishay.com Vishay Draloric MAXIMUM RESISTANCE CHANGE AT RATED DISSIPATION OPERATION MODE STANDARD Rated dissipation, P70 M25SI1206 0.250 W Operating temperature range -55 °C to 125 °C Permissible film temperature, ϑF max. 125 °C 5 Ω to 3.9 kΩ M25SI1206 Max. resistance change at P70 for resistance range, |ΔR/R| after: ≤1% 1000 h Note • A suitable low thermal resistance of the circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits. Please consider the application note “Thermal Management in Surface-Mounted Resistor Applications” (www.vishay.com/doc?28844) for information on the general nature of thermal resistance. TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES M25SI1206 ± 100 ppm/K ±5% 5 Ω to 3.9 kΩ E24 PACKAGING TYPE / SIZE CODE QUANTITY PACKAGING STYLE WIDTH PITCH PACKAGING DIMENSIONS M25SI1206 P5 5000 Paper Tape acc. IEC 60286-3 Type 1a 8 mm 4 mm Ø 180 mm / 7" PART NUMBER AND PRODUCT DESCRIPTION Part Number: M251206BB9109JP500 M 2 5 1 2 0 6 B B 9 1 0 9 J P 5 0 TYPE / SIZE VERSION TCR RESISTANCE TOLERANCE PACKAGING M251206 B = SI B = ± 100 ppm/K 3 digit value 1 digit multiplier J=±5% P5 0 Multiplier 8 = *10-2 9 = *10-1 0 = *100 1 = *101 Product Description: M25SI 100 91R 5 % P5 M25SI 100 91R 5% P5 TYPE TCR RESISTANCE TOLERANCE PACKAGING M25SI ± 100 ppm/K 91R = 91 Ω ±5% P5 Note • Products can be ordered using either the PART NUMBER or PRODUCT DESCRIPTION. Revision: 11-Nov-15 Document Number: 20031 2 For technical questions, contact: thinfilmchip@vishay,com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 M25SI www.vishay.com Vishay Draloric DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A homogeneous film of metal alloy is deposited on a high grade ceramic substrate Al2O3. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. Vishay acknowledges the following systems for the regulation of hazardous substances: The result of the determined production is verified by an extensive testing procedure. Only accepted products are laid directly into the paper tape in accordance with IEC 60286-3 Type 1a (1). ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The use of conformal coating is not permitted. The resistors are RoHS-compliant; the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474. (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org. (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table. Revision: 11-Nov-15 Document Number: 20031 3 For technical questions, contact: thinfilmchip@vishay,com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 M25SI www.vishay.com Vishay Draloric FUNCTIONAL PERFORMANCE Voltage in V Time to Fuse in s 1000 100 10 1000 100 1 10 0.1 0.01 0.001 0 1 2 3 4 5 6 7 8 Fusing Performance 10 100 10 000 1000 Resistance Value in Ω Maximum Applicable Voltage after Fusing 0.275 Temperature Rise in °C Rated Power in W 1 1 9 10 Power in W 0.250 0.225 0.200 0.175 0.150 100 75 60 45 30 0.125 15 0.100 0 -55 0 -25 Derating Revision: 11-Nov-15 0 25 50 75 100 125 150 70 Ambient Temperature in °C 0 0.1 Temperature Rise 0.2 0.3 0.4 Power in W Document Number: 20031 4 For technical questions, contact: thinfilmchip@vishay,com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 M25SI www.vishay.com Vishay Draloric TESTS AND REQUIREMENTS All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 60115-8 (successor of EN 140400), sectional specification IEC 60068-2-xx, test methods The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. The testing also covers most of the requirements specified by EIA/ECA-703 and JIS-C-5201-1. The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on printed circuit boards in accordance with EN 60115-8, 2.4.2, unless otherwise specified. TEST PROCEDURES AND REQUIREMENTS EN 60 115-1 CLAUSE IEC 60 068-2 (1) TEST METHOD TEST REQUIREMENTS PERMISSIBLE CHANGE (ΔR) PROCEDURE Stability for product types: M25SI1206 5 Ω to 3.9 kΩ 4.5 - Resistance - ±5%R 4.8 - Temperature coefficient At (20 / -55 / 20) °C and (20 / 125 / 20) °C ± 100 ppm/K 4.25.1 - Endurance at 70 °C: standard operation mode U = P 70 x R ≤ Umax.; whichever is the less severe; 1.5 h on; 0.5 h off; 70 °C; 1000 h ≤±1%R - Endurance at upper category temperature 125 °C; 1000 h ≤±1%R 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ≤ ± 0.5 % R 4.19 14 (Na) Rapid change of temperature 30 min at LCT; 30 min at UCT; LCT = -55 °C; UCT = 125 °C ≤ ± 0.2 % R 4.18 58 (Td) Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s ≤ ± 0.2 % R 4.25.3 Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. Revision: 11-Nov-15 Document Number: 20031 5 For technical questions, contact: thinfilmchip@vishay,com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 M25SI www.vishay.com Vishay Draloric DIMENSIONS T1 W H T2 L DIMENSIONS AND MASS TYPE / SIZE H (mm) L (mm) W (mm) T1 (mm) T2 (mm) MASS (mg) M25SI1206 0.55 ± 0.05 3.20 + 0.10 / - 0.20 1.60 ± 0.15 0.45 ± 0.20 0.40 ± 0.20 10 Note • Resistors M25SI are marked using the three-character code system of IEC 60062 (1), 4.2.2. on their beige protective coating. SOLDER PAD DIMENSIONS b l a RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING TYPE / SIZE M25SI1206 REFLOW SOLDERING a (mm) b (mm) l (mm) a (mm) b (mm) l (mm) 0.90 1.70 2.00 1.10 1.70 2.30 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1), or in publication IPC-7351. (1) The quoted IEC standards are also released as EN standards with the same number and identical contents. Revision: 11-Nov-15 Document Number: 20031 6 For technical questions, contact: thinfilmchip@vishay,com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2021 1 Document Number: 91000