RCG040222K0JNED

RCG e3 www.vishay.com Vishay Green Thick Film Chip Resistors FEATURES • Vishay Green resistor - does not use RoHS exemptions • Stability at different environmental conditions ΔR/R ≤ 1 % (1000 h rated power at 70 °C) • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS LINKS TO ADDITIONAL RESOURCES • Consumer 3D 3D • Connectivity 3D Models RCG e3 series Vishay Green thick film chip resistors are the perfect choice for commercial applications where fully RoHS-compliant products are required. Typical applications include consumer and connectivity applications. TECHNICAL SPECIFICATIONS DESCRIPTION RCG0402 e3 RCG0603 e3 RCG0805 e3 RCG1206 e3 0402 0603 0805 1206 RR1005M RR1608M RR2012M RR3216M Imperial size Metric size code 1 Ω to 10 MΩ; jumper (0 Ω) Resistance range Resistance tolerance ± 5 %; ± 1 %; ± 0.5 % Temperature coefficient ± 200 ppm/K; ± 150 ppm/K; ± 100 ppm/K Rated dissipation, P70 (1) Operating voltage, Umax. ACRMS/DC 0.063 W 0.10 W 50 V 75 V Permissible film temperature, ϑF max. (1) 0.125 W 0.25 W 150 V 200 V 200 V 300 V 155 °C Operating temperature range -55 °C to +155 °C Max. resistance change at P70 for resistance range, IΔR/RI after: ≤2% 1000 h Permissible voltage against ambient (insulation): 1 min, Uins 75 V 100 V Note (1) Please refer to “Application Information” below APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 04-Jul-2022 Document Number: 20047 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCG e3 www.vishay.com Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR ± 200 ppm/K TOLERANCE ±5% ±1% ± 0.5 % ±1% ± 0.5 % ≤ 20 mΩ ±5% ±1% ± 0.5 % ± 150 ppm/K RCG0402 e3 ± 100 ppm/K Jumper, Imax. = 1.5 A ± 200 ppm/K ± 100 ppm/K RCG0603 e3 Jumper, Imax. = 2 A ± 200 ppm/K Jumper, Imax. = 2.5 A ± 200 ppm/K ± 100 ppm/K RCG1206 e3 Jumper, Imax. = 3.5 A E-SERIES E24 1 Ω to 147 Ω E24; E96 150 Ω to 10 MΩ 0Ω E24 1 Ω to 10 MΩ ≤ 20 mΩ ±5% ±1% ± 0.5 % ≤ 20 mΩ ±5% ±1% ± 0.5 % ≤ 20 mΩ ± 100 ppm/K RCG0805 e3 RESISTANCE 1 Ω to 10 MΩ E24; E96 0Ω E24 1 Ω to 10 MΩ E24; E96 0Ω E24 1 Ω to 10 MΩ E24; E96 0Ω - Note • The temperature coefficient of resistance (TCR) is not specified for 0 Ω jumper PACKAGING TYPE / SIZE RCG0402 e3 RCG0603 e3 RCG0805 e3 RCG1206 e3 CODE QUANTITY ED EE EI ED EL EE EA EB EC EA EB EC EA EB EC 10 000 50 000 5000 10 000 20 000 50 000 5000 10 000 20 000 5000 10 000 20 000 5000 10 000 20 000 PACKAGING STYLE WIDTH PITCH 8 mm 2 mm PACKAGING DIMENSIONS 180 mm / 7" 330 mm / 13" 180 mm / 7" 180 mm / 7" 285 mm / 11.25" 330 mm / 13" 180 mm / 7" 285 mm / 11.25" 330 mm / 13" 180 mm / 7" 285 mm / 11.25" 330 mm / 13" 180 mm / 7" 285 mm / 11.25" 330 mm / 13" 2 mm 8 mm Paper tape acc. to IEC 60286-3, Type 1a 4 mm 8 mm 4 mm 8 mm 4 mm PART NUMBER AND PRODUCT DESCRIPTION Part Number: RCG080510K0FKEA R C TYPE / SIZE RCG0402 RCG0603 RCG0805 RCG1206 G 0 8 0 RESISTANCE R = decimal K = thousand M = million 0000 = 0 Ω jumper 5 1 0 K 0 F K E TOLERANCE D = ± 0.5 % F = ± 1.0 % J = ± 5.0 % Z = jumper TCR K = ± 100 ppm/K L = ± 150 ppm/K N = ± 200 ppm/K 0 = jumper PACKAGING EA, EB, EC, ED, EE, EI, EL A Product Description: RCG0805 100 10K 1 % EA RCG0805 100 10K 1% EA TYPE / SIZE RCG0402 RCG0603 RCG0805 RCG1206 TCR ± 100 ppm/K ± 150 ppm/K ± 200 ppm/K RESISTANCE 10R = 10 Ω 10K = 10 kΩ 1M = 1 MΩ 0R0 = jumper TOLERANCE ± 0.5 % ±1% ±5% PACKAGING EA, EB, EC, ED, EE, EI, EL Revision: 04-Jul-2022 Document Number: 20047 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCG e3 www.vishay.com Vishay DESCRIPTION MATERIALS Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A Vishay Green cermet film layer and a glass-over are deposited on a high grade (Al2O3) ceramic substrate with its prepared inner Vishay Green contacts. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a. Vishay acknowledges the following systems for the regulation of hazardous substances: ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are fully RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. APPROVALS Where applicable, the resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1, EN 60115-8 and the variety of environmental test procedures of the IEC 60068 (1) series. RELATED PRODUCTS For RoHS-compliant thick film resistors please refer to “D/CRCW e3, Standard Thick Film Chip Resistors” datasheet (www.vishay.com/doc?20035). For RoHS-compliant thick film chip resistors with medium power rating and operating voltage, please refer to “RCC e3 Medium Power Thick Film Chip Resistors” datasheet (www.vishay.com/docs?20066). Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 04-Jul-2022 Document Number: 20047 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCG e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE Derating Axis Title RCG1206 RCG0805 RCG0603 RCG0402 0.2 1000 1st line 2nd line 2nd line P - Power Dissipation (W) 10000 100 10 0 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 ϑamb - Ambient Temperature (°C) 80 90 100 110 120 130 140 150 160 VISHAY GREEN REQUIREMENTS SUBSTANCES CONCENTRATION LIMIT Lead (Pb) < 1000 ppm Mercury (Hg) < 1000 ppm Cadmium (Cd) < 100 ppm Hexavalent chronium < 1000 ppm Polybrominated biphenyl (PBB) < 1000 ppm Polybrominated diphenyl ether (PBDE) < 1000 ppm Bromine (Br) < 900 ppm Chlorine (Cl) < 900 ppm Sum of bromine and chlorine ≤ 1500 ppm Antimony (Sb) < 900 ppm Red phosphorous < 100 ppm Notes • No exemptions (e.g. Pb in glass) may be applied to any substances or application for the “Vishay Green” category • All concentration levels are based on homogenous materials TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the following specifications: The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5201-1. EN 60115-1, generic specification The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: EN 60115-8, sectional specification EN 140401-802, detail specification IEC 60068-2-xx, test methods The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. Revision: 04-Jul-2022 Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The components are mounted for testing on boards in accordance with EN 60115-8, 2.4.2 unless otherwise specified. Document Number: 20047 4 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCG e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 (1) TEST METHOD REQUIREMENTS PERMISSIBLE CHANGE (ΔR) STABILITY CLASS 1 STABILITY CLASS 2 OR BETTER OR BETTER PROCEDURE TEST Stability for product types: 1 Ω to 10 MΩ RCG e3 4.5 - Resistance 4.8 - Temperature coefficient 4.25.1 - Endurance at 70 °C Endurance at upper category temperature Damp heat, steady state Climatic sequence: Dry heat Damp heat, cyclic Cold Low air pressure Damp heat, cyclic DC load Cold Rapid change of temperature 4.25.3 - 4.24 4.23 4.23.2 4.23.3 4.23.4 4.23.5 4.23.6 4.23.7 - 78 (Cab) 2 (Ba) 30 (Db) 1 (Ab) 13 (M) 30 (Db) 1 (Aa) 4.19 14 (Na) 4.13 - Short time overload 4.27 - Single pulse high voltage overload 4.39 - Periodic electric overload 4.38 - Electrostatic