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SI4435DY
30V P-Channel PowerTrench MOSFET
General Description
Features
This P-Channel MOSFET is a rugged gate version of
Fairchild Semiconductor’s advanced PowerTrench
process. It has been optimized for power management
applications requiring a wide range of gave drive
voltage ratings (4.5V – 25V).
• –8.8 A, –30 V
Applications
• Fast switching speed
• Power management
• High performance trench technology for extremely
low RDS(ON)
RDS(ON) = 20 mΩ @ V GS = –10 V
RDS(ON) = 35 mΩ @ V GS = –4.5 V
• Low gate charge (17nC typical)
• Load switch
• Battery protection
• High power and current handling capability
DD
DD
DD
DD
SO-8
G
G
S
SS S
SS
Pin 1 SO-8
Absolute Maximum Ratings
Symbol
5
4
6
3
7
2
8
1
TA=25oC unless otherwise noted
Ratings
Units
V DSS
Drain-Source Voltage
Parameter
–30
V
V GSS
Gate-Source Voltage
±20
V
ID
Drain Current
–8.8
A
– Continuous
(Note 1a)
– Pulsed
PD
–50
Power Dissipation for Single Operation
TJ , TSTG
(Note 1a)
2.5
(Note 1b)
1.2
(Note 1c)
1
Operating and Storage Junction Temperature Range
W
–55 to +175
°C
Thermal Characteristics
RθJA
Thermal Resistance, Junction-to-Ambient
(Note 1a)
50
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
(Note 1c)
125
°C/W
RθJ C
Thermal Resistance, Junction-to-Case
(Note 1)
25
°C/W
Package Marking and Ordering Information
Device
Device Marking
Reel Size
Tape width
Quantity
SI4435DY
4435
13’’
12mm
2500 units
2018 Semiconductor Components Industries, LLC.
SI4435DY Rev 4
SI4435DY
December 2018
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min
Typ
Max Units
Off Characteristics
BV DSS
∆BV DSS
∆TJ
IDSS
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
V GS = 0 V, ID = –250 µA
V DS = –24 V,
V GS = 0 V
–1
µA
IGSSF
IGSSR
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
V GS = 20 V,
V GS = –20 V,
V DS = 0 V
V DS = 0 V
100
–100
nA
nA
–3
V
On Characteristics
–30
ID = –250 µA, Referenced to 25°C
V
–21
mV/°C
(Note 2)
V GS(th)
∆V GS(th)
∆TJ
RDS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
V DS = V GS , ID = –250 µA
ID = –250 µA, Referenced to 25°C
ID(on)
On–State Drain Current
V GS = –10 V,
V DS = –5 V
gFS
Forward Transconductance
V DS = –5 V,
ID = –8.8 A
24
S
V DS = –15 V,
f = 1.0 MHz
V GS = 0 V,
1604
pF
408
pF
202
pF
–1
–1.7
5
V GS = –10 V,
ID = –8.8 A
V GS = –4.5 V, ID = –6.7 A
V GS = –10 V, ID = –8.8A, TJ =125°C
15
22
19
mV/°C
20
35
32
mΩ
–40
A
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
V DD = –15 V,
V GS = –10 V,
V DS = –15 V,
V GS = –5 V
ID = –1 A,
RGEN = 6 Ω
ID = –8.8 A,
13
23
ns
13.5
24
ns
42
68
ns
25
40
ns
17
24
nC
5
nC
6
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
V SD
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
V GS = 0 V, IS = –2.1 A
Voltage
(Note 2)
–0.73
–2.1
A
–1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 50°C/W when
mounted on a 1in2
pad of 2 oz copper
b) 105°C/W when
mounted on a .04 in2
pad of 2 oz copper
c) 125°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
SI4435DY Rev 4
SI4435DY
Electrical Characteristics
SI4435DY
Typical Characteristics
2
-ID, DRAIN CURRENT (A)
VGS = -10V
-6.0V
40
-4.5V
V
RDS(ON), NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
50
-4.0V
30
-3.5V
20
-3.0V
10
0
V GS=-4.5V
1.8
1.6
-4.5V
-5.0V
1.4
-6.0V
1.2
-7.0V
-8.0V
-10V
1
0.8
0
1
2
3
0
10
-V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 1. On-Region Characteristics.
