PEP
www.vishay.com
Vishay Sfernice
High Precision Wraparound - Power Enhanced
Thin Film Chip Resistors
FEATURES
• Load life stability: 0.1 % typical (0.35 % max.)
at 2000 h / Pn / 70° C
• Very low noise < -35 dB and voltage coefficient
< 0.01 ppm/V
• Wide resistance range:
39 Ω to 900 kΩ depending on size
• Tolerances down to ± 0.05 %
LINKS TO ADDITIONAL RESOURCES
• Termination: thin film technology
3D 3D
• Pn: up to 1 W for 1206 size, without cooling under PCB
required
3D Models
• Sulfur resistant (per ASTM B809-95 humid vapor test)
INTRODUCTION
PEP series chip resistors are designed for high power
applications, low noise, superior stability, low temperature
coefficient of resistance, and low voltage coefficient. The
resistive thin film layer can withstand an established
temperature as high as 250 °C: hence, the restrictions are
mainly due to the robustness of terminations and solder
joints.
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
PEP series is recommended for customers who need to
switch to lower size devices, with the same power limits.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RESISTANCE
RANGE
Ω
RATED
POWER W
Pn (1)
RATED
POWER W
Pd (1)
LIMITING ELEMENT
VOLTAGE
V
TOLERANCE
± % (2)
TEMPERATURE
COEFFICIENT (2)
± ppm/°C
5, 10, 25, 50
PEP0402
0402
39 to 50K
0.125
0.063
50
0.05, 0.1, 0.5, 1
PEP0603
0603
39 to 108K
0.320
0.125
75
0.05, 0.1, 0.5, 1
5, 10, 25, 50
PEP0805
0805
39 to 240K
0.500
0.200
150
0.05, 0.1, 0.5, 1
5, 10, 25, 50
PEP1206
1206
39 to 900K
0.660 (3)
0.330
200
0.05, 0.1, 0.5, 1
5, 10, 25, 50
Notes
(1) P = nominal power: P = derated power intended to improve stability
n
d
(2) For ohmic range versus tolerance and TCR, see Best Tolerance and TCR vs. Ohmic Value” table
(3) P = 1 W if PEP1206 is mounted on alumina board
n
CLIMATIC SPECIFICATIONS
MECHANICAL SPECIFICATIONS
Operating temperature range
Substrate
Technology
-55 °C; +155 °C
PERFORMANCE VS. HUMID SULFUR VAPOR
Test conditions
Test results
Revision: 13-Oct-2021
50 °C ± 2 °C, 85 % ± 4 % RH,
exposure time 500 h
Resistance drift < (0.05 % R + 0.05 Ω),
no corrosion products observed
Film
Protection
Terminations
Alumina
Thin film
Nickel chromium based alloy
with mineral passivation
Epoxy + silicone
N type: tin silver over nickel barrier
G type: gold over nickel barrier
Document Number: 53083
1
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PEP
www.vishay.com
Vishay Sfernice
DIMENSIONS in millimeters (inches)
A
D
D
B
C
E
E
CASE SIZE
A
B
MAX. TOL.
+0.152 (+0.006)
MIN. TOL.
-0.152 (-0.006)
MAX. TOL.
+0.127 (+0.005)
MIN. TOL.
-0.127 (-0.005)
D/E
C
NOMINAL
NOMINAL
NOMINAL
TOLERANCE
0402
1.00 (0.039)
0.60 (0.024)
0.25 (0.010)
0.1 (0.004)
0603
1.52 (0.060)
0.85 (0.033)
0805
1.91 (0.075)
1.27 (0.050)
1206
3.06 (0.120)
1.60 (0.063)
Termination N:
0.5 (0.02) ± 0.127 (0.005)
0.38 (0.015)
Termination G:
0.4 (0.016) ± 0.051 (0.002)
0.13 (0.005)
0.40 (0.016)
SUGGESTED LAND PATTERN (to IPC-7351A)
Gmin.
Xmax.
Zmax.
CHIP SIZE
DIMENSIONS in millimeter (inches)
Zmax.
Gmin.
Xmax.
