OLED-128O032A-SPP3N00000
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Vishay
128 x 32 Graphic OLED
FEATURES
• Type: graphic
• Display format: 128 x 32 dots
• Built-in controller: SSD1305Z
• Duty cycle: 1/32
• +3 V power supply
• Interface: 6800, option 8080 and SPI
• With polarizer
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
MECHANICAL DATA
ITEM
ABSOLUTE MAXIMUM RATINGS
STANDARD VALUE
Module dimension
Viewing area
Active area
ITEM
57.02 x 15.10
55.018 x 13.098
Dot size
0.408 x 0.388
Dot pitch
0.43 x 0.41
Mounting hole
UNIT
62.0 x 24.0 x 2.35
mm
n/a
SYMBOL
STANDARD VALUE
MIN.
MAX.
Supply voltage
for logic (1)(2)
VDD
-0.3
4
Supply voltage
for display (1)(2)
VCC
0
15
Operating
temperature
TOP
-40
+80
Storage
temperature
TSTG
-40
+80
UNIT
V
°C
Notes
(1) All the above voltages are on the basis of “V
SS = 0 V”.
(2) When this module is used beyond the above absolute maximum
ratings, permanent breakage of the module may occur. Also, for
normal operations, it is desirable to use this module under the
conditions according to section 6 “Electrical Characteristics”. If
this module is used beyond these conditions, malfunctioning of
the module can occur and the reliability of the module may
deteriorate.
ELECTRICAL CHARACTERISTICS
ITEM
SYMBOL
CONDITION
Supply voltage for logic
VDD
Supply voltage for display
STANDARD VALUE
MIN.
TYP.
MAX.
-
2.8
3.0
3.3
VCC
-
10
12
15
Input high voltage
VIH
-
0.8 VDD
-
VDD
Input low voltage
VIL
-
0
-
0.2 VDD
Output high voltage
VOH
-
0.9 VDD
-
VDD
Output low voltage
VOL
-
0
-
0.1 VDD
Supply current
ICC
VCC = 12 V
20
21
25
UNIT
V
mA
OPTIONS
EMITTING COLOR
YELLOW
GREEN
RED
BLUE
WHITE
-
-
-
Yes
-
Revision: 13-Dec-16
Document Number: 37892
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INTERFACE PIN FUNCTION
PIN NO.
SYMBOL
FUNCTION
1
NC (GND)
2
VLSS
3
VSS
Ground
4
NC
No connection
5
VDD
Power supply pin for core logic operation
6
BS1
Communicating protocol select
These pins are MCU interface selection input. See the following table:
No connection
This is an analog ground pin. It should be connected to VSS externally
68XX parallel 80XX parallel
7
BS2
8
Serial
I2C
BS1
0
1
0
1
BS2
1
1
0
0
CS#
This pin is the chip select input. (active “low”)
9
RES#
This pin is reset signal input.
When the pin is “low”, initialization of the chip is executed.
Keep this pin “high” (i.e. connect to VDD) during normal operation.
10
D/C#
This is data / command control pin. When it is pulled high (i.e. connect to VDDIO), the data
at D [7:0] is treated as data. When it is pulled “low”, the data at D [7:0] will be transferred
to the command register. In I2C mode, this pin acts as SA0 for slave address selection.
R / W#
This is read / write control input pin connecting to the MCU interface. When interfacing to
a 6800 series microprocessor, this pin will be used as read / write (R / W) selection input.
Read mode will be carried out when this pin is pulled “high” (i.e. connect to VDDIO) and
write mode when “low”. When 8080 interface mode is selected, this pin will be the write
(WR) input. Data write operation is initiated when this pin is pulled “low” and the chip is
selected. When serial interface is selected, this pin must be connected to VSS.
12
E / RD#
When interfacing to a 6800 series microprocessor, this pin will be used as the enable (E)
signal. Read / write operation is initiated when this pin is pulled “high” (i.e. connect to VDD)
and the chip is selected. When connecting to an 8080 microprocessor, this pin receives
the read (RD#) signal. Read operation is initiated when this pin is pulled “low” and the chip
is selected. When serial interface is selected, this pin must be connected to VSS.
