Si2301BDS
Vishay Siliconix
P-Channel 2.5 V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) ()
ID (A)b
0.100 at VGS = - 4.5 V
- 2.4
0.150 at VGS = - 2.5 V
- 2.0
VDS (V)
- 20
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• 100 % Rg Tested
• Compliant to RoHS Directive 2002/95/EC
TO-236
(SOT-23)
G
1
3
S
D
2
Top View
Si2301 BDS (L1)*
* Marking Code
Ordering Information: Si2301BDS-T1-E3 (Lead (Pb)-free)
Si2301BDS-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
5s
Steady State
Drain-Source Voltage
VDS
- 20
Gate-Source Voltage
VGS
±8
Continuous Drain Current (TJ = 150 °C)b
TA = 25 °C
TA = 70 °C
Pulsed Drain Currenta
IS
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
PD
V
- 2.4
- 2.2
- 1.9
- 1.8
IDM
Continuous Source Current (Diode Conduction)b
Power Dissipationb
ID
A
- 10
- 0.72
- 0.6
0.9
0.7
0.57
0.45
TJ, Tstg
Unit
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb
Maximum Junction-to-Ambientc
Symbol
RthJA
Typical
Maximum
120
145
140
175
Unit
°C/W
Notes:
a. Pulse width limited by maximum junction temperature.
b. Surface mounted on FR4 board, t 5 s.
c. Surface mounted on FR4 board.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 72066
S11-2044-Rev. F, 17-Oct-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si2301BDS
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Limits
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
VDS
VGS = 0 V, ID = - 250 µA
- 20
VGS(th)
VDS = VGS, ID = - 250 µA
- 0.45
IGSS
VDS = 0 V, VGS = ± 8 V
± 100
VDS = - 20 V, VGS = 0 V
-1
VDS = - 20 V, VGS = 0 V, TJ = 55 °C
- 10
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltage
VDS - 5 V, VGS = - 4.5 V
-6
VDS - 5 V, VGS = - 2.5 V
-3
- 0.95
nA
µA
A
VGS - 4.5 V, ID = - 2.8 A
0.080
0.100
VGS = - 2.5 V, ID = - 2 A
0.110
0.150
gfs
VDS = - 5 V, ID = - 2.8 A
6.5
VSD
IS = - 0.75 A, VGS = 0 V
- 0.80
- 1.2
VDS = - 6 V, VGS = - 4.5 V
ID - 2.8 A
4.5
10
0.7
RDS(on)
V
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
f = 1 MHz
nC
1.1
2
8
16
375
VDS = - 6 V, VGS = 0 V, f = 1 MHz
pF
95
65
c
Switching
Turn-On Time
Turn-Off Time
td(on)
tr
td(off)
tf
VDD = - 6 V, RL = 6
ID - 1 A, VGEN = - 4.5 V
Rg = 6
20
30
40
60
30
45
20
30
ns
Notes:
a. Pulse test: pulse width 300 µs duty cycle 2 %.
b. For DESIGN AID ONLY, not subject to production testing.
c. Switching time is essentially independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72066
S11-2044-Rev. F, 17-Oct-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si2301BDS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
10
10
VGS = 5 thru 2.5 V
TC = - 55 °C
8
I D - Drain Current (A)
I D - Drain Current (A)
8
2V
6
4
1.5 V
2
25 °C
125 °C
6
4
2
1V
0
0
1
2
3
4
0
0.0
5
0.5
VDS - Drain-to-Source Voltage (V)
1.0
1.5
2.0
2.5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
3.0
Transfer Characteristics
0.5
800
0.4
C - Capacitance (pF)
600
R DS(on) -
0.3
0.2
VGS = 2.5 V
Ciss
400
200
0.1
Coss
VGS = 4.5 V
Crss
0.0
0
0
2
4
6
ID - Drain Current (A)
8
10
0
4
8
On-Resistance vs. Drain Current
16
20
Capacitance
1.6
5
R DS(on) - On-Resistance (Normalized)
VDS = 10 V
ID = 2.8 A
VGS - Gate-to-Source Voltage (V)
12
VDS - Drain-to-Source Voltage (V)
4
3
2
1
0
0
1
2
3
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 72066
S11-2044-Rev. F, 17-Oct-11
4
5
VGS = 4.5 V
ID = 2.8 A
1.4
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si2301BDS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.6
10
TJ = 150 °C
0.4
ID = 2.8 A
0.3
1
R DS(on) -
I S - Source Current (A)
0.5
TJ = 25 °C
0.2
0.1
0.0
0.1
0
0.2
0.4
0.6
0.8
1.0
0
1.2
1
Source-Drain Diode Forward Voltage
3
4
5
On-Resistance vs. Gate-to-Source Voltage
10
0.4
0.3
8
0.2
Power (W)
VGS(th) Variance (V)
2
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
ID = 250 µA
0.1
6
4
0.0
TA = 25 °C
2
- 0.1
- 0.2
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.1
1
TJ - Temperature (°C)
Threshold Voltage
10
Time (s)
100
1000
Single Pulse Power
100
10 µs
100 µs
I D - Drain Current (A)
10
Limited by
RDS(on)*
1 ms
1
10 ms
TA = 25 °C
Single Pulse
100 ms
0.1
DC, 100 s, 10 s, 1 s
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS
minimum VGS at which RDS(on) is specified
Square Wave Pulse Duration (s)
Safe Operating Area
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Document Number: 72066
S11-2044-Rev. F, 17-Oct-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si2301BDS
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 62.5 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10 -3
10 -2
10 -1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72066.
Document Number: 72066
S11-2044-Rev. F, 17-Oct-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
SOT-23 (TO-236): 3-LEAD
b
3
E1
1
E
2
e
S
e1
D
0.10 mm
C
0.004"
A2
A
C
q
Gauge Plane
Seating Plane
Seating Plane
C
A1
Dim
0.25 mm
L
L1
MILLIMETERS
Min
INCHES
Max
Min
Max
0.044
A
0.89
1.12
0.035
A1
0.01
0.10
0.0004
0.004
A2
0.88
1.02
0.0346
0.040
b
0.35
0.50
0.014
0.020
c
0.085
0.18
0.003
0.007
D
2.80
3.04
0.110
0.120
E
2.10
2.64
0.083
0.104
E1
1.20
1.40
0.047
e
0.95 BSC
e1
L
1.90 BSC
0.40
L1
q
0.0748 Ref
0.60
0.016
0.64 Ref
S
0.024
0.025 Ref
0.50 Ref
3°
0.055
0.0374 Ref
0.020 Ref
8°
3°
8°
ECN: S-03946-Rev. K, 09-Jul-01
DWG: 5479
Document Number: 71196
09-Jul-01
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Application Note 826
Vishay Siliconix
0.049
(1.245)
0.029
0.022
(0.559)
(0.724)
0.037
(0.950)
(2.692)
0.106
RECOMMENDED MINIMUM PADS FOR SOT-23
0.053
(1.341)
0.097
(2.459)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index Return to Index
APPLICATION NOTE
Document Number: 72609
Revision: 21-Jan-08
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Revision: 01-Jan-2022
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Document Number: 91000