0402
1.55 (0.061)
0.15 (0.006)
0.73 (0.029)
0603
2.37 (0.093)
0.35 (0.014)
0.98 (0.039)
0805
2.76 (0.109)
0.74 (0.029)
1.40 (0.055)
1206
3.91 (0.154)
1.85 (0.073)
1.73 (0.068)
Axis Title
CODE (TEMPERATURE RANGE)
120
100
±5
Z (0 °C; +70 °C)
± 10
Y (-55 °C; +155 °C)
± 25
E (-55 °C; +155 °C)
± 50
H (-55 °C; +155 °C)
2nd line
Rated Power (%)
TCR (ppm/°C)
POWER DERATING CURVE
10000
1000
80
1st line
2nd line
TEMPERATURE COEFFICIENT
60
100
40
20
10
0
0
Revision: 13-Oct-2021
20
40
60 70 80
100 120 140 155
Ambient Temperature (°C)
Document Number: 53083
2
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PEP
www.vishay.com
Vishay Sfernice
BEST TOLERANCE AND TCR VS. OHMIC VALUE
STYLE
0402
0603
0805
1206
RANGE (Ω)
TOLERANCE (± %)
TCR CODE
39 to < 50
0.1, 0.5, 1
Z; Y; E; H
50 to 50K
0.05, 0.1, 0.5, 1
Z; Y; E; H
39 to < 50
0.1, 0.5, 1
Z; Y; E; H
50 to 108K
0.05, 0.1, 0.5, 1
Z; Y; E; H
39 to < 50
0.1, 0.5, 1
Z; Y; E; H
250 to 240K
0.05, 0.1, 0.5, 1
Z; Y; E; H
39 to < 50
0.1, 0.5, 1
Z; Y; E; H
250 to 900K
0.05, 0.1, 0.5, 1
Z; Y; E; H
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Marking
Option to order 0013:
Marking of ohmic value and tolerance:
0805 size: 3 digits marking (according to EIA-96)
1206 size: 4 digits marking (same codification than in the
ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
0805 size: 3 digits marking (according to EIA-96)
1206 size: 4 digits marking (same codification than in the
ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PACKAGING
PACKAGING RULES
ESD packaging available: waffle-pack, plastic tape and reel
(low conductivity), and paper tape and reel.
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code.
NUMBER OF PIECES PER PACKAGE
SIZE MOQ
WAFFLE PACK
2" × 2"
0402
0603
0805
TAPE AND REEL
MIN.
340
100
1206
100
140
TAPE
WIDTH
MAX.
5000
100
8 mm
4000
Tape and Reel
See Global Part Number Information to get the quantity
desired by tape.
PERFORMANCES
CONDITIONS
MIL OR CECC
REQUIREMENTS
TYPICAL VISHAY
PERFORMANCES
MIL-PRF-55342G
MIL-STD-202 F-Method 107 F
± 0.05 %
± 0.02 %
MIL-PRF-55342G
PARA 3.10.4.7.5
± 0.05 %
± 0.01 %
Resistance to solder heat
MIL-PRF-55342G
PARA 3.12, 4.7.7, 4.7.1.2
± 0.05 %
± 0.03 %
Resistance of terminations
(bending test)
CECC
± 0.05 %
± 0.01 %
MIL-PRF-55342G
2000 h Pn at 70 °C
MIL-STD-202 F-Method 108 A
± 0.5 %
± 0.1 %
TESTS
Thermal shock
Short time overload
Load life
Revision: 13-Oct-2021
Document Number: 53083
3
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PEP
www.vishay.com
Vishay Sfernice
STABILITY TEST RESULTS
PEP0402, 20 kΩ
PEP0402, 20 kΩ
10000
0.020
0.050
0.040
Maxi
1000
1st line
2nd line
0.005
Mini
0
-0.005
100
-0.010
2nd line
Resistance Drift (%)
0.030
Mean
0.010
-0.020
0
500
1000
1500
1000
0.010
Mean
0
-0.010
Mini
-0.020
-0.030
PEP0402 20 kΩ; applied power: 0.125 W
Test chamber temperature: 70 °C
Board: standard FR4
