RCS1206270RFKEA

RCS e3 www.vishay.com Vishay Anti-Surge, High Power Thick Film Chip Resistors FEATURES • Excellent surge pulse capability • Superior ESD surge characteristics • High power rating • AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • Automotive • Industrial • Telecommunications The anti-surge thick film chip resistor series combines a significantly higher power rating and pulse load performance as compared to standard chip resistors. • Medical TECHNICAL SPECIFICATIONS DESCRIPTION RCS0402 e3 Imperial size Metric size code RCS0603 e3 RCS0805 e3 RCS1206 e3 0402 0603 0805 1206 RR1005M RR1608M RR2012M RR3126M 1  to 10 M; jumper (0  Resistance range Resistance tolerance ± 5 %; ± 1 %; ± 0.5 % Temperature coefficient ± 200 ppm/K; ± 100 ppm/K Rated dissipation, P70 (1) 0.2 W 0.25 W 0.4 W 0.5 W Operating voltage, Umax. ACRMS/DC 50 V 75 V 150 V 200 V 200 V 300 V Permissible film temperature, F max. (1) 155 °C Operating temperature range -55 °C to +155 °C Max. resistance change at P70 for resistance range, |R/R| after: 1000 h 1.0 % 8000 h 2.0 % Permissible voltage against ambient (insulation): 1 min, Uins 75 V 100 V Note (1) Please refer to APPLICATION INFORMATION below APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 07-Mar-2019 Document Number: 20065 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCS e3 www.vishay.com Vishay TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE RCS0402 e3 RCS0603 e3 RCS0805 e3 RCS1206 e3 TCR TOLERANCE RESISTANCE E-SERIES ± 200 ppm/K ±5% 1  to 10 M E24 ± 100 ppm/K ±1% 1  to 10 M E24; E96 ± 100 ppm/K ± 0.5 % 1  to 10 M E24; E96 Jumper, Imax. = 3 A 20 m 0 - ± 200 ppm/K ±5% 1  to 10 M E24 ± 100 ppm/K ±1% 1  to 10 M E24; E96 ± 100 ppm/K ± 0.5 % 1  to 10 M E24; E96 Jumper, Imax. = 3.5 A 20 m 0 - ± 200 ppm/K ±5% 1  to 10 M E24 ± 100 ppm/K ±1% 1  to 10 M E24; E96 ± 100 ppm/K ± 0.5 % 1  to 10 M E24; E96 Jumper, Imax. = 4 A 20 m 0 - ± 200 ppm/K ±5% 1  to 10 M E24 ± 100 ppm/K ±1% 1  to 10 M E24; E96 ± 100 ppm/K ± 0.5 % 1  to 10 M E24; E96 Jumper, Imax. = 5 A 20 m 0 - Note • The temperature coefficient of resistance (TCR) is not specified for 0  jumpers PACKAGING TYPE / SIZE RCS0402 e3 RCS0603 e3 RCS0805 e3 RCS1206 e3 Revision: 07-Mar-2019 CODE QUANTITY ED = ET7 10 000 EE = EF4 50 000 EI = ET2 5000 ED = ET3 10 000 EL = ET4 20 000 EE = ET8 50 000 PACKAGING STYLE WIDTH PITCH 2 mm PACKAGING DIMENSIONS Ø 180 mm/7" Ø 330 mm/13" Ø 180 mm/7" 2 mm Ø 180 mm/7" Ø 285 mm/11.25" Ø 330 mm/13" EA = ET1 5000 EB = ET5 10 000 Ø 180 mm/7" EC = ET6 20 000 Ø 330 mm/13" EA = ET1 5000 Ø 180 mm/7" EB = ET5 10 000 EC = ET6 20 000 Ø 330 mm/13" EA = ET1 5000 Ø 180 mm/7" EB = ET5 10 000 EC = ET6 20 000 Paper tape according to IEC 60286-3, Type 1a 8 mm 4 mm 4 mm 4 mm Ø 285 mm/11.25" Ø 285 mm/11.25" Ø 285 mm/11.25" Ø 330 mm/13" Document Number: 20065 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCS e3 www.vishay.com Vishay PART NUMBER AND PRODUCT DESCRIPTION Part Number: RCS0805100RFKEC Part Number: RCS08050000Z0EC R C S 0 8 0 5 1 0 0 R F K E TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING RCS0402 RCS0603 RCS0805 RCS1206 R = decimal K = thousand M = million 0000 = jumper D = ± 0.5 % F = ± 1.0 % J = ± 5.0 % Z = jumper K = ± 100 ppm/K N = ± 200 ppm/K 0 = jumper EA, EB, EC, ED, EE, EI, EL C Product Description: RCS0805 100 100R 1 % ET6 e3 Product Description: RCS0805 0R0 ET6 e3 RCS0805 100 100R 1% ET6 e3 TYPE / SIZE TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE RCS0402 RCS0603 RCS0805 RCS1206 ± 100 ppm/K ± 200 ppm/K 10R = 10  100R = 100  10K = 10 k 1M0 = 1 M 0R0 = jumper ± 0.5 % ± 1.0 % ± 5.0 % ET1, ET2, ET3, ET4, ET5, ET6, ET7, ET8, EF4 e3 = pure tin termination finish Revision: 07-Mar-2019 Document Number: 20065 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCS e3 www.vishay.com DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A cermet film layer and a glass-over are deposited on a high grade (AI2O3) ceramic substrate with its prepared inner contacts on both sides. A special laser is used to achieve the target value and the desired power dissipation performance by smoothly fine trimming the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 Type 1a (1). ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1. The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters and aqueous solutions. The suitability of conformal coatings potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. The resistors are RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. MATERIALS Vishay acknowledges the following systems for the regulation of hazardous substances: Vishay The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. APPROVALS The resistors are qualified according to AEC-Q200. Where applicable, the resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1, EN 60115-8 and the variety of environmental test procedures of the IEC 60068 (1) series. RELATED PRODUCTS For more information about products with superior surge and pulse performance please refer to D/CRCW-IF e3, Pulse Proof Thick Film Chip Resistors datasheet (www.vishay.com/doc?20024). The CRCW-HP e3 product series is designed for those applications where both enhanced power rating and superior pulse loading performance is required. For ordering CRCW-HP e3 please refer to latest edition of datasheet (www.vishay.com/doc?20043). For thick film resistors with standard requirements for power rating, please refer to D/CRCW e3, Standard Thick Film Chip Resistors datasheet (www.vishay.com/doc?20035) • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474. (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 07-Mar-2019 Document Number: 20065 4 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCS e3 www.vishay.com Vishay FUNCTIONAL PERFORMANCE Single Pulse Axis Title 10000 10 000 RCS0402 in work RCS1206 RCS0805 100 1000 1st line 2nd line 2nd line ^ Pmax. - Pulse Load (W) 1000 10 RCS0603 100 1 0.1 0.01 0.000001 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 ti - Pulse Duration (s) Maximum pulse load, single pulse; applicable if P  0 and n < 1000 and Uˆ = Uˆ max.; for permissible resistance change equivalent to 8000 h operation Continuous Pulse Axis Title 10000 10 000 RCS0402 in work RCS1206 100 1000 RCS0805 1st line 2nd line 2nd line ^ Pmax. - Pulse Load (W) 1000 10 RCS0603 100 1 0.1 0.01 0.000001 10 0.00001 0.0001 0.001 0.01 0.1 1 10 100 ti - Pulse Duration (s) Maximum pulse load, continuous pulses; applicable if P  P (amb) and Uˆ = Uˆ max.; for permissible resistance change equivalent to 8000 h operation Pulse Voltage Axis Title 2000 10000 RCS0402 in work 1800 1400 2512 1000 2010 1200 1st line 2nd line 2nd line ^ Umax. - Pulse Voltage (V) 1600 1000 800 1206, 1210, 1218 600 0805 400 0603 100 200 0 0.000001 10 0.00001 0.0001 0.001 0.01 0.1 1 10 ti - Pulse Duration (s) Maximum pulse voltage, single and continuous pulses; applicable if Pˆ = Pˆ max.; for permissible resistance change equivalent to 8000 h operation Revision: 07-Mar-2019 Document Number: 20065 5 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCS e3 www.vishay.com Vishay Derating Axis Title 10000 0.6 RCS1206 2nd line P - Power Dissipation (W) 0.5 RCS0805 1000 0.3 1st line 2nd line 0.4 RCS0603 100 0.2 RCS0402 0.1 10 0 -70 -50 -30 -10 10 30 50 70 90 110 130 150 ϑamb - Ambient Temperature (°C) TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 60115-8 specification (successor of EN 140400), sectional The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 % EN 140401-802, detail specification Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar). IEC 60068-2-xx, test methods A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The parameters stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. The components are mounted for testing on boards in accordance with EN 60115-8, 2.4.2 unless otherwise specified. The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5201-1. TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60082-2 (1) TEST METHOD REQUIREMENTS PERMISSIBLE CHANGE (R) STABILITY CLASS 1 STABILITY CLASS 2 OR BETTER OR BETTER PROCEDURE TEST Stability for product types: RCS e3 4.5 - Resistance 4.8 - Temperature coefficient 4.25.1 - Endurance at 70 °C 4.25.3 - 4.24 78 (Cab) Revision: 07-Mar-2019 At (20 / -55 / 20) °C and (20 / 155 / 20) °C U = P 70 x R or U = Umax. whichever is the less severe; 1.5 h on; 0.5 h off 70 °C; 1000 h 70 °C; 8000 h Endurance at upper category