discharge (human body model) 4.22 6 (Fc) Vibration 4.17 58 (Td) Solderability 4.18 58 (Td) 4.29 45 (XA) 4.32 21 (Uu3) Shear (adhesion) 4.33 21 (Uu1) Substrate bending 4.7 - 4.35 - Voltage proof Flammability, needle flame test Resistance to soldering heat Component solvent resistance At (20 / -55 / 20) °C and (20 / 125 / 20) °C U = P 70 x R ≤ Umax.; 1.5 h on; 0.5 h off 70 °C; 1000 h ± 0.5 %; ± 1 % ± 100 ppm/K; ± 150 ppm/K ±5% ± 500 ppm/K ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 155 °C; 1000 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) (40 ± 2) °C; (93 ± 3) % RH; 56 days ± (1 % R + 0.05 Ω) ± (1 % R + 0.1 Ω) 125 °C; 16 h 55 °C; 24 h; ≥ 90 % RH; 1 cycle -55 °C; 2 h ± (1 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) 8.5 kPa; 2 h; (25 ± 10) °C 55 °C; 5 days; > 90 % RH; 5 cycles U = P 70 x R ≤ Umax.; 1 min -55 °C; 2 h ± (0.5 % R + 0.1 Ω) 30 min. at -55 °C and 30 min. at 125 °C; ± (1 % R + 0.05 Ω) 1000 cycles U = 2.5 x P 70 x R ≤ 2 x Umax.; ± (2 % R + 0.05 Ω) whichever is the less severe; 5 s Severity no. 4: U = 10 x P 70 x R or U ≤ 2 x Umax.; ± (1 % R + 0.05 Ω) whichever is the less severe; 10 pulses 10 μs / 700 μs U = 15 x P 70 x R ≤ 2 x Umax.; whichever is the less severe; ± (1 % R + 0.05 Ω) 0.1 s on; 2.5 s off; 1000 cycles IEC 61340-3-1 (1); ± (1 % R + 0.05 Ω) 3 positive + 3 negative discharges; ESD voltage acc. to size Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) no resonance; no visible damage no visible damage amplitude ≤ 1.5 mm or ≤ 200 m/s2; 7.5 h Solder bath method, Sn60Pb40; non-activated flux; (235 ± 5) °C; (2 ± 0.2) s Good tinning (≥ 95 % covered); Solder bath method, no visible damage Sn96.5Ag3Cu0.5 or Sn99.3Cu0.7 non-activated flux; (245 ± 5) °C or (250 ± 5) °C; (3 ± 0.3) s Solder bath method; ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) (260 ± 5) °C; (10 ± 1) s Isopropyl alcohol; No visible damage 50 °C; method 2 RCG0402 e3 and RCG0603 e3: 9 N No visible damage RCG0805 e3 and RCG1206 e3: 45 N No visible damage, no open circuit in bent position Depth 2 mm; 3 times ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) No flashover or breakdown U = 1.4 x Uins; 60 s IEC 60695-11-5 (1); No burning after 30 s 10 s Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 04-Jul-2022 Document Number: 20047 5 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCG e3 www.vishay.com Vishay DIMENSIONS L T2 W H T1 DIMENSIONS AND MASS TYPE / SIZE L (mm) W (mm) H (mm) T1 (mm) T2 (mm) MASS (mg) RCG0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.10 0.2 ± 0.10 0.65 RCG0603 e3 1.55 + 0.10 / - 0.05 0.85 ± 0.1 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2 RCG0805 e3 2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5 RCG1206 e3 3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.05 0.45 ± 0.20 0.4 ± 0.20 10 SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) RCG0402 e3 - - - - 0.45 0.60 0.60 1.65 RCG0603 e3 0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.25 RCG0805 e3 0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90 RCG1206 e3 1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60 Note • The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still, the given solder pad dimensions will be found adequate for most general applications Revision: 04-Jul-2022 Document Number: 20047 6 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2023 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2023 1 Document Number: 91000