-0.015
Maxi
0.020
100
PEP0603 17.6 kΩ; applied power: 0.320 W
Test chamber temperature: 70 °C
Board: standard FR4
-0.040
10
2000
1st line
2nd line
0.015
2nd line
Resistance Drift (%)
10000
-0.050
0
500
Time (h)
1000
1500
10
2000
Time (h)
PEP0402, 20 kΩ
PEP0402, 20 kΩ
0.100
10000
10000
0.050
0.080
Maxi
1000
0.020
0
Mean
-0.020
100
Mini
-0.040
-0.060
-0.100
0
500
1000
1500
Mean
-0.010
PEP1206 40 kΩ; applied power: 0.660 W
Test chamber temperature: 70 °C
Board: standard FR4
-0.050
10
2000
100
Mini
-0.030
PEP0805 45 kΩ; applied power: 0.500 W
Test chamber temperature: 70 °C
Board: standard FR4
-0.080
1000
0.010
1st line
2nd line
0.040
2nd line
Resistance Drift (%)
0.030
Maxi
1st line
2nd line
2nd line
Resistance Drift (%)
0.060
0
500
1000
1500
10
2000
Time (h)
Time (h)
PEP0402, 20 kΩ
0.050
PEP1206 40 kΩ; applied power: 1 W
Test chamber temperature: 70 °C
Board: alumina
1000
0.010
1st line
2nd line
2nd line
Resistance Drift (%)
0.030
10000
Maxi
-0.010
Mean
-0.030
100
Mini
-0.050
0
500
1000
1500
10
2000
Time (h)
Note
• Note about stability test results: all parts reported by reflow with solder paste lead (Pb)-free SAC305 (Sn 96.5 % / Ag 3 % / Cu 0.5 %)
Revision: 13-Oct-2021
Document Number: 53083
4
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PEP
www.vishay.com
Vishay Sfernice
GLOBAL PART NUMBER INFORMATION
Global Part Numbering: PEP1206Y1003BGTB99
P
E
GLOBAL
MODEL
PEP
P
1
2
0
6
Y
1
0
0
3
B
G
T
B
9
9
SIZE
TCR
VALUE
TOLERANCE
TERMINATION
PACKAGING
OPTION
0402
0603
0805
1206
Z = ± 5 ppm
(0 °C; +70 °C)
Y = ± 10 ppm/°C
E = ± 25 ppm/°C
H = ± 50 ppm/°C
The first three digits are
significant figures and
the last digit specifies
the number of zeros to
follow, R designates
decimal point
W = ± 0.05 %
B = ± 0.1 %
D = ± 0.5 %
F=±1%
N = tin silver
over gold barrier
G = gold over
nickel barrier
For more
information see
“Codification of
Packaging”
table
For more
information
see
“Codification
of options on
two digits”
table
Examples:
1000 = 100 Ω
3901 = 3900 Ω
1004 = 1 MΩ
Leave blank
if no option
CODIFICATION OF OPTIONS ON TWO DIGITS
OPTION
..
0099
0100
0101
0102
0103
0104
0105
..
0124
0125
0126
0127
0128
..
0320
0321
0322
0323
0324
0325
..
OPTION 2 DIGITS
..
99
0A
0A
0C
0D
0E
0F
..
0Y
0Z
1A
1B
1C
..
8M
8N
8O
8P
8Q
8R
..
CODIFICATION OF SIZES
CODE 18
9
C
D
H
CODE 40
0402
0603
0805
1206
CODIFICATION OF PACKAGING
CODE 18
WAFFLE PACK
W
WA
PLASTIC TAPE (in standard for all sizes)
T
TA
TB
TC
TD
TE
TF
Revision: 13-Oct-2021
PACKAGING
100 min., 1 mult.
100 min., 100 mult. (available only on size 1206)
100 min., 1 mult.
100 min., 100 mult.
250 min., 250 mult.
500 min., 500 mult.
1000 min., 1000 mult.
2500 min., 2500 mult.
Full tape (quantity depending on size of chips)
Document Number: 53083
5
For technical questions, contact: sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 01-Jan-2022
1
Document Number: 91000