40
50
0.07
ID = -8.8A
V GS = -10V
ID = -4.4A
RDS(ON), ON-RESISTANCE (OHM)
RDS(ON), NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
30
Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
1.6
1.4
1.2
1
0.8
0.6
0.06
0.05
0.04
TA = 125 oC
0.03
0.02
T A = 25o C
0.01
-50
-25
0
25
50
75
100
125
150
175
2
4
6
8
10
-V GS, GATE TO SOURCE VOLTAGE (V)
T J, JUNCTION TEMPERATURE ( oC)
Figure 3. On-Resistance Variation with
Temperature.
Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
100
V DS = -5V
o
T A = -55 C
-IS , REVERSE DRAIN CURRENT (A)
40
-I D, DRAIN CURRENT (A)
20
-I D, DRAIN CURRENT (A)
25o C
30
125oC
20
10
0
1.5
2
2.5
3
3.5
-V GS, GATE TO SOURCE VOLTAGE (V)
Figure 5. Transfer Characteristics.
4
V GS =0V
10
T A = 125o C
1
25o C
0.1
-55o C
0.01
0.001
0.0001
0
0.2
0.4
0.6
0.8
1
1.2
-V SD , BODY DIODE FORWARD VOLTAGE (V)
Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
SI4435DY Rev 4
SI4435DY
Typical Characteristics
2500
V DS = -5V
ID = -8.8A
f = 1 MHz
V GS = 0 V
-10V
8
2000
-15V
CAPACITANCE (pF)
-V GS, GATE-SOURCE VOLTAGE (V)
10
6
4
2
CISS
1500
1000
COSS
500
CRSS
0
0
0
6
12
18
24
30
0
5
Qg, GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
15
20
25
30
Figure 8. Capacitance Characteristics.
50
RDS(ON) LIMIT
P(pk), PEAK TRANSIENT POWER (W)
100
-ID, DRAIN CURRENT (A)
10
-V DS, DRAIN TO SOURCE VOLTAGE (V)
100µ s
1ms
10ms
10
100ms
1s
1
10s
DC
V GS = -10V
SINGLE PULSE
Rθ JA = 125o C/W
0.1
T A = 25o C
0.01
0.1
1
10
SINGLE PULSE
RθJA = 125°C/W
TA = 25°C
40
30
20
10
0
0.001
100
0.01
-V DS , DRAIN-SOURCE VOLTAGE (V)
1
10
100
1000
t 1, TIME (sec)
Figure 9. Maximum Safe Operating Area.
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
0.1
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
RθJA(t) = r(t) + RθJA
o
0.2
0.1
RθJA = 125 C/W
0.1
0.05
P(pk)
0.02
t1
0.01
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1 / t2
0.01
SINGLE PULSE
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
SI4435DY Rev 4
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx
Bottomless
CoolFET
CROSSVOLT
DenseTrench
DOME
EcoSPARK
E2CMOSTM
EnSignaTM
FACT
FACT Quiet Series
FAST â
FASTr
FRFET
GlobalOptoisolator
GTO
HiSeC
I2C
ISOPLANAR
LittleFET
MicroFET
MicroPak
MICROWIRE
OPTOLOGIC â
OPTOPLANAR
PACMAN
POP
Power247
PowerTrench â
QFET
QS
QT Optoelectronics
Quiet Series
SILENT SWITCHER â UHC
SMART START
UltraFET â
SPM
VCX
STAR*POWER
Stealth
SuperSOT-3
SuperSOT-6
SuperSOT-8
SyncFET
TinyLogic
TruTranslation
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
2. A critical component is any component of a life
1. Life support devices or systems are devices or
support device or system whose failure to perform can
systems which, (a) are intended for surgical implant into
be reasonably expected to cause the failure of the life
the body, or (b) support or sustain life, or (c) whose
support device or system, or to affect its safety or
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
effectiveness.
reasonably expected to result in significant injury to the
user.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. H5
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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