13
D0
14
D1
15
D2
16
D3
17
D4
18
D5
19
D6
20
D7
21
IREF
This is segment output current reference pin. A resistor should be connected between
this pin and VSS to maintain the IREF current at 10 μA.
22
VCOMH
The pin for COM signal deselected voltage level. A capacitor should be connected
between this pin and VSS.
23
VCC
Power supply for panel driving voltage. This is also the most positive power voltage
supply pin.
24
NC (GND)
11
Revision: 13-Dec-16
These are 8-bit bi-directional data bus to be connected to the microprocessor’s data bus.
When serial interface mode is selected, D0 will be the serial clock input: SCLK; D1 will be
the serial data input: SDIN and D2 should be left opened. When I2C mode is selected, D2,
D1 should be tied together and serve as SDAout, SDAin in application and D0 is the serial
clock input, SCL.
No connection
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DIMENSIONS in millimeters
2.35 max.
15.10 (VA)
57.02 (VA)
3.491
55.018 (AA)
2.05 ± 0.2
0.70 ± 0.07
1.10 ± 0.1
0.50 ± 0.5
3.00
2.491
13.098 (AA)
24.00 ± 0.2
20.10 ± 0.2
2.00
62.00 ± 0.2
“A”
Remove tape
t = 0.15 max.
Shading plate
t = 0.2
Glue
19.60 ± 0.3
Protect tape
15 x 3.5 x 0.05
8.50 ± 0.1
2.00 ± 0.15
2x
.80
Contact side
Stiffener side
± 0.
1
24
0.30 ± 0.03
3.00 ± 0.3
W = 0.30 ± 0.03
0.50
P0.5 x 23 = 11.50 ± 0.05
12.50 ± 0.2
0.388
0.43
(24.75)
0.41
4.50 ± 0.5
8.60 ± 0.15
1
Ø0
0.408
Detail “A”
SCALE 5/1
The non-specified tolerance of dimension is ± 0.3 mm.
Revision: 13-Dec-16
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OLED-128O032A-SPP3N00000
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1.Module Classification Information
OLED 128 O 032 A S P P 3 N 0 0 000
ۑ
1
ۑ
ۑ
ۑ
ۑ
ۑ
ۑ
ۑ
չ
պ
ջ
ռ
ս
Brand: Vishay Intertechnology, Inc.
Horizontal Format: 128 Columns
2
3
4
5
Display Type: NĺCharacter Type, HĺGraphic Type, YĺTab Type, OĺCog
Vertical Format: 32 Lines
Serials code
A烉Amber
B烉Blue
Emitting Color
G烉Green
6
R烉RED
W烉White
L烉Yellow
7
Polarizer
P烉With Polarizer; N: Without Polarizer
8
Display Mode
P烉Passive Matrix ; A: Active Matrix
9
10
Driver Voltage
Touch Panel
11
Products type
3: 3.0 V; 5: 5.0V
N烉Without touch panel; T: With touch panel
0烉Standard type
1. Sunlight Readable type
2. Transparent OLED (TOLED)
3. Flexible OLED
4. OLED for Lighting
Product grades:
0烉Standard(A-level)
2烉B-level
3烉C-level
4烉high class(AA-level)
5烉Customer offerings
Application serial number(000~ZZZ)
12
Product grades
13
Serial No.
Revision: 13-Dec-16
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2.General Specification
Item
Dimension
Unit
128 x 32 Dots
㸫
62.0 × 24.0 × 2.35
mm
55.018 × 13.098
mm
Pixel Size
0.408 × 0.388
mm
Pixel Pitch
0.43 × 0.41
mm
Dot Matrix
Module dimension
Active Area
Display Mode
Passive Matrix
Display Color
SkyBlue
Drive Duty
IC
1/32 Duty
SSD1305Z
Revision: 13-Dec-16
Document Number: 37892
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62.00±0.2
57.02 VA
3.491
55.018 AA
MAX 2.35
2.05±0.2
0.70±0.07
1.10±0.1
0.50±0.5
2.491
15.10 VA
13.098 AA
20.10±0.2
24.00±0.2
2.00
3.00
3. Contour Drawing & Block Diagram
"A"
Remove tape
T=0.15 Max
Shading plate
T=0.2
Glue
Protect tape
15*3.5*0.05
2.00±0.15
2- 0
W=0.30±0.03
0.50
(24.75)
Contact side
Stiffener side
0.30±0.03
P0.5*23=11.50±0.05
12.50±0.2
0.388
3.00±0.3
4.50±0.5
0.1
24
1
8.60±0.15
.80±
0.41
19.60±0.3
8.50±0.1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
N.C.(GND)
VLSS
VSS
N.C.
