RCV2010100KJNEFAT

RCV-AT e3 www.vishay.com Vishay Draloric High Voltage (Up to 3 kV) Thick Film Chip Resistors FEATURES • High operating voltage (up to 3 kV) • Low voltage coefficient of resistance (VCR): 25 ppm/V • RCV-AT series AEC-Q200 qualified • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS The RCV e3 high voltage thick film chip resistors series are the perfect choice for modern electronics with high voltage requirements. Typical applications include automotive inverters for H(EV) cars, voltage measurement systems as implemented in on board chargers, and DC-DC converters. • Inverters for (H)EV cars • On board chargers • DC-DC converters TECHNICAL SPECIFICATIONS DESCRIPTION Imperial size Metric size code RCV2010-AT e3 RCV2512-AT e3 2010 2512 RR5025M RR6332M Resistance range 100 k to 100 M Resistance tolerance ± 5 %; ± 1 % Temperature coefficient ± 200 ppm/K; ± 100 ppm/K Voltage coefficient 25 ppm/V Rated dissipation, P70 (1) 0.75 W 1.0 W Operating voltage, Umax. ACRMS/DC 2000 V 3000 V Permissible film temperature, F max. (1) 155 °C Operating temperature range -55 °C to +155 °C Max. resistance change at P70 for resistance range, |R/R| after: 1000 h  2.0 %  2.0 % Note (1) Please refer to APPLICATION INFORMATION below APPLICATION INFORMATION When the resistor dissipates power, a temperature rise above the ambient temperature occurs, dependent on the thermal resistance of the assembled resistor together with the printed circuit board. The rated dissipation applies only if the permitted film temperature is not exceeded. These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Revision: 25-Jun-2020 Document Number: 20082 1 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV-AT e3 www.vishay.com Vishay Draloric TEMPERATURE COEFFICIENT AND RESISTANCE RANGE TYPE / SIZE TCR TOLERANCE RESISTANCE E-SERIES ± 200 ppm/K ±5% 100 k to 100 M E24 ± 100 ppm/K ±1% 100 k to 10 M E24; E96 ± 200 ppm/K ±5% 100 k to 100 M E24 ± 100 ppm/K ±1% 100 k to 10 M E24; E96 RCV2010-AT e3 RCV2512-AT e3 PACKAGING TYPE / SIZE RCV2010-AT e3 CODE QUANTITY EF = E02 4000 EG = E67 WIDTH PITCH PACKAGING DIMENSIONS 12 mm 4 mm Ø 180 mm / 7" Blister tape according to IEC 60286-3, type 2a 2000 RCV2512-AT e3 ET = E82 PACKAGING STYLE 8 mm 12 mm Ø 180 mm / 7" 4000 4 mm PART NUMBER AND PRODUCT DESCRIPTION Part Number: RCV2010100KFKEFAT R C V 2 0 1 0 1 0 0 K F K E F A T TYPE / SIZE RESISTANCE TOLERANCE TCR PACKAGING VERSION RCV2010 RCV2512 K = thousand M = million F=±1% J=±5% K = ± 100 ppm/K N = ± 200 ppm/K EF, EG, EH AT = automotive Product Description: RCV2010-AT 100 100K 1 % E02 e3 RCV2010-AT 100 100K 1% E02 e3 TYPE / SIZE TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE RCV2010-AT RCV2512-AT ± 100 ppm/K ± 200 ppm/K 100K = 100 k 1M = 1 M 100M = 100 M ±1% ±5% E02, E67, E82 e3 = pure tin termination finish Revision: 25-Jun-2020 Document Number: 20082 2 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV-AT e3 www.vishay.com DESCRIPTION Production is strictly controlled and follows an extensive set of instructions established for reproducibility. A cermet film layer and a glass-over are deposited on a high grade (Al2O3) ceramic substrate. Specially designed inner contacts are deposited on both sides. A special laser is used to achieve the target value by smoothly fine trimming the resistive layer without damaging the ceramics. The resistor elements are covered by a protective coating designed for electrical, mechanical, and climatic protection. The terminations receive a final pure tin on nickel plating. The result of the determined production is verified by an extensive testing procedure on 100 % of the individual chip resistors. Only accepted products are laid directly into the tape in accordance with IEC 60286-3 type 1a and 2a (1). Vishay Draloric Hence the products fully comply with the following directives: • 2000/53/EC End-of-Life Vehicle Directive (ELV) and Annex II (ELV II) • 2011/65/EU Restriction of the Use of Hazardous Substances Directive (RoHS) with amendment 2015/863/EU • 2012/19/EU Waste Electrical and Electronic Equipment Directive (WEEE) Vishay pursues the elimination of conflict minerals from its supply chain, see the Conflict Minerals Policy at www.vishay.com/doc?49037. APPROVALS The resistors are qualified