PTCTT95R250GTE

PTCTT Series www.vishay.com Vishay BCcomponents TWIN Vertical SMD PTC Thermistors For Telecom Overload Protection FEATURES • Very small footprint, allowing to increase the number of lines per PCB • Matched pairs in one component, significantly reducing the assembly time • Narrow tracking between the 2 PTC’s over a wide temperature range (matching at 85 °C:  2 x matching at 25 °C) • Limited height and weight, used on high speed pick-andplace circuit assembly • Flat pick-up ceramic area for easy placement • Small ceramics for faster response time • Thermal coupled PTC’s for enhanced protection • Small and large pitch available • Compliant with the enhanced level requirements of ITU - K20-21-45 edition 2003 • Suitable for lead (Pb)-bearing and lead (Pb)-free reflow soldering • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 QUICK REFERENCE DATA PARAMETER VALUE UNIT 10 to 50  105 to 130 240 2.5 to 8.0 °C VRMS Operating temperature range at Vmax. -40 to 85 °C Maximum trip time at 1 A 1.2 to 4.0 ~ 1.3 s Resistance value at 25 °C Switching temperature Maximum voltage (RMS) Maximum overload current Weight A APPLICATIONS Over-temperature/over-load protection: • Telecom - Telecommunications infrastructure - PABX - Set-top Box (S.B.) g DESCRIPTION The component consists of two high performance PTC ceramics mounted together on an alumina spacer cover and with 4 lead (Pb)-free tin plated contacts. The terminations are joined to the Ag plated ceramics by a high melting solder. MARKING • All TWIN Vertical SMD PTC’s are marked with the last 3-digits of the type number (BCxxx) and a date code (YYWW) MOUNTING A flat pick-up area of 30 mm2 and low weight allows for fast placement. No excessive solder paste should be used as no solder or flux can reach the ceramic body during reflow soldering. Not suitable for bismuth containing solder. Typical soldering 235 °C, duration: 5 s (Lead (Pb)-bearing) 245 °C, duration: 5 s (Lead (Pb)-free) Resistance to soldering heat 260 °C, duration: 10 s max. ELECTRICAL DATA It (mA) MAX. TRIP-TIME at 1 A (s) Imax. at Vmax. (A) Ires (2 PIECES POWERED) at Vmax. (mA) 55 300 4.0 4.0 12.0 60 40 200 2.0 8.0 12.0 60 40 200 2.0 4.0 12.0 100 60 40 200 1.5 4.0 12.0 90 50 35 190 1.2 2.5 12.0 Int at R25 ± 20 % () MATCHING ( Vmax. (VRMS) 10 0.5 240 20 0.5 25 0.5 35 50 25 °C (mA) 70 °C (mA) 85 °C (mA) 140 85 240 90 240 100 1.0 240 1.0 240 Note • All data is measured at 25 °C unless otherwise specified Revision:03-Mar-14 Document Number: 29088 1 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PTCTT Series www.vishay.com Vishay BCcomponents ORDERING INFORMATION SAP CODING R25 ± 20 % () SMALL PITCH LARGE PITCH 10 PTCTT95R100GTE 20 PTCTT95R200GTE 25 PTCTT95R250GTE PTCTT95R100GTELAR PTCTT95R200GTELAR PTCTT95R250GTELAR PTCTT95R350GTELAR PTCTT95R500GTELAR 35 PTCTT95R350GTE 50 PTCTT95R500GTE ELECTRICAL CHARACTERISTICS Trip current vs Tamb Typical 3.5 3.0 PTC will trip (1 PTC