VDD
BS1
BS2
CS#
RES#
D/C#
R/W#
E/RD#
D0
D1
D2
D3
D4
D5
D6
D7
IREF
VCOMH
VCC
N.C.(GND)
0.43
0.408
Detail "A"
Scale(5/1)
The non-specified tolerance of dimension is
Revision: 13-Dec-16
0.3mm.
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FUNCTION BLOCK DIAGRAM
*For more information, please refer to Application Note provided by Vishayġ
Revision: 13-Dec-16
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4. Interface Pin Function
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Symbol
Function
N.C.(GND) No connection
This is an analog ground pin. It should be connected to VSS
VLSS
externally.
VSS
Ground.
N.C.
No connection
VDD
Power supply pin for core logic operation
Communicating Protocol Select
These pins are MCU interface selection input. See the following
BS1
table:
68XX-parallel 80XX-parallel Serial I2C
BS1
0
1
0
1
BS2
BS2
1
1
0
0
CS#
This pin is the chip select input. (active LOW)
This pin is reset signal input. When the pin is LOW, initialization
of the chip is executed.
RES#
Keep this pin HIGH (i.e. connect to VDDIO) during normal
operation.
This is Data/Command control pin. When it is pulled HIGH (i.e.
connect to VDDIO), the data at D[7:0] is treated as data. When it
D/C#
is pulled LOW, the data at D[7:0] will be transferred to the
command register.
In I2C mode, this pin acts as SA0 for slave address selection.
This is read / write control input pin connecting to the MCU
interface.
When interfacing to a 6800-series microprocessor, this pin will be
used as Read/Write (R/W#) selection input. Read mode will be
carried out when this pin is pulled HIGH (i.e. connect to VDDIO)
and write mode when LOW. When 8080 interface mode is
R/W#
selected, this pin will be the Write (WR#) input. Data write
operation is initiated when this pin is pulled LOW and the chip is
selected.
When serial interface is selected, this pin must be connected to
VSS.
When interfacing to a 6800-series microprocessor, this pin will be
used as the Enable (E) signal. Read/write operation is initiated
when this pin is pulled HIGH (i.e. connect to VDDIO)
and the chip is selected.
When connecting to an 8080-microprocessor, this pin receives
E/RD#
the Read (RD#) signal. Read operation is initiated when this pin
is pulled LOW and the chip is selected.
When serial interface is selected, this pin must be connected to
VSS.
D0
These are 8-bit bi-directional data bus to be connected to the
microprocessor’s data bus.
D1
Revision: 13-Dec-16
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15
16
17
18
19
20
21
22
23
24
D2
D3
D4
D5
D6
D7
Vishay
When serial interface mode is selected, D0 will be the serial
clock input: SCLK; D1 will be the serial data input: SDIN and D2
should be left opened. When I2C mode is selected, D2, D1
should be tied together and serve as SDAout, SDAin in
application and D0 is the serial clock input, SCL.
This is segment output current reference pin.
A resistor should be connected between this pin and VSS to
maintain the IREF current at 10uA.
The pin for COM signal deselected voltage level.
VCOMH
A capacitor should be connected between this pin and VSS.
Power supply for panel driving voltage. This is also the most
VCC
positive power voltage supply pin.
