PHP00805E1930BST1

PHP www.vishay.com Vishay Dale Thin Film High Power Thin Film Wraparound Chip Resistor FEATURES • High purity ceramic substrate • Power rating to 2.5 W • Resistance range 10 Ω to 30.1 kΩ • Resistor tolerance to ± 0.1 % • TCR to ± 25 ppm/°C • Flame resistant UL 94 V-0 LINKS TO ADDITIONAL RESOURCES APPLICATIONS 3D 3D 3D Models • Power supplies • Power switching Infographics PHP series chip resistors are designed with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users circuit board. Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the ability to remove the generated heat is critical to the overall performance of the device. • Braking system • Test and measurement equipment • Motor deflection circuits TYPICAL PERFORMANCE ABSOLUTE TCR 25 TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Nichrome - 10 Ω to 30.1 kΩ - 25 ppm/°C, 50 ppm/°C (standard) and, 100 ppm/°C -55 °C to +125 °C Material Resistance Range TCR: Absolute Tolerance: Absolute Power Rating: Resistor Stability: Absolute Stability: Ratio Voltage Coefficient Working Voltage 0.1 %, 0.5 %, 1.0 % and, 5.0 % +25 °C 0.375 W to 2.5 W (1) Maximum at +70 °C ΔR 0.1 % 2000 h at +70 °C Not applicable - < 0.1 ppm/V - 75 V to 200 V - Operating Temperature Range -55 °C to +155 °C - Storage Temperature Range -55 °C to +155 °C - Noise < -30 dB - Shelf Life Stability: Absolute ± 0.01 % 1 year at +25 °C COMPONENT RATINGS POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE (Ω) 0603 CASE SIZE 375 (1) 75 10 to 30.1K 0805 625 (1) 100 10 to 30.1K 1206 1000 (1) 200 10 to 30.1K 2512 2500 (1) 200 10 to 30.1K Note (1) Dependent on component mounting by user Revision: 08-Mar-2021 Document Number: 60076 1 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP www.vishay.com Vishay Dale Thin Film ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements) ENVIRONMENTAL TEST LIMITS MIL-PRF-55342 CHARACTERISTIC “E” TYPICAL VISHAY PERFORMANCE ± 25 ppm/°C ± 15 ppm/°C Resistance Temperature Characteristic Maximum Ambient Temperature at Rated Wattage +70 °C +70 °C Maximum Ambient Temperature at Power Derating +150 °C +150 °C Thermal Shock ± 0.1 % ± 0.04 % Low Temperature Operation ± 0.1 % ± 0.001 % Short Time Overload ± 0.1 % ± 0.003 % High Temperature Exposure ± 0.1 % ± 0.030 % Resistance to Soldering Heat ± 0.2 % ± 0.007 % Moisture Resistance ± 0.2 % ± 0.002 % Life at +70 °C for 2000 h ± 0.5 % ± 0.100 % DIMENSIONS in inches D W T E L LENGTH WIDTH W (± 0.005) THICKNESS MIN./MAX. TOP PAD D (± 0.005) BOTTOM PAD E (± 0.005) 0603 0.064 ± 0.006 0805 0.080 ± 0.006 0.032 0.020 max. 0.012 0.021 0.050 0.015/0.033 0.016 1206 0.025 0.126 ± 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 2512 0.040 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050 CASE SIZE LAND PATTERN DIMENSIONS in inches 0603 Land Pattern 1206 Land Pattern 0.0920 0.1730 0.0340 0.0710 0.0140 0.0390 0.0220 0.0755 0805 Land Pattern 2512 Land Pattern 0.2910 0.1050 0.0520 0.1260 0.0200 0.0425 0.1090 0.0910 Revision: 08-Mar-2021 Document Number: 60076 2 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP www.vishay.com Vishay Dale Thin Film STANDARD MATERIAL SPECIFICATIONS Resistive Element Nichrome Substrate Material Alumina (Al2O3) Terminations (Tin/Lead) Tin/lead solder over nickel barrier Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 0603 - 100 Ω 0603 - 5 kΩ 0603 - 18.8 kΩ 70 PHP CHIP TEMP. VS. APPLIED POWER Applied Power (W) Applied Power (W) PHP CHIP TEMP. VS. APPLIED POWER 150 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 200 70 Chip Surface Temperature (°C) Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 1206 - 100 Ω 1206 - 5 kΩ 1206 - 10 kΩ 70 150 Revision: 08-Mar-2021 200 Note • Chip surface temperature measured using FLIR SC645 thermal imaging system with an approximate test card surface temperature of 85 °C PHP CHIP TEMP. VS. APPLIED POWER 10.00 9.00 8.00 7.00 6.00 5.00 4.00 3.00 2.00 1.00 0.00 2512 - 10 Ω 2512 - 10 kΩ 2512 - 30 kΩ 70 200 Chip Surface Temperature (°C) Notes • Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface temperature of 25 °C • Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 °C over the full range of power levels • Thermal imaging and load life testing was conducted mounting one device to 2" x 3" test cards with 2.5 mil copper plating on both surfaces. Thermal vias on 120 mil centers were utilized for heat transfer between surfaces of the test card 150 Chip Surface Temperature (°C) Applied Power (W) Applied Power (W) PHP CHIP TEMP. VS. APPLIED POWER 0805 - 100 Ω 0805 - 5 kΩ 0805 - 20 kΩ 150 200 Chip Surface Temperature (°C) Notes • Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface temperature of 25 °C Case Size Resistance Value Temperature 2512 2512 2512 Up to 10 Ω Up to 10 kΩ Up to 30 kΩ 70 2.44 1.81 1.87 150 6.82 4.89 5.19 200 9.33 6.63 7.09 Power (W) Document Number: 60076 3 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP www.vishay.com Vishay Dale Thin Film SINGLE PULSE CURVES Pulse Power (W) 1000 100 Ω - 2512 100 Ω - 1206 100 10 100 Ω - 0805 100 Ω - 0603 1 0.1 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Duration (s) DERATING CURVE Percent of Rated Power 100 80 60 40 20 0 0 70 125 155 Ambient Temperature °C GLOBAL PART NUMBER INFORMATION P H P GLOBAL MODEL SUBSTRATE PHP 0 = alumina 0 CASE SIZE 0603 0805 1206 2512 1 2 0 6 1 TCR RESISTANCE TOLERANCE E= ± 25 ppm/°C H= ± 50 ppm/°C K= ± 100 ppm/°C The first 3 digits are significant figures and the last digit specifies the number of zeros to follow. “R” designates the decimal point. B = ± 0.1 % D = ± 0.5 % F = ± 1.0 % G = ± 2.0 % J = ± 5.0 % Example: 10R0 = 10 Ω 1000 = 100 Ω 1001 = 1 kΩ Revision: 08-Mar-2021 E 0 0 2 B TERMINATION B = wraparound Sn/Pb solder w/nickel barrier S = wraparound lead (Pb)-free solder SAC-305 RoHS-compliant - e1 B T 1 PACKAGING BS = BULK 100 min., 1 mult. WS = WAFFLE 100 min., 1 mult. WI = WAFFLE (item single lot day code) 100 min., 1 mult. TAPE AND REEL T1 = 1000 min., 1000 mult. T3 = 300 min., 300 mult. T5 = 500 min., 500 mult. TF = full reel TS = 100 min., 1 mult. TI = 100 min., 1 mult. (item single lot date code) TP = 100 min., 1 mult. (package unit single lot date) Document Number: 60076 4 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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