powered) Current deviation factor 2.5 2.0 1.5 ITRIP 1.0 PTC will not trip (2 PTC's powered) 0.5 0 - 40 PTC OUTLINES - 20 0 IHOLD 20 40 Tamb(°C) 80 60 DIMENSIONS in millimeters X (4x) L 0.3 T H d S BCXXX YYWW P t 100 P1 P2 0.1 b K1 K2  FOOTPRINT b1 L T H b b1 S d t P P1 P2 X K1 K2 SMALL PITCH 9.0 ± 0.1 7.2 ± 0.25 6.9 ± 0.25 1.5 ± 0.1 0.9 ± 0.15 1.25 ± 0.15 0.22 ± 0.025 2.3 ± 0.1 6.5 ± 0.5 2.55 ± 0.15 2.2 ± 0.1 0.5 ± 0.2 6.0 ± 0.5 5.0 ± 0.5 LARGE PITCH 9.0 ± 0.1 8.4 ± 0.25 6.9 ± 0.25 1.5 ± 0.1 0.9 ± 0.15 1.25 ± 0.15 0.22 ± 0.025 2.3 ± 0.1 6.5 ± 0.5 2.55 ± 0.15 3.45 ± 0.15 0.5 ± 0.2 7.2 ± 0.5 5.0 ± 0.5 RECOMMENDED FOOTPRINT in millimeters D E A B C Revision:03-Mar-14 A B C D E SMALL PITCH 2.0 2.4 3.8 3.8 2.7 LARGE PITCH 2.0 2.4 5.0 4.0 1.4 Document Number: 29088 2 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PTCTT Series www.vishay.com Vishay BCcomponents PACKAGING Tape specifications All tape and reel specifications are in accordance with IEC 60 286-3. Carrier tape material is non-conductive polystyrene or polycarbonate. P0 Blister tape T K0 D0 P2 E F BCXXX YYWW cover tape T1 W B0 P1 T2 A0 D1 Cumulative pitch error: 0.2 mm over 10 pitches Cumulative tolerance over 10 holes: ± 0.2 mm direction of unreeling DIMENSIONS OF BLISTER TAPE in millimeters A0 B0 K0 W E F D0 SMALL PITCH LARGE PITCH 7.2 ± 0.1 9.3 ± 0.1 7.2 ± 0.1 16.0 ± 0.3 1.75 ± 0.1 7.5 ± 0.1 1.5 + 0.1 8.4 ± 0.1 9.3 ± 0.1 7.2 ± 0.1 16.0 ± 0.3 1.75 ± 0.1 7.5 ± 0.1 1.5 + 0.1 D1 P0 P1 P2 T T1 T2 SMALL PITCH LARGE PITCH 1.5 + 0.1 4.0 ± 0.1 12.0 ± 0.1 2.0 ± 0.1 0.5 ± 0.05 0.05 7.8 max. 1.5 + 0.1 4.0 ± 0.1 12.0 ± 0.1 2.0 ± 0.1 0.5 ± 0.05 0.05 7.8 max. REEL SPECIFICATIONS in millimeters Reel W2 N A 12.75 +0.15 0 20.5 W1 REEL DIMENSIONS in millimeters UNITS PER REEL TAPE WIDTH A N W1 W2 MAX. 1 000 16 380 64 16.4 20.4 Note • Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres Revision:03-Mar-14 Document Number: 29088 3 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PTCTT Series www.vishay.com Vishay BCcomponents SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020. Soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering 300 10 s T (°C) 260 °C ≈ 245 °C 250 215 °C 200 180 °C 150 10 s 40 s 130 °C 100 2 K/s 50 0 0 Typical values (solid line) Process limits (dotted lines) 50 100 150 250 200 t (s) Vapour phase soldering 300 T (°C) 20 to 40 s 250 215 °C 200 180 °C 150 forced cooling 130 °C external preheating 100 °C 100 internal preheating, e.g. by infrared, max. 2 K/s 50 0 0 50 100 150 250 200 Typical values (solid line) Process limits (dotted line) t (s)  HANDLING PRECAUTIONS Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behaviour at high temperatures. Handling forces applied to the component should be limited to 5 N in any condition. Revision:03-Mar-14 Document Number: 29088 4 For technical questions, contact: nlr@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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