N.C.(GND) No connection
IREF
Revision: 13-Dec-16
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5.Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Unit
Notes
Supply Voltage for Logic
VDD
-0.3
4
V
1, 2
Supply Voltage for Display
VCC
0
15
V
1, 2
Operating Temperature
TOP
-40
+80
°C
-
TSTG
-40
+80
°C
-
Storage Temperature
Note 1: All the above voltages are on the basis of “VSS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent
breakage of the module may occur. Also, for normal operations, it is desirable to use this
module under the conditions according to Section 6 ‘’Electrical Characteristics’’. If this module
is used beyond these conditions, malfunctioning of the module can occur and the reliability of
the module may deteriorate
Revision: 13-Dec-16
Document Number: 37892
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6.Electrical Characteristics
Item
Symbol Condition
Min
Typ
Max
Unit
Supply Voltage for Logic
VDD
炼
2.8
3.0
3.3
V
Supply Voltage for Display
VCC
炼
10
12
15
V
High Level Input
Low Level Input
High Level Output
Low Level Output
Supply Current
VIH
VIL
VOH
VOL
ICC
炼
炼
炼
炼
VCC=12.0V
0.8×VDD
0
0.9×VDD
0
20
炼
炼
炼
炼
21
VDD
0.2×VDD
VDD
0.1×VDD
25
V
V
V
V
mA
Revision: 13-Dec-16
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7.Optical Characteristics
Item
View Angle
Contrast Ratio
Response Time
Symbol
Condition
Min
Typ
Max Unit
(V)ș
160
deg
(H)ij
160
deg
炼
Dark
T rise
炼
10
ȝs
T fall
炼
10
ȝs
nits
Supply Voltage For Vcc=12.0V
2000:1
炼
CR
With polarizer
100
120
CIEx(SkyBlue)
(CIE1931)
0.12
0.16
0.20
CIEy(SkyBlue)
(CIE1931)
0.22
0.26
0.30
50% Check Board Brightness
Revision: 13-Dec-16
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8.OLED Lifetime
ITEM
Conditions
Operating
Life Time
Ta=25ɗ
/ Initial 50% check board
brightness Typical Value
Min
Typ
20,000 Hrs
炼
Remark
Note
Notes:
1. Life time is defined the amount of time when the luminance has decayed to 50% of initial value.
4. Current consumption: within ± 50% of initial value.
APPENDIX:
RESIDUE IMAGE
Because the pixels are lighted in different time, the luminance of active pixels
may reduce or differ from inactive pixels. Therefore, the residue image will occur.
To avoid the residue image, every pixel needs to be lighted up uniformly.
Revision: 13-Dec-16
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10.Inspection Specification
NO
01
02
03
04
Item
Electrical
Testing
Black or
white
spots on
OLED
(display
only)
OLED
black
spots,
white
spots,
contamina
tion
(non-displ
ay)
Polarizer
bubbles
Revision: 13-Dec-16
Criterion
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character , dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 OLED viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
2.1 White and black spots on display 䍺0.25mm, no more than
three white or black spots present.
2.2 Densely spaced: No more than two spots or lines within
3mm.
3.1 Round type : As
following drawing
ĭ=( x + y ) / 2
SIZE
Acceptable Q
TY
Accept no
dense
2
ĭʀ0.10
0.10烋
ĭʀ0.20
0.20烋
ĭʀ0.25
0.25烋ĭ
3.2 Line type : (As following drawing)
Length Width
--Wʀ0.02
Lʀ3.0
0.02烋Wʀ0.03
Lʀ2.5
0.03烋Wʀ0.05
--0.05烋W
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
Size ĭ
ĭʀ0.20
0.20烋ĭʀ0.50
0.50烋ĭʀ1.00
1.00烋ĭ
Total Q TY
AQL
0.65
2.5
2.5
1
0
Acceptable Q TY
Accept no dense
2.5
2
As round type
Acceptable Q TY
Accept no dense
3
2
0
3
2.5
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NO
05
Item
Scratches
Criterion
Follow NO.3 OLED black spots, white spots, contamination
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: OLED side length
L: Electrode pad length:
Vishay
AQL
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
z: Chip thickness
Zʀ1/2t
y: Chip width
x: Chip length
Not over viewing
xʀ1/8a
area
Not exceed 1/3k
1/2t烋zʀ2t
xʀ1/8a
˞If there are 2 or more chips, x is total length of each chip.
2.5
6.1.2 Corner crack:
z: Chip thickness
Zʀ1/2t
y: Chip width
x: Chip length
Not over viewing
xʀ1/8a
area
Not exceed 1/3k
1/2t烋zʀ2t
xʀ1/8a
˞If there are 2 or more chips, x is the total length of each chip.
