SFH6139-X017

Option Information www.vishay.com Vishay Semiconductors Option Information Optocoupler lead-bend configurations are available as options. In addition, partial discharge testing as per VDE / IEC is also available as an option. The options are: Option 1 VDE option Option 6 400 mil (10.16 mm) lead spread DIP configuration See the order information section in the data sheet to determine if and which options are available to a specific product. Contact the Vishay sales office for other option configurations. Option 7 Surface mount, gull wing DIP configuration with standoff Option 8 Surface mount, gull wing DIP configuration with increased clearance Option 9 Surface mount, gull wing DIP configuration ORDERING OPTIONS A specific option or combination of options can be ordered by add the options definition field following the base part S F Prefix H 6 1 5 A Base Part Number - 3 X CTR Ranges 1 = 40 % to 80 % 2 = 63 % to 125 % 3 = 100 % to 200 % 4 = 160 % to 320 % 5 = 250 % to 500 % or 50 % to 150 % (1) 6 = 100 % to 300 % (1) 7 = 80 % to 160 % (1) 8 = 130 % to 260 % (1) 9 = 200 % to 400 % (1) BRT Il ILD ILQ SFH6 VO Examples: CNY17F-2X017T 4N35-X016 SFH615-3X001 VO615A-9X007T number and CTR range (if applicable) as presented in the following example: 0 0 Options Definition 9 T Tape and Reel Option Option 1 Optocouplers for saf e electr ical Insulation per DIN VDE 0884 Option 6 Optocouplers with 10.16 mm (0.4") through hole lead spread Option 7 Optocouplers with SMD lead form bend, 0.9 mm maximum standoff height Option 8 Optocouplers with 10.16 mm (0.4") SMD lead form bend Option 9 Optocouplers with SMD lead form bend, 0.25 mm maximum standoff height Option 1 may be combined with the other lead forming options. Option T may only be combined with Options 7, 8, and 9 Note (1) Used on selected products, consult data sheet for details This field is always 4 characters long and commences with the character X. In the case of surface mounted products in tape and reel format, the tape and reel option character “T” will follow this field. 18482 The possible combinations for these fields (1) are: X001, X006, X007, X008, X009, X001T (2), X007T, X008T, X009T, X016, X017, X018, X019, X017T, X018T, X019T Notes (1) Not all options are available for all product types. (2) The X001T option is only available on products that are available on the following SMD products SFH6106, SFH6156, SFH6186, SFH6206, and SFH6286 series, e.g. SFH6106-3X001T .  OPTION 1 OPTOCOUPLERS FOR SAFE ELECTRICAL INSULATION PER DIN EN 60747-5-5 (VDE 0884) (1) The optocoupler listed are suitable for safe electrical insulation only within the safety maximum ratings. Compliance with the safety maximum ratings must be ensured by protective circuits. The partial discharge measurement ensures that no partial discharge occurs during operation at maximum permissible operating insulation voltage (VIORM). Permanent partial discharge affects the insulating materials and can result in a high voltage breakdown. Rev. 2.0, 24-Aug-15 It is recommended that tests with the insulation test voltage (VISOL) should not be made, otherwise partial discharge may occur impairing the insulation characteristics. Thus partial discharges also may occur at the maximum permissible operating insulation voltage. The insulation test per DIN EN 60747-5-5 (VDE 0884) is carried out after all the other tests Document Number: 83713 1 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Option Information www.vishay.com Vishay Semiconductors V INITIAL V V V Pr 0.1 to 1 kV/µs V Pr V IORM V IORM t t 60 s 1s t p =10 s 0.1 s 1.0 s tp = 1.0 s 0.1 s 1.2 s 