according to AEC-Q200. ASSEMBLY The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, esters, and aqueous solutions. The suitability of conformal coatings, potting compounds and their processes, if applied, shall be qualified by appropriate means to ensure the long-term stability of the whole system. Where applicable, the resistors are tested in accordance with EN 140401-802 which refers to EN 60115-1, EN 60115-8 and the variety of environmental test procedures of the IEC 60068 (1) series. RELATED PRODUCTS For high voltage thin film products, please refer to latest edition of TNPV e3, High Voltage Thin Film Chip Resistors datasheet, www.vishay.com/doc?28881. The resistors are RoHS-compliant, the pure tin plating provides compatibility with lead (Pb)-free and lead-containing soldering processes. Solderability is specified for 2 years after production or requalification. The permitted storage time is 20 years. The immunity of the plating against tin whisker growth has been proven under extensive testing. MATERIALS Vishay acknowledges the following systems for the regulation of hazardous substances: • IEC 62474, Material Declaration for Products of and for the Electrotechnical Industry, with the list of declarable substances given therein (2) • The Global Automotive Declarable Substance List (GADSL) (3) • The REACH regulation (1907/2006/EC) and the related list of substances with very high concern (SVHC) (4) for its supply chain The products do not contain any of the banned substances as per IEC 62474, GADSL, or the SVHC list, see www.vishay.com/how/leadfree. Notes (1) The quoted IEC standards are also released as EN standards with the same number and identical contents (2) The IEC 62474 list of declarable substances is maintained in a dedicated database, which is available at http://std.iec.ch/iec62474 (3) The Global Automotive Declarable Substance List (GADSL) is maintained by the American Chemistry Council and available at www.gadsl.org (4) The SVHC list is maintained by the European Chemical Agency (ECHA) and available at http://echa.europa.eu/candidate-list-table Revision: 25-Jun-2020 Document Number: 20082 3 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV-AT e3 www.vishay.com Vishay Draloric DERATING Axis Title 10000 1.2 RCV2512-AT RCV2010-AT 0.8 1000 1st line 2nd line 2nd line P - Power Dissipation (W) 1.0 0.6 100 0.4 0.2 10 0 -70 -50 -30 -10 10 30 50 70 90 110 130 150 ϑamb - Ambient Temperature (°C) NOMINAL OPERATING VOLTAGE Axis Title 10000 RCV2512-AT 2800 2400 1000 2000 1st line 2nd line 2nd line Permissible Operating Voltage (V) 3200 RCV2010-AT 1600 1200 100 800 400 0 100 000 1 000 000 10 000 000 10 100 000 000 Resistance Value (Ω) The permissible operating voltage Umax. equals the rated voltage. For ambient temperatures above 70 °C power derating must be considered TESTS AND REQUIREMENTS All executed tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 60115-8 specification (successor of EN 140400), sectional The tests are carried out under standard atmospheric conditions in accordance with IEC 60068-1, 4.3, whereupon the following values are applied: Temperature: 15 °C to 35 °C Relative humidity: 25 % to 75 % EN 140401-802, detail specification Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) IEC 60068-2-xx, test methods A climatic category LCT / UCT / 56 is applied, defined by the lower category temperature (LCT), the upper category temperature (UCT), and the duration of exposure in the damp heat, steady state test (56 days). The parameters stated in the “Test Procedures and Requirements” table are based on the required tests and permitted limits of EN 140401-802. The table presents only the most important tests, for the full test schedule refer to the documents listed above. However, some additional tests and a number of improvements against those minimum requirements have been included. The testing also covers most of the requirements specified by EIA/IS-703 and JIS-C-5201-1. Revision: 25-Jun-2020 Document Number: 20082 4 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV-AT e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS IEC EN 60082-2 (1) 60115-1 TEST CLAUSE METHOD REQUIREMENTS PERMISSIBLE CHANGE (R) PROCEDURE STABILITY CLASS 1 STABILITY CLASS 2 OR BETTER OR BETTER