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NO Item
Vishay
Criterion
Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: OLED side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width
x: Chip length
yʀ0.5mm
xʀ1/8a
6.2.2 Non-conductive portion:
06
AQL
z: Chip thickness
0 烋 zʀt
Glass
crack
2.5
y: Chip width
x: Chip length
z: Chip
thickness
yʀ L
xʀ1/8a
0 烋 zʀt
˞If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
specifications.
˞If the product will be heat sealed by the customer, the alignment
mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width
yʀ1/3L
Revision: 13-Dec-16
x: length
xʀa
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uvG
W^G
W_G
W`G
XWG
XXG
Item
Cracked
glass
Backlight
elements
Vishay
Criterion
AQL
The OLED with extensive crack is not acceptable.
2.5
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged.
Using OLED spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
0.65
Bezel
9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.
9.2 Bezel must comply with job specifications.
2.5
PCBૠCOB
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the
IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside the
seal area on the PCB. And there should be no more than
three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, OLED pad, zebra pad
or screw hold pad, make sure it is smoothed down.
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections,
oxidation or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
2.5
2.5
Soldering
2.5
0.65
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
0.65
G
G
G
G
Revision: 13-Dec-16
Document Number: 37892
19
For technical questions, contact: displays@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OLED-128O032A-SPP3N00000
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NO
12
Vishay
Item
Criterion
AQL
2.5
General
appearance
12.1 No oxidation, contamination, curves or, bends on
interface Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on
product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it cause the
interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 OLED pin loose or missing pins.
12.10 Product packaging must the same as specified on
packaging specification sheet.
12.11 Product dimension and structure must conform to
product specification sheet.
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
Revision: 13-Dec-16
Document Number: 37892
20
For technical questions, contact: displays@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OLED-128O032A-SPP3N00000
www.vishay.com
Vishay
Check Item
Classification
No Display
Major
Missing Line
Major
Pixel Short
Major
Darker Short
Major
Wrong Display
Major
Un-uniform
B/A x 100% < 70%
A/C x 100% < 70%
Major
Revision: 13-Dec-16
Criteria
Document Number: 37892
21
For technical questions, contact: displays@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OLED-128O032A-SPP3N00000
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Vishay
11.Precautions in use of OLED Modules
Modules
(1)Avoid applying excessive shocks to module or making any alterations or modifications to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the
components of OLED display module.
(3)Don’t disassemble the OLED display module.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist OLED display module.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8)It's pretty common to use "Screen Saver" to extend the lifetime and Don't use fix information
for long time in real application.
(9)Don't use fixed information in OLED panel for long time, that will extend "screen burn" effect
time..
(10) Vishay has the right to change the passive components, including R2and R3 adjust resistors.
(Resistors, capacitors and other passive components will have different appearance and color
caused by the different supplier.)
(11) Vishay have the right to change the PCB Rev. (In order to satisfy the supplying stability,
management optimization and the best product performance...etc, under the premise of not
affecting the electrical characteristics and external dimensions, Vishay have the right to modify
the version.)
11.1. Handling Precautions
(1) Since the display panel is being made of glass, do not apply mechanical impacts such us
dropping from a high position.
(2) If the display panel is broken by some accident and the internal organic substance leaks out,
be careful not to inhale nor lick the organic substance.
(3) If pressure is applied to the display surface or its neighborhood of the OLED display module,
the cell structure may be damaged and be careful not to apply pressure to these sections.
(4) The polarizer covering the surface of the OLED display module is soft and easily scratched.
Please be careful when handling the OLED display module.
(5) When the surface of the polarizer of the OLED display module has soil, clean the surface. It
takes advantage of by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth containing
solvent
such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents
(6) Hold OLED display module very carefully when placing OLED display module into the
System housing. Do not apply excessive stress or pressure to OLED display module. And, do
not over bend the film with electrode pattern layouts.
These stresses will influence the display performance. Also, secure sufficient rigidity for the
outer cases.
Revision: 13-Dec-16
Document Number: 37892
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(7) Do not apply stress to the LSI chips and the surrounding molded sections.
(8) Do not disassemble nor modify the OLED display module.
