MSP3V3, MSP5.0A
www.vishay.com
Vishay General Semiconductor
Surface-Mount TRANSZORB® Transient Voltage Suppressors
FEATURES
• Very low profile - typical height of 0.65 mm
eSMP ® Series
Available
• Ideal for automated placement
• Oxide planar chip junction
• Unidirectional polarity only
• Peak pulse power: 150 W (10 μs/1000 μs)
Top View
Bottom View
• Meets MSL level 1, per J-STD-020C, LF maximum peak
of 260 °C
MicroSMP (DO-219AD)
Cathode
• ESD capability: 15 kV (air), 8 kV (contact)
Anode
• AEC-Q101 qualified
• Not recommended for PCB bottom side wave mounting
LINKS TO ADDITIONAL RESOURCES
3D 3D
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
3D Models
PRIMARY CHARACTERISTICS
VWM
3.3 V to 5.0 V
VBR
4.1 V to 7.07 V
Use in sensitive electronics protection against voltage
transients induced by inductive load switching and lighting
on ICs, MOSFET, industrial, and signal lines of sensor units
for protecting sensitive equipment against transient
overvoltages.
PPPM
150 W
MECHANICAL DATA
TJ max.
150 °C
Polarity
Unidirectional
Package
MicroSMP (DO-219AD)
Case: MicroSMP (DO-219AD)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
industrial grade
Base P/NHM3 - halogen-free, RoHS-compliant, and
automotive grade
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Polarity: color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
VALUE
UNIT
Peak power dissipation with a 10/1000 μs waveform (fig. 1)
PPPM (1)(2)
150
W
Peak pulse current with a 10/1000 μs waveform
IPPM
(1)
See next table
A
1.0
W
Power dissipation
TM = 120 °C
PD (2)
Power dissipation
TA = 25 °C
PD (3)
0.5
W
TJ, TSTG
-55 to +150
°C
Operating junction and storage temperature range
Notes
(1) Non-repetitive current pulse, per fig. 1
(2) Mounted on 6.0 mm x 6.0 mm copper pads to each terminal
(3) Mounted on minimum recommended pad layout
Revision: 09-Nov-2020
Document Number: 88486
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSP3V3, MSP5.0A
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
DEVICE
TYPE
BREAKDOWN
VOLTAGE
VBR AT IT (1)
(V)
DEVICE
MARKING
CODE
MIN.
MAX.
TEST
CURRENT
IT
(mA)
STAND-OFF
VOLTAGE
VWM
(V)
MAXIMUM
REVERSE
LEAKAGE
CURRENT
IR AT VWM
(μA)
MAXIMUM
VC AT IPPM
MAXIMUM
VC AT IPPM
RD
10/1000 μs
VC (V) IPPM (A)
RD
8/20 μs
RD (Ω) VC (V) IPPM (A)
RD (Ω)
MSP3V3
KC
4.10
5.10
1.0
3.3
200
7.6
19.7
0.127
11.5
87
0.074
MSP5.0A
AE
6.40
7.07
10
5.0
100
9.2
16.3
0.131
13.4
75
0.085
Notes
• To calculate maximum clamping voltage at surge current uses the following formula: VCL max. = RD x IPP + VBR max.
