SE30AFB, SE30AFD, SE30AFG, SE30AFJ
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Vishay General Semiconductor
Surface Mount ESD Capability Rectifiers
FEATURES
eSMP® Series
• Very low profile - typical height of 0.95 mm
Available
• Ideal for automated placement
• Oxide planar chip junction
• Low forward voltage drop, low leakage current
• ESD capability
Bottom View
Top View
• Meets MSL level 1, per
LF maximum peak of 260 °C
SlimSMA (DO-221AC)
J-STD-020,
• AEC-Q101 qualified
Cathode
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Anode
ADDITIONAL RESOURCES
TYPICAL APPLICATIONS
3D 3D
General purpose, power line polarity protection, in both
consumer and automotive applications.
3D Models
MECHANICAL DATA
PRIMARY CHARACTERISTICS
IF(AV)
3.0 A
VRRM
100 V, 200 V, 400 V, 600 V
IFSM
40 A
VF at IF = 3.0 A (TA = 125 °C)
0.86 V
IR
10 μA
Case: SlimSMA (DO-221AC)
Molding compound meets UL 94 V-0 flammability rating
Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
Base P/NHM3 - halogen-free, RoHS-compliant, and
AEC-Q101 qualified
TJ max.
175 °C
Package
SlimSMA (DO-221AC)
Circuit configuration
Single
Terminals: matte tin plated leads, solderable per
J-STD-002 and JESD 22-B102
M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix
meets JESD 201 class 2 whisker test
Polarity: color band denotes the cathode end
MAXIMUM RATINGS (TA = 25 °C unless otherwise noted)
PARAMETER
Device marking code
Maximum repetitive peak reverse voltage
Maximum DC forward current
Peak forward surge current 10 ms single half
sine-wave superimposed on rated load
Operating junction and storage temperature range
SYMBOL
VRRM
IF (1)
IF (2)
SE30AFB
SE30AFD
SE30AFG
SE30AFJ
UNIT
S3B
100
S3D
200
S3G
400
S3J
600
V
3.0
1.4
A
IFSM
40
A
TJ, TSTG
-55 to +175
°C
Notes
(1) Mounted on 15 mm x 15 mm pad areas, 2 oz. FR4 PCB
(2) Free air, mounted on recommended copper pad area
Revision: 26-Feb-2020
Document Number: 89955
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SE30AFB, SE30AFD, SE30AFG, SE30AFJ
www.vishay.com
Vishay General Semiconductor
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
TEST CONDITIONS
Instantaneous forward voltage
Reverse current
IF = 1.5 A
IF = 3.0 A
IF = 1.5 A
IF = 3.0 A
SYMBOL
TA = 25 °C
VF (1)
TA = 125 °C
TA = 25 °C
TA = 125 °C
IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A
4.0 V, 1 MHz
IR (2)
Rated VR
Typical reverse recovery time
Typical junction capacitance
trr
CJ
TYP.
MAX.