(9) Do not apply input signals while the logic power is off.
(10) Pay sufficient attention to the working environments when handing OLED display
modules to prevent occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OLED display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OLED display
module. Be careful since static electricity may be generated when exfoliating the protective
film.
(11) Protection film is being applied to the surface of the display panel and removes the
protection film before assembling it. At this time, if the OLED display module has been stored
for a long period of time, residue adhesive material of the protection film may remain on the
surface of the display panel after removed of the film. In such case, remove the residue
material by the method introduced in the above Section 5.
(12) If electric current is applied when the OLED display module is being dewed or when it is
placed under high humidity environments, the electrodes may be corroded and be careful to
avoid the above.
11.2. Storage Precautions
(1) When storing OLED display modules, put them in static electricity preventive bags
avoiding exposure to direct sun light nor to lights of fluorescent lamps. and, also, avoiding
high temperature and high humidity environment or low temperature (less than 0°C)
environments.
(We recommend you to store these modules in the packaged state when they were shipped
from Vishay.
At that time, be careful not to let water drops adhere to the packages or bags nor let dewing
occur with them.
(2) If electric current is applied when water drops are adhering to the surface of the OLED
display module, when the OLED display module is being dewed or when it is placed under
high humidity environments, the electrodes may be corroded and be careful about the above.
11.3. Designing Precautions
(1) The absolute maximum ratings are the ratings which cannot be exceeded for OLED
display module, and if these values are exceeded, panel damage may be happen.
(2) To prevent occurrence of malfunctioning by noise, pay attention to satisfy the VIL and VIH
specifications and, at the same time, to make the signal line cable as short as possible.
(3) We recommend you to install excess current preventive unit (fuses, etc.) to the power
circuit (VDD). (Recommend value: 0.5A)
(4) Pay sufficient attention to avoid occurrence of mutual noise interference with the
neighboring devices.
(5) As for EMI, take necessary measures on the equipment side basically.
Revision: 13-Dec-16
Document Number: 37892
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For technical questions, contact: displays@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
OLED-128O032A-SPP3N00000
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Vishay
(6) When fastening the OLED display module, fasten the external plastic housing section.
(7) If power supply to the OLED display module is forcibly shut down by such errors as taking
out the main battery while the OLED display panel is in operation, we cannot guarantee the
quality of this OLED display module.
* Connection (contact) to any other potential than the above may lead to rupture of
the IC.
11.4. Precautions when disposing of the OLED display modules
1) Request the qualified companies to handle industrial wastes when disposing of the OLED
display modules. Or, when burning them, be sure to observe the environmental and hygienic
laws and regulations.
11.5. Other Precautions
(1) When an OLED display module is operated for a long of time with fixed pattern may remain
as an after image or slight contrast deviation may occur.
Nonetheless, if the operation is interrupted and left unused for a while, normal state can be
restored. Also, there will be no problem in the reliability of the module.
(2) To protect OLED display modules from performance drops by static electricity rapture, etc.,
do not touch the following sections whenever possible while handling the OLED display
modules.
* Pins and electrodes
* Pattern layouts such as the TCP & FPC
(3) With this OLED display module, the OLED driver is being exposed. Generally speaking,
semiconductor elements change their characteristics when light is radiated according to the
principle of the solar battery. Consequently, if this OLED driver is exposed to light,
malfunctioning may occur.
* Design the product and installation method so that the OLED driver may be shielded from light
in actual usage.
* Design the product and installation method so that the OLED driver may be shielded from light
during the inspection processes.
(4) Although this OLED display module stores the operation state data by the commands and the
indication data, when excessive external noise, etc. enters into the module, the internal status
may be changed. It therefore is necessary to take appropriate measures to suppress noise
generation or to protect from influences of noise on the system design.
(5) We recommend you to construct its software to make periodical refreshment of the operation
statuses (re-setting of the commands and re-transference of the display data) to cope with
catastrophic noise.
(6)Resistors, capacitors and other passive components will have different appearance and color
caused by the different supplier.
(7)Our company will has the right to upgrade and modify the product function.
Revision: 13-Dec-16
Document Number: 37892
24
For technical questions, contact: displays@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000