12 s tp: measuring time for par tial dischage tp: measuring time for partial dischage Procedure a. Type and sampling tests, destructive tests Procedure b. Routine tests, non-destructive tests 17928-1 Fig. 1 - Time Voltage Diagram per DIN EN 60747-5-5 DESCRIPTION SYMBOL SYSTEM 1 DIP4 DIP8 UNIT DIP16 SFH610A-.. ILCT6 ILQ1/2/5/74 SFH615A-.. ILD1/2/5/74 ILQ30/31/55 SFH615AA-.. ILD30/31/55 ILQ32 SFH615AGB-.. ILD32 ILQ66-.. SFH615AGR-.. ILD66-.. ILQ615-.. SFH617A-.. ILD250/1/2 ILQ620-.. SFH618A-.. ILD255 ILQ620GB-.. SFH620A-.. ILD621GB-.. ILQ621-.. SFH620AA-.. ILD621-.. ILQ621GB-.. SFH620AGB-.. ILD621GB-.. SFH628A-.. ILD755-.. SFH6106-.. ILD766-.. SFH6116-.. MCT6 SFH6156-.. SFH6186-.. SFH6206-.. SFH6286-.. Installation category (DIN VDE 0110) For rated line voltages  300 VRMS I to IV For rated line voltages  600 VRMS I to IV For rated line voltages  1000 VRMS IEC climatic category (DIN IEC 60068 Part 1/9.80) 55/100/21 Pollution degree (DIN VDE 0110 Part 1/1.89) Maximum operation insulating voltage (1) Test voltage input/output, procedure b (1) VPr = 1.875 x VIORM, routine 100 % test, tp = 1 s, partial discharge < 5 pC a (1) VPr Test voltage input/output, procedure = 1.6 x VIORM, type and sampling test tp = 60 s, partial discharge < 5 pC Maximum permissible overvoltage (transient overvoltage) Partial discharge test voltage (1) 2 VIORM 890 Vpeak VPr 1669 Vpeak VPr 1424 Vpeak VIOTM 10 000 Vpeak VINITIAL 8000 Vpeak Safety maximum ratings (maximum permissible ratings in case of a fault, also refer to d diagram)  Package temperature Current (input current IF, PSi = 0, TA = 25 °C) Derating with higher ambient temperature Power (output or total power dissipation, TA = 25 °C) Derating with higher ambient temperature Tsi Isi ISi PSi PSi 175 275 °C mA -1.83 400 -2.67 mA/K mW mW/K Insulation resistance at TSi VI/O = 500 V RIS > 109 W Rev. 2.0, 24-Aug-15 Document Number: 83713 2 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Option Information www.vishay.com DESCRIPTION Vishay Semiconductors SYMBOL SYSTEM 2 UNIT 4N25/26/27/28 IL250 MCT5210 4N35/36/37/38/39 IL251 MCT5211 4N32/33 IL252 SFH600-.. CNY17-.. IL255-.. SFH601-.. CNY17F-.. IL400 SFH608-.. H11A-.. IL755-.. SFH640-.. H11AA1-.. IL755B-.. MOC8050 H11B-.. IL766-.. IL56B-.. H11B1-.. IL766B-.. MOC8021 H11C-.. MCA230/231 MOC8112 MOC8102/03/04/05 H11D-.. MCA255 IL1/2/5/74 MCT2/2E VO610A... IL2B-.. MCT270/271 VO615A... IL30/31/55 MCT272 VO617A... IL55B-.. MCT273/274 VO618A... IL66-.. MCT275 VO615C... IL66B-.. MCT276/277 VO617C... IL201/202/203 Installation category (DIN VDE 0110) For rated line voltages  300 VRMS I to IV For rated line voltages  600 VRMS I to IV For rated line voltages  1000 VRMS IEC climatic category (DIN IEC 60068 Part 1/9.80) 55/100/21 Pollution degree (DIN VDE 0110 Part 1/1.89) 2 Maximum operation insulating voltage (1) VIORM 890 Vpeak Test voltage input/output, procedure b (1) VPr = 1.875 x VIORM, routine 100 % test, tp = 1 s, partial discharge < 5 pC VPr 1669 Vpeak Test voltage input/output, procedure a (1) VPr = 1.6 x VIORM, type and sampling test tp = 60 s, partial discharge < 5 pC VPr 1424 Vpeak Maximum permissible overvoltage (transient overvoltage) VIOTM 8000 Vpeak Partial discharge test voltage (1) VINITIAL 8000 Vpeak Safety maximum ratings (maximum permissible ratings in case of a fault,  also refer to diagram) Package temperature Current (input current IF, PSi = 0, TA = 25 °C) Derating with higher ambient temperature Power (output or total power dissipation, TA = 25 °C) Derating with higher ambient temperature Tsi Isi 175 400 °C mA DISi PSi PSi -2.67 700 -4.67 mA/K mW mW/K Insulation resistance at TSi