SE30AFJ-M3/6B

SE30AFB, SE30AFD, SE30AFG, SE30AFJ www.vishay.com Vishay General Semiconductor Surface Mount ESD Capability Rectifiers FEATURES eSMP® Series • Very low profile - typical height of 0.95 mm Available • Ideal for automated placement • Oxide planar chip junction • Low forward voltage drop, low leakage current • ESD capability Bottom View Top View • Meets MSL level 1, per LF maximum peak of 260 °C SlimSMA (DO-221AC) J-STD-020, • AEC-Q101 qualified Cathode • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Anode ADDITIONAL RESOURCES TYPICAL APPLICATIONS 3D 3D General purpose, power line polarity protection, in both consumer and automotive applications. 3D Models MECHANICAL DATA PRIMARY CHARACTERISTICS IF(AV) 3.0 A VRRM 100 V, 200 V, 400 V, 600 V IFSM 40 A VF at IF = 3.0 A (TA = 125 °C) 0.86 V IR 10 μA Case: SlimSMA (DO-221AC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified TJ max. 175 °C Package SlimSMA (DO-221AC) Circuit configuration Single Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: color band denotes the cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER Device marking code Maximum repetitive peak reverse voltage Maximum DC forward current Peak forward surge current 10 ms single half sine-wave superimposed on rated load Operating junction and storage temperature range SYMBOL VRRM IF (1) IF (2) SE30AFB SE30AFD SE30AFG SE30AFJ UNIT S3B 100 S3D 200 S3G 400 S3J 600 V 3.0 1.4 A IFSM 40 A TJ, TSTG -55 to +175 °C Notes (1) Mounted on 15 mm x 15 mm pad areas, 2 oz. FR4 PCB (2) Free air, mounted on recommended copper pad area Revision: 26-Feb-2020 Document Number: 89955 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SE30AFB, SE30AFD, SE30AFG, SE30AFJ www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS Instantaneous forward voltage Reverse current IF = 1.5 A IF = 3.0 A IF = 1.5 A IF = 3.0 A SYMBOL TA = 25 °C VF (1) TA = 125 °C TA = 25 °C TA = 125 °C IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A 4.0 V, 1 MHz IR (2) Rated VR Typical reverse recovery time Typical junction capacitance trr CJ TYP. MAX. 0.91 0.97 0.79 0.86 13 1.5 19 1.1 0.98 10 100 - UNIT V μA μs pF Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL RθJA Typical thermal resistance SE30AFB SE30AFD (1) SE30AFG SE30AFJ 125 RθJM (2) UNIT °C/W 12 Notes (1) Free air, mounted on recommended PCB, 1 oz. pad area; thermal resistance R θJA - junction to ambient (2) Mounted on 15 mm x 15 mm pad areas, 2 oz. FR4 PCB; R θJM - junction to mount IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS (TA = 25 °C unless otherwise noted) STANDARD AEC-Q101-001 TEST TYPE TEST CONDITIONS Human body model (contact mode) SYMBOL CLASS VALUE VC H3B > 8 kV C = 100 pF, R = 1.5 kΩ ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE SE30AFJ-M3/6A 0.032 6A 3500 7" diameter plastic tape and reel SE30AFJ-M3/6B 0.032 6B 14 000 13" diameter plastic tape and reel SE30AFJHM3/6A (1) 0.032 6A 3500 7" diameter plastic tape and reel SE30AFJHM3/6B (1) 0.032 6B 14 000 13" diameter plastic tape and reel Note AEC-Q101 qualified (1) Revision: 26-Feb-2020 Document Number: 89955 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SE30AFB, SE30AFD, SE30AFG, SE30AFJ www.vishay.com Vishay General Semiconductor RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) TM = 141 °C, RthM = 12 °C/W 3.2 2.8 2.4 2 1.6 T A = 25 °C 1.2 0.8 0.4 TM measured at cathode band terminal PCB mount 0 0 25 50 75 100 125 150 10000 TJ = 175 °C 100 TJ = 150 °C TJ = 125 °C 10 1000 TJ = 75 °C 1 0.1 TJ = 25 °C 100 0.01 TJ = -40 °C 0.001 0.0001 175 10 10 Mount Temperature (°C) 20 30 40 50 60 70 80 90 100 Percent of Rated Peak Reverse Voltage (%) Fig. 1 - Maximum Forward Current Derating Curve Fig. 4 - Typical Reverse Leakage Characteristics 100 3.5 D = 0.8 3.0 D = 0.5 Junction Capacitance (pF) Average Power Loss (W) 1st line 2nd line Instantaneous Reverse Current (µA) DC Forward Rectified Current (A) Axis Title 1000 3.6 D = 0.3 2.5 D = 0.2 D = 1.0 D = 0.1 2.0 1.5 T 1.0 0.5 D = tp/T tp 2.5 3 0.0 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p 10 1 0 0.5 1 1.5 2 0.1 3.5 1 10 100 Reverse Voltage (V) Average Forward Current (A) Fig. 2 - Forward Power Loss Characteristics Fig. 5 - Typical Junction Capacitance 10000 10 1000 TJ = 150 °C TJ = 125 °C 1st line 2nd line Instantaneous Forward Current (A) TJ = 175 °C TJ = 25 °C TJ = 75 °C 100 1 TJ = -40 °C 10 0.1 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Transient Thermal Impedance (°C/W) Axis Title 100 1000 Junction to Ambient 100 10 1 0.01 0.1 1 10 100 t - Pulse Duration (s) Fig. 6 - Transient Thermal Impedance Revision: 26-Feb-2020 Document Number: 89955 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SE30AFB, SE30AFD, SE30AFG, SE30AFJ www.vishay.com Vishay General Semiconductor Thermal Resistance (°C/W) 140 Epoxy printed circiut board FR4 copper thickness = 70 μm 120 100 80 60 40 20 Scu (cm2) 0 0.0 2.0 4.0 6.0 8.0 10.0 Copper Pad Areas (cm2) Fig. 7 - Thermal Resistance Junction to Ambient vs. Copper Pad Areas PACKAGE OUTLINE DIMENSIONS in inches (millimeters) SlimSMA (DO-221AC) Cathode Band 0.057 (1.45) 0.049 (1.25) 0.106 (2.70) 0.098 (2.50) 0.171 (4.35) 0.163 (4.15) 0.211 (5.35) 0.199 (5.05) 0.047 (1.20) 0.030 (0.75) Typ.: 0.019 (0.48) Mounting Pad Layout 0.039 (1.00) 0.035 (0.90) 0.060 (1.52) MIN. 0.012 (0.30) 0.006 (0.15) 0.047 (1.20) MIN. 0.123 (3.12) MAX. 0.217 (5.52) REF. 0.047 (1.20) MIN. Revision: 26-Feb-2020 Document Number: 89955 4 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. 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ALL RIGHTS RESERVED Revision: 01-Jan-2022 1 Document Number: 91000