temperature 155 °C; 1000 h Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH 1  to 10 M ± 0.5 %; ± 1 % ±5% ± 100 ppm/K ± 200 ppm/K ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) ± (1 % R + 0.05 ) Document Number: 20065 6 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCS e3 www.vishay.com Vishay TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60082-2 (1) TEST METHOD PROCEDURE TEST REQUIREMENTS PERMISSIBLE CHANGE (R) STABILITY CLASS 1 STABILITY CLASS 2 OR BETTER OR BETTER Stability for product types: 4.37 67 (Cy) Damp heat, steady state, accelerated 4.23 4.23.2 4.23.3 4.23.4 4.23.5 2 (Bb) 30 (Db) 1 (Ab) 13 (M) Climatic sequence: Dry heat Damp Cold Low air pressure 4.23.6 30 (Db) Damp heat, cyclic 4.23.7 - 1 (Aa) DC load Cold 4.19 14 (Na) Rapid change of temperature 4.13 - Short time overload 4.27 - Single pulse high voltage overload 4.39 - Periodic electric overload 4.38 - Electrostatic discharge (human body model) 4.22 6 (Fc) Vibration 4.17 58 (Td) Solderability 4.18 58 (Td) 4.29 45 (XA) 4.32 21 (Ue3) Resistance to soldering heat Component solvent resistance Shear (adhesion) 4.33 21 (Ue1) Substrate bending 4.7 - 4.35 - Voltage proof Flammability, needle flame test RCS e3 (85 ± 2) °C; (85 ± 5) % RH U = 0.1 x P 85 x R  100 V; 1000 h 1  to 10 M ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 125 °C; 16 h 55 °C; 24 h;  90 % RH; 1 cycle -55 °C; 2 h ± (1 % R + 0.05 ) ± (2 % R + 0.1 ) 8.5 kPa; 2 h; (25 ± 10) °C 55 °C; 24 h;  90 % RH; 5 cycles U = P 70 x R  Umax.; 1 min -55 °C; 2 h ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 30 min. at -55 °C and ± (1 % R + 0.05 ) 30 min. at 125 °C no visible damage 1000 cycles U = 2.5 x P 70 x R  2 x Umax.; ± (2 % R + 0.05 ) whichever is the less severe; 5 s Severity no. 4: U = 10 x P 70 x R ± (1 % R + 0.05 ) or U = 2 x Umax.; no visible damage whichever is the less severe; 10 pulses 10 μs / 700 μs U = 15 x P 70 x R or U = 2 x Umax.; ± (1 % R + 0.05 ) whichever is the less severe; no visible damage 0.1 s on; 2.5 s off; 1000 cycles IEC 61340-3-1 (1); ± (1 % R + 0.05 ) 3 positive + 3 negative discharges; ESD voltage according to the size Endurance by sweeping; 10 Hz to 2000 Hz; ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) no resonance; no visible damage no visible damage 2 amplitude  1.5 mm or  200 m/s ; 7.5 h Solder bath method, SnPb40; non-activated flux (235 ± 5) °C; (2 ± 0.2) s Good tinning ( 95 % covered); Solder bath method, no visible damage Sn96.5Ag3Cu0.5; non-activated flux (245 ± 5) °C; (3 ± 0.3) s Soldering bath method; ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) (260 ± 5) °C; (10 ± 1) s Isopropyl alcohol +50 °C; No visible damage method 2 RCS0402 e3: 9 N No visible damage RCS0603 e3 and RCS0805 e3: 17.7 N ± (0.25 % R + 0.05 ) Depth 2 mm; 3 times no visible damage, no open circuit in bent position U = 1.4 x Uins; 60 s No flashover or breakdown IEC 60695-11-5 (1); No burning after 30 s 10 s Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 07-Mar-2019 Document Number: 20065 7 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCS e3 www.vishay.com Vishay DIMENSIONS DIMENSIONS AND MASS TYPE / SIZE L (mm) W (mm) H (mm) T1 (mm) T2 (mm) MASS (mg) RCS0402 e3 1.0 ± 0.05 0.5 ± 0.05 0.35 ± 0.05 0.25 ± 0.05 0.2 ± 0.10 0.65 RCS0603 e3 1.55 + 0.10 / - 0.05 0.85 ± 0.10 0.45 ± 0.05 0.3 ± 0.20 0.3 ± 0.20 2 RCS0805 e3 2.0 + 0.20 / - 0.10 1.25 ± 0.15 0.45 ± 0.05 0.3 + 0.20 / - 0.10 0.3 ± 0.20 5.5 RCS1206 e3 3.2 + 0.10 / - 0.20 1.6 ± 0.15 0.55 ± 0.10 0.45 ± 0.20 0.4 ± 0.20 10 SOLDER PAD DIMENSIONS X G Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) RCS0402 e3 - - - - 0.45 0.6 0.6 1.65 RCS0603 e3 0.65 1.10 1.25 2.85 0.75 0.75 1.00 2.15 RCS0805 e3 0.90 1.30 1.60 3.50 1.00 0.95 1.45 2.90 RCS1206 e3 1.40 1.40 1.95 4.20 1.50 1.05 1.80 3.60 Notes • The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g in standards IEC 61188-5-x (1) or in publication IPC-7351 (1) The quoted IEC standards are also released as EN standards with the same number and identical contents Revision: 07-Mar-2019 Document Number: 20065 8 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. © 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 01-Jan-2021 1 Document Number: 91000