VI/O = 500 V RIS > 10 9 W Rev. 2.0, 24-Aug-15 Document Number: 83713 3 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Option Information www.vishay.com DESCRIPTION Vishay Semiconductors SYMBOL SYSTEM 4 (2) SYSTEM 5 IL410 6N135 IL300 IL420 6N136 IL300E IL4116 SFH6135 IL300F IL4117 SFH6136 IL300EF IL4118 6N138 IL300DEFG IL4216 SFH6138 IL4217 SFH6139 IL4218 6N139 SYSTEM 7 UNIT SFH6345 6N137... VO2601... VO2611... VO2630... VO2631... VO4661... Installation category (DIN VDE 0110) For rated line voltages  300 VRMS I to IV I to IV I to IV For rated line voltages  600 VRMS I to III I to IV I to IV 55/100/21 55/100/21 55/100/21 2 2 2 VIORM 890 890 890 Vpeak Test voltage input/output, procedure VPr = 1.875 x VIORM, routine 100 % test, tp = 1 s,  partial discharge < 5 pC VPr 1669 1669 1669 Vpeak Test voltage input/output, procedure a (1) VPr = 1.6 x VIORM, type and sampling Test tp = 60 s,  partial discharge < 5 pC VPr 1424 1424 1424 Vpeak VIOTM 8000 8000 8000 Vpeak VINITIAL 8000 8000 8000 Vpeak For rated line voltages  1000 VRMS IEC climatic category (DIN IEC 60068 Part 1/9.80) Pollution degree (DIN VDE 0110 Part 1/1.89) Maximum operation insulating voltage (1) b (1) Maximum permissible overvoltage (transient overvoltage) Partial discharge test voltage (1) Safety maximum ratings (maximum permissible ratings in case of a fault,  also refer to diagram) Package temperature Current (input current IF, PSi = 0, TA = 25 °C) Derating with higher ambient temperature Power (output or total power dissipation, TA = 25 °C)  Derating with higher ambient temperature Tsi Isi 175 250 175 300 165 235 °C mA DISi PSi PSi -1.65 500 -3.33 -2 500 -3.33 -1.57 465 -3.1 mA/K mW mW/K Insulation resistance at TSi VI/O = 500 V RIS > 109 > 109 > 109 W Notes All voltages referred to are peak values except otherwise specified. (1) See time-test voltage diagram (2) In preparation  Testing input / output voltage requires all input pins and all output pins to be shorted Option 1: Tested per DIN EN 60747-5-2 (VDE 0884) / DIN EN 60747-5-5 (pending) Option 6: Wide lead spacing (10.16 mm creepage / clearance distances > 8 mm) Option 7: Surface mount leads (creepage / clearance distances > 8 mm) Option 8: Surface mount leads Option 9: Surface mount leads See CECC 00802, edition 1, for soldering conditions for SMT devices (option 7 and 9). “-..” means dash selections Rev. 2.0, 24-Aug-15 Document Number: 83713 4 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Option Information www.vishay.com Vishay Semiconductors OPTION 6 DIP OPTOCOUPLERS WITH 0.4" (10.16 mm) LEAD SPREAD The leads of the optocouplers are bent according to a spacing of 0.4" (10.16 mm). Dimensions deviating from the standard type are: Lead spacing 10.16 mm (0.4") Creepage distance > 8 mm Clearance > 8 mm VRMS or DC 7.62 typ. 3.5 ± 0.3 This version additionally complies with the following standards: 0.1 min. • IEC 60950 DIN VDE 0805/05 90 (System 2 and 3 only) Reinforced insulation up to an operating voltage of 400 2.55 ± 0.25 10.16 typ. 20802-5 Clearance-creepage distance = 8 mm min.  See standard version for pin configuration OPTION 7 LEAD BENDS FOR SURFACE MOUNT OPTOCOUPLERS These optocouplers are suitable for surface mounting. Dimensions deviating from the standard type are: Creepage distance > 8 mm Clearance distance > 8 mm DIP 6 7.62 typ. 0.7 min. This version additionally complies with the following standards: 4.6 4.1 8 min. • IEC 60950 DIN VDE 0805/05 90 (system 2 and 3 only) Reinforced insulation up to an operating voltage of 400 VRMS or DC 8.4 min. 10.3 max. During the soldering process, the package should not be wetted with tin-lead solder to prevent the impairment of the isolation features. Apart from iron soldering, only reflow soldering methods (vapor phase, infrared and hot gas) are permissible. 