PCNM2512E1502BST5

PCNM www.vishay.com Vishay Dale Thin Film High Power Aluminum Nitride, Wraparound Surface Mount, Precision Thin Film Non-Magnetic Chip Resistor (up to 6 W) FEATURES • • • • • • High thermal conductivity aluminum nitride substrate Power rating up to 6.0 W Resistance range 2  to 30.1 k Resistor tolerance to ± 0.1 % TCR to ± 25 ppm/°C Flame resistant UL 94 V-0 APPLICATIONS • Power supplies • Power switching • Braking system ADDITIONAL RESOURCES 3D 3D 3D Models TYPICAL PERFORMANCE PCNM series chip resistors are designed on aluminum nitride ceramic substrates with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users circuit assembly. Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the ability to remove the heat is critical to the overall performance of the device. ABSOLUTE TCR 25 TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Nichrome - Material 2  to 30.1 k - TCR: Absolute 25 ppm/°C (standard) and 100 ppm/°C - Tolerance: Absolute 0.1 %, 0.25 %, 0.5 %, 1.0 % and 5.0 % -55 °C to +150 °C 0.5 W to 6.0 W (1) Maximum at +70 °C Resistance Range Power Rating: Resistor Stability: Absolute R 1.0 % 1000 h at +70 °C Voltage Coefficient < 0.1 ppm/V - Working Voltage 75 V to 100 V - Operating Temperature Range -55 °C to +155 °C - Storage Temperature Range -55 °C to +155 °C - Noise < -30 dB - Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C Note (1) Dependant on component mounting by user COMPONENT RATINGS POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE () 1206 CASE SIZE 2000 (1) 100 2 to 30.1K 2512 6000 (1) 100 2 to 30.1K Notes • 0603 and 0805 case size under engineering qualification (1) Dependant on component mounting by user Revision: 25-Oct-2019 Document Number: 60130 1 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCNM www.vishay.com Vishay Dale Thin Film ENVIRONMENTAL TESTS ENVIRONMENTAL TEST (1) TEST LIMITS TYPICAL VISHAY PERFORMANCE Resistance temperature characteristic ± 25 ppm/°C ± 15 ppm/°C Maximum ambient temperature at rated wattage +70 °C +70 °C Maximum ambient temperature at power derating +150 °C +150 °C Thermal shock ± 0.25 % ± 0.10 % Low temperature operation ± 0.25 % ± 0.01 % Short time overload ± 0.5 % ± 0.2 % High temperature exposure ± 0.2 % ± 0.05 % Resistance to soldering heat ± 0.25 % ± 0.02 % Moisture resistance ± 0.4 % ± 0.01 % Life at +70 °C for 1000 h ± 1.00 % ± 0.02 % Note (1) Environmental testing was performed based on MIL-STD-202 Standard Test Methods DIMENSIONS in inches D T D W T E L L LENGTH L CASE SIZE WIDTH W THICKNESS T MIN./MAX. TOP PAD D BOTTOM PAD E 1206 0.126 ± 0.008 0.063 ± 0.005 0.015 ± 0.003 0.020 + 0.005 / - 0.010 0.040 ± 0.005 2512 0.259 + 0.009 / - 0.015 0.124 ± 0.005 0.015 ± 0.003 0.020 ± 0.005 0.050 ± 0.005 LAND PATTERN DIMENSIONS in inches 1206 Land Pattern 2512 Land Pattern 0.2910 0.1730 0.0710 0.0220 0.1260 0.0755 0.1090 0.0910 STANDARD MATERIAL SPECIFICATIONS Resistive element Nichrome Substrate material Aluminum nitride Terminations (tin / lead) Terminations (lead (Pb)-free) Revision: 25-Oct-2019 Tin / lead solder over copper Tin / silver / copper (Sn96.5 / Ag3.0 / Cu0.5) solder over copper Document Number: 60130 2 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCNM www.vishay.com Vishay Dale Thin Film PCAN1206 CHIP TEMP VS. APPLIED POWER PCNM2512 CHIP TEMP VS. APPLIED POWER 12.0 16.0 10 Ω 14.0 1000 Ω 100 Ω 8.0 10 Ω 1000 Ω 10 000 Ω 100 Ω 12.0 Applied Power (W) Applied Power (W) 10.0 6.0 4.0 10.0 8.0 6.0 4.0 2.0 0.0 2.0 70 150 Chip Surface Temperature Temperature (°C) 0.0 200 70 150 Chip Surface Temperature Temperature (°C) 200 Notes • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C • Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full range of power levels • Thermal imaging and load life testing was conducted mounting one device to a 1.6" x 3.7" test card with 3.5 mil copper plating on both surfaces. Thermal vias on 50 mil centers were utilized for heat transfer between surfaces of the test card DERATING CURVE Percent of Rated Power 100 80 60 40 20 0 0 70 125 155 Ambient Temperature °C Peak Power (W) PULSE HANDLING RESULTS 100 100 Ω - 2512 10 100 Ω - 1206 1 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Duration (s) Revision: 25-Oct-2019 Document Number: 60130 3 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PCNM www.vishay.com Vishay Dale Thin Film GLOBAL PART NUMBER INFORMATION New Global Part Numbering: PCNM1206H1000BBT1 P C N M 1 GLOBAL MODEL CASE SIZE TCR CHARACTERISTIC PCNM 1206 2512 E = ± 25 ppm/°C (1) H = ± 50 ppm/°C (1) K = ± 100 ppm/°C 2 0 6 H 1 0 0 0 RESISTANCE TOLERANCE TERMINATION The first 3 digits are significant figures and the last digit specifies the number of zeros to follow. “R” designates the decimal point. B = ± 0.1 % (1) C = ± 0.25 % (1) D = ± 0.5 % (1) F = ± 1.0 % G = ± 2.0 % B = wraparound  Sn/Pb solder w/ nickel barrier  S = wraparound lead (Pb)-free solder (e1) RoHS compliant  G = wraparound Au, over Ni (gold) termination epoxy bondable RoHS compliant (e4) Example: 10R0 = 10  1000 = 100  B B T 1 PACKAGING BS = BULK 100 min., 1 mult WS = WAFFLE 100 min., 1 mult W0 = 100 pc min. waffle, 1 mult WI = 100 min., 1 mult (package unit single lot date code)  TAPE AND REEL T0 = 100 min., 100 mult T1 = 1000 min., 1000 mult T3 = 300 min., 300 mult T5 = 500 min., 500 mult TF = Full reel TS = 100 min., 1 mult TI = 100 min., 1 mult (item single lot date code) TP = 100 min., 1 mult (package unit single lot date code) Notes (1) Available on 10  and higher; less than 10  100 ppm/°C and 1 % tolerance best Revision: 25-Oct-2019 Document Number: 60130 4 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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