New Product
Si4170DY
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
RDS(on) (Ω)
ID (A)a
0.0035 at VGS = 10 V
30
0.0045 at VGS = 4.5 V
27
Qg (Typ.)
29 nC
•
•
•
•
Halogen-free
TrenchFET® Power MOSFET
100 % Rg Tested
100 % Avalanche Tested
RoHS
COMPLIANT
APPLICATIONS
• Notebook PC Core
- Low Side Switch
SO-8
D
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
Top View
S
Ordering Information: Si4170DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Limit
30
± 20
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
IAS
EAS
Maximum Power Dissipation
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
PD
Operating Junction and Storage Temperature Range
V
30
22.8
21.8b, c
17.3b, c
70
ID
IDM
Pulsed Drain Current
Unit
A
5.4
2.7b, c
40
80
6
3.3
mJ
W
3.0b, c
1.9b, c
- 55 to 150
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
Parameter
t ≤ 10 s
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
Steady State
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 85 °C/W.
Document Number: 68396
S-81054-Rev. A, 12-May-08
Symbol
RthJA
RthJF
Typical
Maximum
Unit
33
16
42
21
°C/W
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New Product
Si4170DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
30
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
ID = 250 µA
VGS(th)
VDS = VGS, ID = 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
gfs
mV/°C
- 6.4
1.4
2.6
V
± 100
nA
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
10
VDS ≥ 5 V, VGS = 10 V
RDS(on)
V
33
30
µA
A
VGS = 10 V, ID = 15 A
0.0029
0.0035
VGS = 4.5 V, ID = 10 A
0.0036
0.0045
VDS = 15 V, ID = 15 A
90
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
4355
VDS = 15 V, VGS = 0 V, f = 1 MHz
256
VDS = 15 V, VGS = 10 V, ID = 20 A
VDS = 15 V, VGS = 4.5 V, ID = 20 A
VDD = 15 V, RL = 1.5 Ω
ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
0.2
0.55
1.1
15
30
10
20
65
8
16
td(on)
36
65
17
30
VDD = 15 V, RL = 1.5 Ω
ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω
tf
Fall Time
45
11.5
tf
td(off)
Turn-Off Delay Time
100
29
35
tr
Rise Time
65
nC
7.5
f = 1 MHz
td(on)
Turn-On Delay Time
pF
595
45
80
20
40
Ω
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward
Currenta
Body Diode Voltage
TC = 25 °C
IS
40
ISM
70
IS = 3 A
VSD
0.74
1.1
A
V
Body Diode Reverse Recovery Time
trr
34
65
ns
Body Diode Reverse Recovery Charge
Qrr
29
55
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
17
17
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 68396
S-81054-Rev. A, 12-May-08
New Product
Si4170DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
70
5
VGS = 10 thru 4 V
4
I D - Drain Current (A)
I D - Drain Current (A)
56
42
28
VGS = 3 V
3
TC = 125 °C
2
TC = 25 °C
14
1
0
0
TC = - 55 °C
0
1
2
3
4
5
0
1
4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
5
5500
VGS = 4.5 V
Ciss
0.0036
4400
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
3
VDS - Drain-to-Source Voltage (V)
0.0040
0.0032
0.0028
VGS = 10 V
3300
2200
0.0024
1100
0.0020
0
0
14
28
42
56
70
Coss
Crss
0
6
12
18
24
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
30
1.7
10
ID = 20 A
VDS = 10 V
ID = 15 A
1.5
8
VDS = 15 V
VDS = 20 V
6
4
VGS = 10 V
(Normalized)
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
2
1.3
VGS = 4.5 V
1.1
0.9
2
0
0
14
28
42
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 68396
S-81054-Rev. A, 12-May-08
56
70
0.7
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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New Product
Si4170DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.015
100
ID = 15 A
TJ = 150 °C
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
10
TJ = 25 °C
1
0.1
0.01
0.012
0.009
0.006
TJ = 125 °C
0.003
TJ = 25 °C
0.000
0.2
0.4
0.6
0.8
1.0
1.2
0
2
4
6
8
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.6
200
0.3
160
Power (W)
V GS(th) Variance (V)
0.001
0.0
0.0
ID = 5 mA
- 0.3
- 0.6
10
120
80
40
ID = 250 µA
- 0.9
- 50
0
- 25
0
25
50
75
100
125
150
0.001
0.01
0.1
1
10
Time (s)
TJ - Temperature (°C)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
Limited by RDS(on)*
I D - Drain Current (A)
10
1 ms
10 ms
100 ms
1
1s
10 s
0.1
DC
BVDSS
TA = 25 °C
Single Pulse
0.01
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 68396
S-81054-Rev. A, 12-May-08
New Product
Si4170DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
35
I D - Drain Current (A)
28
21
14
7
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
7.5
1.80
6.0
1.44
Power (W)
Power (W)
Current Derating*
4.5
3.0
1.08
0.72
0.36
1.5
0.00
0.0
0
25
50
75
100
125
150
0
25
50
75
100
125
TC - Case Temperature (°C)
TA - Ambient Temperature (°C)
Power, Junction-to-Foot
Power, Junction-to-Ambient
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 68396
S-81054-Rev. A, 12-May-08
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New Product
Si4170DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 85 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?68396.
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Document Number: 68396
S-81054-Rev. A, 12-May-08
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Revision: 01-Jan-2022
1
Document Number: 91000