(1) Pulse test: t ≤ 50 ms
p
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
Typical thermal resistance
SYMBOL
VALUE
RθJA (1)
250
RθJM (2)
30
UNIT
°C/W
Notes
(1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance R
θJA - junction to ambient
(2) Units mounted on PCB with 6.0 mm x 6.0 mm copper pad areas; R
θJM - junction to mount
IMMUNITY TO STATIC ELECTRICAL DISCHARGE TO THE FOLLOWING STANDARDS
(TA = 25 °C unless otherwise noted)
STANDARD
TEST TYPE
AEC-Q101-001
IEC 61000-4-2
(2)
TEST CONDITIONS
Human body model (contact mode)
C = 100 pF, R = 1.5 kΩ
Human body model (air discharge mode)
(1)
C = 150 pF, R = 330 Ω
SYMBOL
VC
CLASS
VALUE
H3B
> 8 kV
4
> 15 kV
Notes
(1) Immunity to IEC 61000-4-2 air discharge mode has a typical performance > 30 kV
(2) System ESD standard
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
MSP3V3-M3/89A
0.006
89A
4500
7" diameter plastic tape and reel
MSP3V3HM3/89A (1)
0.006
89A
4500
7" diameter plastic tape and reel
MSP5.0A-M3/89A
0.006
89A
4500
7" diameter plastic tape and reel
MSP5.0AHM3/89A (1)
0.006
89A
4500
7" diameter plastic tape and reel
Note
(1) Automotive grade
Revision: 09-Nov-2020
Document Number: 88486
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSP3V3, MSP5.0A
www.vishay.com
Vishay General Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
1000
TJ = 25 °C
Pulse Width (td) is
defined as the Point
Where the Peak Current
decays to 50 % of IPPM
tr = 10 μs
tr = 8 μs
Peak Value
IPPM
100
Half Value - IPP
IPPM
2
50
td = 1000 μs
td = 20 μs
td
0
0
1.0
2.0
3.0
Measured at Zero Bias
CJ - Junction Capacitance (pF)
IPPM - Peak Pulse Current (% IRSM)
150
Measured at Stand-off
Voltage, VWM
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
100
4.0
3
3.5
t - Time (ms)
Fig. 1 - Pulse Waveform
5
5.5
6
1.2
Non-Repetitive Pulse
Waveform Shown in Fig. 1
TA = 25 °C
10
1
0.1
TA = TM, Mounted on
6.0 mm x 6.0 mm Copper Pad
PD - Power Dissipation (W)
PPPM - Peak Pulse Power (kW)
4.5
Fig. 4 - Typical Junction Capacitance
100
0.24" x 0.24" (6.0 mm x 6.0 mm)
Copper Pad Areas
1.0
0.8
0.6
Mounted on Minimum
Recommende Pad Area
0.4
0.2
0.0
0.01
0.1
1
10
100
1000
0
10 000
25
75
50
100
125
150
175
Ambient Temperature (°C)
td - Pulse Width (μs)
Fig. 2 - Peak Pulse Power Rating Curve
Fig. 5 - Power Dissipation Derating Curve
1000
100
Transient Thermal Impedance (°C/W)
Peak Pulse Power (PPP) or Current (IPP)
Derating in Percentage (%)
4
VWM - Reverse Stand-Off Voltage (V)
75
50
25
0
0
25
50
75
100
125
150
175
Junction to Ambient
100
10
0.01
0.1
1
10
100
1000
TJ - Initial Temperature (°C)
t - Pulse Duration (s)
Fig. 3 - Pulse Power or Current vs. Initial Junction Temperature
Fig. 6 - Typical Transient Thermal Impedance
Revision: 09-Nov-2020
Document Number: 88486
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
MSP3V3, MSP5.0A
www.vishay.com
Vishay General Semiconductor
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
MicroSMP (DO-219AD)
0.059 (1.50)
0.043 (1.10)
Cathode Band
0.055 (1.40)
0.047 (1.20)
0.030 (0.75)
0.022 (0.55)
0.039 (0.98)
0.031 (0.78)
0.091 (2.30)
0.083 (2.10)
0.106 (2.70)
0.091 (2.30)
0.030 (0.75)
0.022 (0.55)
Mounting Pad Layout
0.079
(2.00)
0.029 (0.73)
0.025 (0.63)
0.043
(1.10)
0.011 (0.27)
0.005 (0.12)
0.032
(0.80)
0.032
(0.80)
0.020 (0.50)
Revision: 09-Nov-2020
Document Number: 88486
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2023
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Document Number: 91000
