PCNM
www.vishay.com
Vishay Dale Thin Film
High Power Aluminum Nitride, Wraparound Surface Mount,
Precision Thin Film Non-Magnetic Chip Resistor (up to 6 W)
FEATURES
•
•
•
•
•
•
High thermal conductivity aluminum nitride substrate
Power rating up to 6.0 W
Resistance range 2 to 30.1 k
Resistor tolerance to ± 0.1 %
TCR to ± 25 ppm/°C
Flame resistant UL 94 V-0
APPLICATIONS
• Power supplies
• Power switching
• Braking system
ADDITIONAL RESOURCES
3D 3D
3D Models
TYPICAL PERFORMANCE
PCNM series chip resistors are designed on aluminum
nitride ceramic substrates with enlarged backside
terminations to reduce the thermal resistance between the
topside resistor layer and the solder joint on the end users
circuit assembly.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the heat is critical to the overall
performance of the device.
ABSOLUTE
TCR
25
TOL.
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
SPECIFICATIONS
CONDITIONS
Nichrome
-
Material
2 to 30.1 k
-
TCR: Absolute
25 ppm/°C (standard) and 100 ppm/°C
-
Tolerance: Absolute
0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 %
-55 °C to +150 °C
0.5 W to 6.0 W (1)
Maximum at +70 °C
Resistance Range
Power Rating: Resistor
Stability: Absolute
R 1.0 %
1000 h at +70 °C
Voltage Coefficient
< 0.1 ppm/V
-
Working Voltage
75 V to 100 V
-
Operating Temperature Range
-55 °C to +155 °C
-
Storage Temperature Range
-55 °C to +155 °C
-
Noise
< -30 dB
-
Shelf Life Stability: Absolute
± 0.01 %
1 year at +25 °C
Note
(1) Dependant on component mounting by user
COMPONENT RATINGS
POWER RATING (mW)
WORKING VOLTAGE (V)
RESISTANCE RANGE ()
1206
CASE SIZE
2000 (1)
100
2 to 30.1K
2512
6000 (1)
100
2 to 30.1K
Notes
• 0603 and 0805 case size under engineering qualification
(1) Dependant on component mounting by user
Revision: 25-Oct-2019
Document Number: 60130
1
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
ENVIRONMENTAL TESTS
ENVIRONMENTAL TEST (1)
TEST LIMITS
TYPICAL VISHAY
PERFORMANCE
Resistance temperature characteristic
± 25 ppm/°C
± 15 ppm/°C
Maximum ambient temperature at rated wattage
+70 °C
+70 °C
Maximum ambient temperature at power derating
+150 °C
+150 °C
Thermal shock
± 0.25 %
± 0.10 %
Low temperature operation
± 0.25 %
± 0.01 %
Short time overload
± 0.5 %
± 0.2 %
High temperature exposure
± 0.2 %
± 0.05 %
Resistance to soldering heat
± 0.25 %
± 0.02 %
Moisture resistance
± 0.4 %
± 0.01 %
Life at +70 °C for 1000 h
± 1.00 %
± 0.02 %
Note
(1) Environmental testing was performed based on MIL-STD-202 Standard Test Methods
DIMENSIONS in inches
D
T
D
W
T
E
L
L
LENGTH
L
CASE SIZE
WIDTH
W
THICKNESS
T
MIN./MAX.
TOP PAD
D
BOTTOM PAD
E
1206
0.126 ± 0.008
0.063 ± 0.005
0.015 ± 0.003
0.020 + 0.005 / - 0.010
0.040 ± 0.005
2512
0.259 + 0.009 / - 0.015
0.124 ± 0.005
0.015 ± 0.003
0.020 ± 0.005
0.050 ± 0.005
LAND PATTERN DIMENSIONS in inches
1206 Land Pattern
2512 Land Pattern
0.2910
0.1730
0.0710
0.0220
0.1260
0.0755
0.1090
0.0910
STANDARD MATERIAL SPECIFICATIONS
Resistive element
Nichrome
Substrate material
Aluminum nitride
Terminations (tin / lead)
Terminations (lead (Pb)-free)
Revision: 25-Oct-2019
Tin / lead solder over copper
Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over copper
Document Number: 60130
2
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
PCAN1206 CHIP TEMP VS. APPLIED POWER
PCNM2512 CHIP TEMP VS. APPLIED POWER
12.0
16.0
10 Ω
14.0
1000 Ω
100 Ω
8.0
10 Ω
1000 Ω
10 000 Ω
100 Ω
12.0
Applied Power (W)
Applied Power (W)
10.0
6.0
4.0
10.0
8.0
6.0
4.0
2.0
0.0
2.0
70
150
Chip Surface Temperature Temperature (°C)
0.0
200
70
150
Chip Surface Temperature Temperature (°C)
200
Notes
• Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C
• Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full
range of power levels
• Thermal imaging and load life testing was conducted mounting one device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both
surfaces. Thermal vias on 50 mil centers were utilized for heat transfer between surfaces of the test card
DERATING CURVE
Percent of Rated Power
100
80
60
40
20
0
0
70
125
155
Ambient Temperature °C
Peak Power (W)
PULSE HANDLING RESULTS
100
100 Ω - 2512
10
100 Ω - 1206
1
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Duration (s)
Revision: 25-Oct-2019
Document Number: 60130
3
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCNM
www.vishay.com
Vishay Dale Thin Film
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: PCNM1206H1000BBT1
P
C
N
M
1
GLOBAL
MODEL
CASE
SIZE
TCR
CHARACTERISTIC
PCNM
1206
2512
E = ± 25 ppm/°C (1)
H = ± 50 ppm/°C (1)
K = ± 100 ppm/°C
2
0
6
H
1
0
0
0
RESISTANCE
TOLERANCE
TERMINATION
The first 3 digits are
significant figures and
the last digit specifies
the number of zeros
to follow.
“R” designates the
decimal point.
B = ± 0.1 % (1)
C = ± 0.25 % (1)
D = ± 0.5 % (1)
F = ± 1.0 %
G = ± 2.0 %
B = wraparound
Sn/Pb solder
w/ nickel barrier
S = wraparound
lead (Pb)-free
solder (e1)
RoHS compliant
G = wraparound Au,
over Ni (gold)
termination
epoxy bondable
RoHS compliant
(e4)
Example:
10R0 = 10
1000 = 100
B
B
T
1
PACKAGING
BS = BULK
100 min., 1 mult
WS = WAFFLE
100 min., 1 mult
W0 = 100 pc min. waffle,
1 mult
WI = 100 min., 1 mult
(package unit single lot
date code)
TAPE AND REEL
T0 = 100 min., 100 mult
T1 = 1000 min., 1000 mult
T3 = 300 min., 300 mult
T5 = 500 min., 500 mult
TF = Full reel
TS = 100 min., 1 mult
TI = 100 min., 1 mult
(item single lot date code)
TP = 100 min., 1 mult
(package unit single lot
date code)
Notes
(1) Available on 10 and higher; less than 10 100 ppm/°C and 1 % tolerance best
Revision: 25-Oct-2019
Document Number: 60130
4
For technical questions, contact: thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
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Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
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Revision: 09-Jul-2021
1
Document Number: 91000