0.91
0.97
0.79
0.86
13
1.5
19
1.1
0.98
10
100
-
UNIT
V
μA
μs
pF
Notes
(1) Pulse test: 300 μs pulse width, 1 % duty cycle
(2) Pulse test: Pulse width ≤ 40 ms
THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
PARAMETER
SYMBOL
RθJA
Typical thermal resistance
SE30AFB
SE30AFD
(1)
SE30AFG
SE30AFJ
125
RθJM (2)
UNIT
°C/W
12
Notes
(1) Free air, mounted on recommended PCB, 1 oz. pad area; thermal resistance R
θJA - junction to ambient
(2) Mounted on 15 mm x 15 mm pad areas, 2 oz. FR4 PCB; R
θJM - junction to mount
IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS
(TA = 25 °C unless otherwise noted)
STANDARD
AEC-Q101-001
TEST TYPE
TEST CONDITIONS
Human body model (contact mode)
SYMBOL
CLASS
VALUE
VC
H3B
> 8 kV
C = 100 pF, R = 1.5 kΩ
ORDERING INFORMATION (Example)
PREFERRED P/N
UNIT WEIGHT (g)
PREFERRED PACKAGE CODE
BASE QUANTITY
DELIVERY MODE
SE30AFJ-M3/6A
0.032
6A
3500
7" diameter plastic tape and reel
SE30AFJ-M3/6B
0.032
6B
14 000
13" diameter plastic tape and reel
SE30AFJHM3/6A (1)
0.032
6A
3500
7" diameter plastic tape and reel
SE30AFJHM3/6B (1)
0.032
6B
14 000
13" diameter plastic tape and reel
Note
AEC-Q101 qualified
(1)
Revision: 26-Feb-2020
Document Number: 89955
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SE30AFB, SE30AFD, SE30AFG, SE30AFJ
www.vishay.com
Vishay General Semiconductor
RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted)
TM = 141 °C, RthM = 12 °C/W
3.2
2.8
2.4
2
1.6
T A = 25 °C
1.2
0.8
0.4
TM measured at cathode band
terminal PCB mount
0
0
25
50
75
100
125
150
10000
TJ = 175 °C
100
TJ = 150 °C
TJ = 125 °C
10
1000
TJ = 75 °C
1
0.1
TJ = 25 °C
100
0.01
TJ = -40 °C
0.001
0.0001
175
10
10
Mount Temperature (°C)
20
30
40
50
60
70
80
90
100
Percent of Rated Peak Reverse Voltage (%)
Fig. 1 - Maximum Forward Current Derating Curve
Fig. 4 - Typical Reverse Leakage Characteristics
100
3.5
D = 0.8
3.0
D = 0.5
Junction Capacitance (pF)
Average Power Loss (W)
1st line
2nd line
Instantaneous Reverse Current (µA)
DC Forward Rectified Current (A)
Axis Title
1000
3.6
D = 0.3
2.5
D = 0.2
D = 1.0
D = 0.1
2.0
1.5
T
1.0
0.5
D = tp/T
tp
2.5
3
0.0
TJ = 25 °C
f = 1.0 MHz
Vsig = 50 mVp-p
10
1
0
0.5
1
1.5
2
0.1
3.5
1
10
100
Reverse Voltage (V)
Average Forward Current (A)
Fig. 2 - Forward Power Loss Characteristics
Fig. 5 - Typical Junction Capacitance
10000
10
1000
TJ = 150 °C
TJ = 125 °C
1st line
2nd line
Instantaneous Forward Current (A)
TJ = 175 °C
TJ = 25 °C
TJ = 75 °C
100
1
TJ = -40 °C
10
0.1
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
Instantaneous Forward Voltage (V)
Fig. 3 - Typical Instantaneous Forward Characteristics
Transient Thermal Impedance (°C/W)
Axis Title
100
1000
Junction to Ambient
100
10
1
0.01
0.1
1
10
100
t - Pulse Duration (s)
Fig. 6 - Transient Thermal Impedance
Revision: 26-Feb-2020
Document Number: 89955
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SE30AFB, SE30AFD, SE30AFG, SE30AFJ
www.vishay.com
Vishay General Semiconductor
Thermal Resistance (°C/W)
140
Epoxy printed
circiut board FR4
copper
thickness = 70 μm
120
100
80
60
40
20
Scu (cm2)
0
0.0
2.0
4.0
6.0
8.0
10.0
Copper Pad Areas (cm2)
Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Areas
PACKAGE OUTLINE DIMENSIONS in inches (millimeters)
SlimSMA (DO-221AC)
Cathode Band
0.057 (1.45)
0.049 (1.25)
0.106 (2.70)
0.098 (2.50)
0.171 (4.35)
0.163 (4.15)
0.211 (5.35)
0.199 (5.05)
0.047 (1.20)
0.030 (0.75)
Typ.: 0.019 (0.48)
Mounting Pad Layout
0.039 (1.00)
0.035 (0.90)
0.060 (1.52)
MIN.
0.012 (0.30)
0.006 (0.15)
0.047 (1.20)
MIN.
0.123 (3.12) MAX.
0.217 (5.52) REF.
0.047 (1.20)
MIN.
Revision: 26-Feb-2020
Document Number: 89955
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Revision: 01-Jan-2022
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Document Number: 91000