TEST Stability for product types: RCV-AT e3 4.5 - 4.8 - 100 k to 100 M Resistance - ±1% ±5% Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C ± 100 ppm/K ± 200 ppm/K ± (2 % R + 0.1 ) ± (4 % R + 0.1 ) 4.25.1 - Endurance at 70 °C U = P70 x R or U = Umax. whichever is the less severe; 1.5 h on; 0.5 h off; 70 °C; 1000 h; 70 °C; 8000 h 4.25.3 - Endurance at upper category temperature 155 °C; 1000 h ± (2 % R + 0.1 ) 4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; 56 days; (93 ± 3) % RH ± (2 % R + 0.1 ) 4.37 67 (Cy) 4.23 - Damp heat, steady state, (85 ± 2) °C; (85 ± 5) % RH accelerated power U = (0.1 x P85 x R)1/2  0.3 x Umax.; 1000 h operation mode Climatic sequence: 4.23.2 2 (Bb) Dry heat 125 °C; 16 h 4.23.3 30 (Db) Damp heat, cyclic 55 °C; 24 h;  90 % RH; 1 cycle 4.23.4 1 (Ab) Cold -55 °C; 2 h 4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C 4.23.6 30 (Db) Damp heat, cyclic 55 °C; 5 days; > 90 % RH; 5 cycles 4.23.7 - DC load U = (P70 x R)1/2  Umax.; 1 min 4.19 ± (2 % R + 0.1 ) ± (2 % R + 0.1 ) 1 (Aa) Cold -55 °C; 2 h ± (0.5 % R + 0.05 ) 14 (Na) Rapid change of temperature 30 min. at -55 °C and 30 min. at 125 °C; 1000 cycles ± (1 % R + 0.05 ) no visible damage U = 2.5 x (P70 x R)1/2 2 x Umax.; whichever is the less severe; 5 s 4.13 - Short time overload Style Duration Maximum UOL RCV2010-AT 5s 3000 RCV2512-AT 5s 4000 ± (2 % R + 0.05 ) 4.27 - Single pulse high voltage overload Severity no. 4: U = 10 x (P70 x R)1/2 or U = 2 x Umax.; whichever is the less severe; 10 pulses 10 μs / 700 μs 4.39 - Periodic electric overload U = 15 x P70 x R or U = 2 x Umax.; whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles ± (2 % R + 0.05 ) - Electrostatic discharge (human body model) IEC 61340-3-1 (1); 3 positive + 3 negative discharges; RCV2010: 12 kV RCV2512: 25 kV ± (1 % R + 0.05 ) Vibration Endurance by sweeping; 10 Hz to 2000 Hz; no resonance; amplitude  1.5 mm or  200 m/s2; 7.5 h ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) no visible damage no visible damage 4.38 4.22 4.17 6 (Fc) 58 (Td) Revision: 25-Jun-2020 Solderability Solder bath method, SnPb40; non-activated flux (235 ± 5) °C; (2 ± 0.2) s Solder bath method, Sn96.5Ag3Cu0.5; non-activated flux (245 ± 5) °C; (3 ± 0.3) s ± (2 % R + 0.1 ) no visible damage Good tinning ( 95 % covered); no visible damage Document Number: 20082 5 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCV-AT e3 www.vishay.com Vishay Draloric TEST PROCEDURES AND REQUIREMENTS IEC EN 60082-2 (1) 60115-1 TEST CLAUSE METHOD REQUIREMENTS PERMISSIBLE CHANGE (R) PROCEDURE STABILITY CLASS 1 STABILITY CLASS 2 OR BETTER OR BETTER TEST Stability for product types: 100 k to 100 M RCV-AT e3 4.18 58 (Td) Resistance to soldering heat Soldering bath method; (260 ± 5) °C; (10 ± 1) s ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 ) 4.29 45 (XA) Component solvent resistance Isopropyl alcohol +50 °C; method 2 No visible damage 4.32 21 (Uu3) Shear (adhesion) 17.7 N No visible damage 4.33 21 (Uu1) Substrate bending Depth 2 mm; 3 times ± (1 % R + 0.05 ) no visible damage, no open circuit in bent position 4.7 - Voltage proof U = 1.4 x Uins; 60 s No flashover or breakdown - Flammability, needle flame test IEC 60695-11-5 (1); 10 s No burning after 30 s 4.35 Note (1) The quoted IEC standards are also released as EN standards with the same number and identical contents DIMENSIONS L T2 W H T1 DIMENSIONS AND MASS L (mm) W (mm) H (mm) T1 (mm) T2 (mm) MASS (mg) RCV2010-AT e3 5.0 ± 0.15 2.5 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.45 ± 0.20 25.5 RCV2512-AT e3 6.3 ± 0.20 3.15 ± 0.15 0.6 ± 0.10 0.6 ± 0.20 0.45 ± 0.20 42 G X TYPE / SIZE SOLDER PAD DIMENSIONS Y Z RECOMMENDED SOLDER PAD DIMENSIONS WAVE SOLDERING REFLOW SOLDERING TYPE / SIZE G (mm) Y (mm) X (mm) Z (mm) G (mm) Y (mm) X (mm) Z (mm) RCV2010-AT e3 3.60 1.65 2.85 6.90 3.70 1.20 2.70 6.10 RCV2512-AT e3 4.90 1.60 3.50 8.10 5.00 1.25 3.35 7.50 Note • Utilization of the full specified operating voltage may require special considerations on the creepage and clearance distance between conductors at different potential levels Revision: 25-Jun-2020 Document Number: 20082 6 For technical questions, contact: thickfilmchip@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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