7.62 typ. 3.81 3.30 DIP 4, DIP 8, DIP 16 0.90 0.51 Permissible soldering conditions for SMD bending options: please see reflow soldering profile. 8.41 min. The soldering process may be repeated two times at the most. Attention must be paid to the cooling down of the device to 25 °C between the soldering processes. 10.3 max. 12.30 ± 0.30 Wide Body, Option 7 9.00 ± 0.15 0.25 ± 0.05 0.75 ± 0.25 11.0 max. 10.16 min. 1.00 ± 0.15 Lead coplanarity: max. 0.10 Clearance and creepage distances must be considered for the solder pad design. Clearance-creepage distance = 8 mm min. See standard version for pin configuration. Rev. 2.0, 24-Aug-15 Document Number: 83713 5 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Option Information www.vishay.com Vishay Semiconductors OPTION 8 LEAD BENDS FOR SURFACE MOUNT OPTOCOUPLERS These optocouplers are suitable for surface mounting. Dimensions deviating from the standard type are: 7.62 typ. Creepage distance > 8 mm Clearance distance > 8 mm DIP 6 0.50 0.00 This version additionally complies with the following standards: • IEC 60950 DIN VDE 0805/05 90 (system 2 and 3 only) Reinforced insulation up to an operating voltage of 400 VRMS or DC 3.81 3.30 9.27 min. 12 max. During the soldering process, the package should not be wetted with tin-lead solder to prevent the impairment of the isolation features. Apart from iron soldering, only reflow soldering methods (vapor phase, infrared and hot gas) are permissible. 7.62 typ. Permissible soldering conditions for SMD bending options: please see reflow soldering profile. 0.50 0.00 The soldering process may be repeated two times at the most. Attention must be paid to the cooling down of the device to 25 °C between the soldering processes. DIP 4 3.81 3.30 9.27 min. 12 max. 17932-1 Clearance and creepage distances must be considered for the solder pad design. Clearance-creepage distance = 8 mm min. See standard version for pin configuration. OPTION 9 LEAD BENDS FOR SURFACE MOUNT OPTOCOUPLERS During the soldering process, the package should not be wetted with tin-lead solder to prevent the impairment of the isolation features. Apart from iron soldering, only reflow soldering methods (vapor phase, infrared and hot gas) are permissible. Permissible soldering conditions for SMD bending options: please see reflow soldering profile. The soldering process may be repeated two times at the most. Attention must be paid to the cooling down of the device to 25 °C between the soldering processes.  9.53 10.03 7.62 ref. 0.102 0.249 0.30 typ. 0.51 1.02 15° max. 17933-1 Rev. 2.0, 24-Aug-15 Document Number: 83713 6 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Option Information www.vishay.com Vishay Semiconductors MARKINGS Product marking is defined in the datasheets. In the cases where marking is not defined in the datasheet, the following table defines the option information that is marked on the product. OPTION TYPE MARKING X001, X001T X001, X1 (1) X006 No mark X007, X007T X007 X008, X008T X008 X009, X009T No mark X016 X001 X017, X017T X017 X018, X018T X018 X019, X019T X001 Note (1) X1 is used on the SOP and SOIC-8 where there are space constraints. Rev. 2.0, 24-Aug-15 Note The information in this document provides generic information on options but for specific information on a product the appropriate product datasheet should be used.                   Document Number: 83713 7 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000