Si1033X
Vishay Siliconix
P-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
- 20
RDS(on) ()
ID (mA)
8 at VGS = - 4.5 V
- 150
12 at VGS = - 2.5 V
- 125
15 at VGS = - 1.8 V
- 100
20 at VGS = - 1.5 V
- 30
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET: 1.5 V Rated
• High-Side Switching
• Low On-Resistance: 8
• Low Threshold: 0.9 V (typ.)
• Fast Switching Speed: 45 ns (typ.)
• 1.5 V Operation
• Gate-Source ESD Protected: 2000 V
• Compliant to RoHS Directive 2002/95/EC
SC-89
BENEFITS
S1
1
6
D1
G1
2
5
G2
D2
3
4
S2
•
•
•
•
•
Marking Code: K
Ease in Driving Switches
Low Offset (Error) Voltage
Low-Voltage Operation
High-Speed Circuits
Low Battery Voltage Operation
APPLICATIONS
Top View
Ordering Information: Si1033X-T1-GE3 (Lead (Pb)-free and Halogen-free)
• Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories
• Battery Operated Systems
• Power Supply Converter Circuits
• Load/Power Switching Cell Phones, Pagers
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
5s
Steady State
Drain-Source Voltage
VDS
- 20
Gate-Source Voltage
VGS
±5
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 85 °C
Pulsed Drain Currentb
Operating Junction and Storage Temperature Range
Gate-Source ESD Rating (HBM, Method 3015)
IS
TA = 25 °C
TA = 85 °C
PD
V
- 155
- 145
- 110
- 105
IDM
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
ID
Unit
- 650
- 450
- 380
280
250
145
130
mA
mW
TJ, Tstg
- 55 to 150
°C
ESD
2000
V
Notes:
a. Surface mounted on FR4 board.
b. Pulse width limited by maximum junction temperature.
Document Number: 71428
S10-2544-Rev. C, 08-Nov-10
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Si1033X
Vishay Siliconix
SPECIFICATIONS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
VGS(th)
VDS = VGS, ID = - 250 µA
- 0.40
Typ.a
Max.
Unit
- 1.20
V
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State
± 0.5
±1
VDS = 0 V, VGS = ± 4.5 V
±1
±2
VDS = - 16 V, VGS = 0 V
-1
- 500
VDS = - 16 V, VGS = 0 V, TJ = 85 °C
VDS = - 5 V, VGS = - 4.5 V
RDS(on)
Resistancea
VDS = 0 V, VGS = ± 2.8 V
- 10
8
VGS = - 2.5 V, ID = - 125 mA
12
VGS = - 1.8 V, ID = - 100 mA
15
Diode Forward
Voltagea
VDS = - 10 V, ID = - 150 mA
VSD
IS = - 150 mA, VGS = 0 V
µA
mA
VGS = - 4.5 V, ID = - 150 mA
gfs
nA
- 200
VGS = - 1.5 V, ID = - 30 mA
Forward Transconductancea
µA
20
0.4
S
- 1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
1500
VDS = - 10 V, VGS = - 4.5 V, ID = - 150 mA
55
VDD = - 10 V, RL = 65
ID - 150 mA, VGEN = - 4.5 V, Rg = 10
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
pC
150
450
30
ns
60
30
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
0.5
500
2V
VGS = 5 V thru 2.5 V
TJ = - 55 °C
400
I D - Drain Current (mA)
I D - Drain Current (A)
0.4
1.8 V
0.3
0.2
0.1
25 °C
300
125 °C
200
100
0.0
0
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2
1
2
3
4
5
6
0
0.0
VDS - Drain-to-Source Voltage (V)
0.5
1.0
1.5
2.0
2.5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
3.0
Document Number: 71428
S10-2544-Rev. C, 08-Nov-10
Si1033X
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
25
120
VGS = 0 V
f = 1 MHz
100
20
C - Capacitance (pF)
RDS(on) - On-Resistance ()
VGS = 1.8 V
15
VGS = 2.5 V
10
Ciss
80
60
40
VGS = 4.5 V
5
Coss
20
0
Crss
0
0
200
400
600
ID - Drain Current (mA)
800
1000
0
4
8
12
16
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
5
1.6
VDS = 10 V
ID = 150 mA
4
RDS(on) - On-Resistance (Ω)
(Normalized)
VGS - Gate-to-Source Voltage (V)
20
3
2
1
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.4
VGS = 4.5 V
ID = 150 mA
1.2
VGS = 1.8 V
ID = 125 mA
1.0
0.8
0.6
- 50
1.6
- 25
Qg - Total Gate Charge (nC)
0
25
50
75
100
TJ - Junction Temperature (°C)
125
On-Resistance vs. Junction Temperature
Gate Charge
50
1000
RDS(on) - On-Resistance ()
I S - Source Current (mA)
TJ = 125 °C
100
TJ = 25 °C
TJ = - 55 °C
10
40
ID = 150 mA
30
20
10
ID = 125 mA
1
0.0
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD - Source-to-Drain Voltage (V)
Surge-Drain Diode Forward Voltage
Document Number: 71428
S10-2544-Rev. C, 08-Nov-10
1.4
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
6
On-Resistance vs. Gate-to-Source Voltage
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Si1033X
Vishay Siliconix
TYPICAL CHARACTERISTICS TA = 25 °C, unless otherwise noted)
0.3
3.0
2.5
ID = 0.25 mA
0.1
2.0
I GSS - ( µA)
V GS(th) Variance (V)
0.2
- 0.0
1.5
- 0.1
1.0
- 0.2
0.5
- 0.3
- 50
- 25
0
25
50
75
100
125
0.0
- 50
VGS = 2.8 V
- 25
0
25
50
75
TJ - Temperature (°C)
Threshold Voltage Variance vs. Temperature
IGSS vs. Temperature
BVGSS - Gate-to-Source Breakdown Voltage (V)
TJ - Tempserature (°C)
100
125
0
-1
-2
-3
-4
-5
-6
-7
- 50
- 25
0
25
50
75
TJ - Temperature (°C)
100
125
BVGSS vs. Temperature
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 500 °C/W
0.02
3. T JM - T A = PDMZthJA(t)
Single Pulse
0.01
10-4
10-3
4. Surface Mounted
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71428.
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Document Number: 71428
S10-2544-Rev. C, 08-Nov-10
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Revision: 01-Jan-2022
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Document Number: 91000