RV0805E3402BBTB

RV www.vishay.com Vishay Sfernice High Precision Wraparound Thin Film Chip Resistors FEATURES • Nickel barrier for high temperature operating conditions Available • Tight TCR < 10 ppm/°C, and in lot tracking < 5 ppm/°C in (-55 °C, +155 °C temperature range) LINKS TO ADDITIONAL RESOURCES Available • Very low noise < 35 dB and voltage coefficient 0.1 ppm/V 3D 3D • Non-inductive 3D Models • Laser trimmed down to 0.1 % Utilizing proven expertise in thin film resistors, Vishay provides a chip manufactured according to CECC with the same reliability and stability found in QPL resistors. These chips are available in a wide range of sizes, values, and performance characteristics. • Antistatic waffle-pack or tape and reel packaging available CONSTRUCTION • Withstand moisture resistance test of AEC-Q200 Passivation • Wraparound resistance less than 0.01 Ω • High stability (0.05 % - 1000 h at Pn at +70 °C) • According to CECC 40401-010 Passivated NiCr resistance film • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Solder coating Nickel barrier High purity alumina substrate Adhesion layer Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details STANDARD ELECTRICAL SPECIFICATIONS MODEL SIZE RESISTANCE RANGE (1) (2) Ω RATED POWER Pn W LIMITING ELEMENT VOLTAGE (UL) V TOLERANCE ±% TEMPERATURE COEFFICIENT ± ppm/°C RV 0505 100 to 260K 0.125 50 0.1, 0.5, 1, 2, 5 10, 25 RV 0603 100 to 260K 0.125 50 0.1, 0.5, 1, 2, 5 10, 25 RV 0805 100 to 300K 0.200 50 0.1, 0.5, 1, 2, 5 10, 25 RV 1206 100 to 1M 0.330 75 0.1, 0.5, 1, 2, 5 10, 25 Notes (1) Extended resistance range on request (2) For ohmic range versus tolerance and TCR, see detailed table CLIMATIC SPECIFICATIONS OHMIC RANGE VS. TOLERANCE AND TCR Operating temperature range -55 °C to +155 °C Storage temperature range -55 °C to +155 °C MECHANICAL SPECIFICATIONS CASE SIZE OHMIC RANGE Ω TOLERANCE % TCR ppm/°C 0505 100 < 500 0.5; 1; 2; 5 10, 25 0505 500 to 260K 0.1; 0.5; 1; 2; 5 10, 25 0603 100 < 500 0.5; 1; 2; 5 10, 25 500 to 260K 0.1; 0.5; 1; 2; 5 10, 25 Resistive material Nichrome 0603 Substrate material Alumina 0805 100 < 500 0.5; 1; 2; 5 10, 25 Tin lead over nickel or tin silver over nickel or gold over nickel 0805 500 to 300K 0.1; 0.5; 1; 2; 5 10, 25 1206 100 < 500 0.5; 1; 2; 5 10, 25 Per CECC specs 1206 500 to 1M 0.1; 0.5; 1; 2; 5 10, 25 Plating Marking resistance to solvents Revision: 04-Oct-2021 Document Number: 60022 1 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RV www.vishay.com Vishay Sfernice TECHNICAL SPECIFICATIONS TEST Absolute TCR SPECIFICATIONS E: ± 25 ppm/°C / Y: ± 10 ppm/°C ± 0.1 %, ± 0.5 %, ± 1 %, ± 2 %, ± 5 % (R ≥ 500 Ω) ± 0.5 %, ± 1 %, ± 2 %, ± 5 % (R ≥ 100 Ω) 0.1 ppm/V -35 dB typical < 0.1 μV/°C ± (0.1 % Rn (1) ± 0.05 Ω) Absolute tolerance Voltage coefficient Noise Thermal EMF Load life stability CONDITIONS -55 °C to +155 °C 1000 h Pn at +70 °C Note (1) Rn: nominal resistance DIMENSIONS in millimeters (inches) A D D B C E E SERIES / CASE SIZES RV 0505 RV 0603 RV 0805 RV 1206 A MIN. 1.198 (0.047) 1.368 (0.054) 1.758 (0.069) 2.908 (0.114) B MAX. 1.502 (0.059) 1.672 (0.066) 2.062 (0.081) 3.212 (0.126) MIN. 1.143 (0.045) 0.623 (0.025) 1.143 (0.045) 1.473 (0.058) D/E MAX. 1.397 (0.055) 0.877 (0.035) 1.397 (0.055) 1.727 (0.068) MIN. 0.250 (0.010) 0.250 (0.010) 0.250 (0.010) 0.250 (0.010) C MAX. 0.510 (0.020) 0.510 (0.020) 0.510 (0.020) 0.510 (0.020) MIN. 0.373 (0.015) 0.373 (0.015) 0.373 (0.015) 0.373 (0.015) MAX. 0.627 (0.025) 0.627 (0.025) 0.627 (0.025) 0.627 (0.025) POPULAR OPTION AEC-Q200 moisture resistance Option to order: 0058: specific production process to withstand 85 °C / 85 % RH at Pn/10 ENVIRONMENTAL TEST TEST CONDITIONS Overload Climatic sequences (1) Thermal shock (1) Load life (1) Resistance to solder heat Moisture resistance (1) High temperature storage Bending (1) 6.25 x rated power / 2 s (or 2 UL) -55 °C / +155 °C 5 moisture cycles -55 °C / +155 °C 5 cycles 30 min +70 °C/Pn 1000 h +260 °C/ 10 s +40 °C / 93 % HR Pn/10 AEC-Q200 (3) 85 °C / 85 % RH / Pn/10 1000 h 1000 h at + 155 °C 10 bends / 2 mm / 5 s VALUES AND DRIFTS (ΔR/R ± %) CECC REQUIREMENTS TYPICAL PERFORMANCE 0.05 % Rn (2) + 0.05 Ω 0.01 % Rn (2) 0.1 % Rn (2) + 0.05 Ω 0.02 % Rn (2) 0.05 % Rn (2) + 0.05 Ω 0.02 % Rn (2) 0.1 % Rn (2) + 0.05 Ω 0.05 % Rn (2) 0.05 % Rn (2) + 0.05 Ω 0.02 % Rn (2) 0.1 % Rn (2) + 0.05 Ω 0.01 % Rn (2) 0.5 % + 0.05 Ω Max. < 0.3 % + 0.05 Ω 0.1 % Rn (2) + 0.05 Ω 0.05 % Rn (2) + 0.05 Ω 0.05 % Rn (2) 0.02 % Rn (2) Notes (1) Test requiring parts to be mounted on PCB will be performed with the requirement that termination alloy will be the same as solder paste alloy. Gold termination will be tested as B termination (2) Rn: nominal resistance Pn: nominal power (3) Option to order: 0058 Revision: 04-Oct-2021 Document Number: 60022 2 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RV www.vishay.com Vishay Sfernice SPECIFIC CONDITIONS DUE TO TERMINATION TYPE CONDITIONS TEST Solderability VALUES AND DRIFTS B; G N +235 °C/2 s Sn60Pb40 alloy +245 °C/3 s Sn97Ag3 alloy N/A +255 °C/40 s (on parts) High T° reflow profile VISHAY REQUIREMENTS TYPICAL PERFORMANCE VISUAL INSPECTION 0.02 % Rn (1) + 0.05 Ω 0.01 % Rn (1) + 0.05 Ω Note (1) Rn: nominal resistance Pn: nominal power DERATING CURVE PACKAGING INFORMATION Axis Title NUMBER OF PIECES PER PACKAGE TAPE AND REEL WAFFLE PACK (2" x 2") 0805 100 1206 140 TAPE WIDTH MAX. 100 4000 100 0603 10000 5000 100 8 mm (0.315”) 4000 1000 80 1st line 2nd line 0505 MIN. 2nd line Rated Power (%) SIZE 120 60 100 40 20 10 0 0 20 40 60 70 80 100 125 140 155 Ambient Temperature (°C) GLOBAL PART NUMBER INFORMATION New Global Part Numbering: RV0505E1001DBT0099 R V GLOBAL MODEL 0 5 0 5 E 1 0 0 1 D B T 0 0 9 9 SIZE TCR VALUE TOLERANCE TERMINATION PACKAGING OPTION 0505 0603 0805 1206 E = ± 25 ppm/°C Y = ± 10 ppm/°C The first 3 digits (2 digits are enough for tolerance G and J) are significant figures and the last digit specifies the number of zeros to follow. R designates decimal point B = ± 0.1 % D = ± 0.5 % F=±1% G=±2% J=±5% B: SnPb over nickel barrier N: SnAg over nickel barrier G: gold over nickel barrier For more information see “Codification of packaging” table Leave blank if no option B: lead bearing version N and G: lead (Pb)-free / RoHS version 10R0 = 10 Ω 3901 = 3900 Ω 1004 = 1 MΩ Historical Part Number Example: RV 0505 25 ppm 1K 0.5 % B TR R1016 PART NUMBER DESCRIPTION (for information only) RV 0505 25 ppm 1K 0.5 % B TR R1016 MODEL SIZE TCR OHMIC VALUE TOLERANCE TERMINATION PACKAGING OPTION Revision: 04-Oct-2021 Document Number: 60022 3 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RV www.vishay.com Vishay Sfernice CODIFICATION OF PACKAGING CODE 18 PACKAGING WAFFLE PACK W 100 min., 1 mult. WA 100 min., 100 mult. (available only in size 1206) PLASTIC TAPE (Standard for all sizes.) T 100 min., 1 mult. TA 100 min., 100 mult. TB 250 min., 250 mult. TC 500 min., 500 mult. TD 1000 min., 1000 mult. TE 2500 min., 2500 mult. TF Full tape (quantity depending on size of chips) PAPER TAPE (Available for 0603, 0805, and 1206. Please consult Vishay Sfernice for other sizes.) PT 100 min., 1 mult. PA 100 min., 100 mult. PB 250 min., 250 mult. PC 500 min., 500 mult. PD 1000 min., 1000 mult. PE 2500 min., 2500 mult. PF Full tape (quantity depending on size of chips) Revision: 04-Oct-2021 Document Number: 60022 4 For technical questions, contact: sferthinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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