Si6562DQ
Vishay Siliconix
N- and P-Channel 2.5-V (G-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
ID (A)
0.030 at VGS = 4.5 V
± 4.5
0.040 at VGS = 2.5 V
± 3.9
RoHS*
0.050 at VGS = - 4.5 V
± 3.5
COMPLIANT
0.085 at VGS = - 2.5 V
± 2.7
20
P-Channel
- 20
• Halogen-free Option Available
• TrenchFET® Power MOSFETS: 2.5 V Rated
RDS(on) (Ω)
Pb-free
Available
D1
S2
TSSOP-8
D1
1
S1
2
Si6562DQ
8
D2
7
S2
S1
3
6
S2
G1
4
5
G2
G2
G1
Top View
Ordering Information: Si6562DQ-T1
Si6562DQ-T1-GE3 (Lead (Pb)-free and Halogen-free)
S1
D2
N-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
VDS
20
- 20
Gate-Source Voltage
VGS
± 12
± 12
± 4.5
± 3.5
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
ID
± 3.6
± 2.7
IDM
± 30
± 30
IS
1.25
- 1.25
PD
1.0
0.64
Unit
V
A
W
TJ, Tstg
- 55 to 150
Symbol
RthJA
N- or P-Channel
Unit
125
°C/W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Notes:
a. Surface Mounted on FR4 board, t ≤ 10 s.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 70720
S-81056-Rev. C, 12-May-08
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Si6562DQ
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
VGS(th)
VDS = VGS, ID = 250 µA
N-Ch
0.6
VDS = VGS, ID = - 250 µA
P-Ch
- 0.6
VDS = 0 V, VGS = ± 12 V
IGSS
VDS = 20 V, VGS = 0 V
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
IDSS
V
N-Ch
± 100
P-Ch
± 100
N-Ch
1
VDS = - 20 V, VGS = 0 V
P-Ch
-1
VDS = 20 V, VGS = 0 V, TJ = 55 °C
N-Ch
25
VDS = - 20 V, VGS = 0 V, TJ = 55 °C
P-Ch
- 25
VDS ≥ 5 V, VGS = 4.5 V
N-Ch
30
VDS ≥ - 5 V, VGS = - 4.5 V
P-Ch
- 30
VGS = 4.5 V, ID = 4.5 A
N-Ch
0.023
0.030
VGS = - 4.5 V, ID = - 3.5 A
P-Ch
0.040
0.050
VGS = 2.5 V, ID = 3.9 A
N-Ch
0.030
0.040
VGS = - 2.5 V, ID = - 2.7 A
P-Ch
0.060
0.085
ID(on)
RDS(on)
gfs
VSD
nA
µA
A
VDS = 10 V, ID = 4.5 A
N-Ch
20
VDS = - 10 V, ID = - 3.5 A
P-Ch
10
IS = 1.25 A, VGS = 0 V
N-Ch
0.65
1.2
IS = - 1.25 A, VGS = 0 V
P-Ch
0.72
- 1.2
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Rise Time
Turn-Off Delay Time
tr
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
N-Channel
VDS = 15 V, VGS = 4.5 V, ID = 4.5 A
P-Channel
VDS = - 15 V, VGS = - 4.5 V, ID = - 3.5 A
N-Channel
VDD = 10 V, RL = 10 Ω
ID ≅ 1 A, VGEN = 10 V, RG = 6 Ω
P-Channel
VDD = - 10 V, RL = 10 Ω
ID ≅ - 1 A, VGEN = - 10 V, RG = 6 Ω
N-Ch
13
25
P-Ch
14.5
25
N-Ch
3.0
P-Ch
3.5
N-Ch
3.3
P-Ch
3.5
nC
N-Ch
22
50
P-Ch
27
50
N-Ch
40
80
P-Ch
30
60
N-Ch
50
100
P-Ch
57
100
N-Ch
20
40
P-Ch
21
40
IF = 1.25 A, dI/dt = 100 A/µs
N-Ch
30
60
IF = - 1.25 A, dI/dt = 100 A/µs
P-Ch
60
100
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 70720
S-81056-Rev. C, 12-May-08
Si6562DQ
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
30
30
VGS = 5 thru 3 V
2.5 V
24
I D - Drain Current (A)
I D - Drain Current (A)
24
18
12
2V
6
18
12
TC = 125 °C
6
25 °C
1.5 V
- 55 °C
0
0
0
2
4
6
8
0
10
0.5
1.0
1.5
2.0
2.5
3.0
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.08
2100
Ciss
0.06
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
1800
VGS = 2.5 V
0.04
VGS = 4.5 V
0.02
1500
1200
900
600
Coss
300
Crss
0
0
0
6
12
18
24
0
30
4
ID - Drain Current (A)
8
16
20
VDS - Drain-to-Source V oltage (V)
On-Resistance vs. Drain Current
Capacitance
1.8
4.5
1.6
2.7
1.8
0.9
VGS = 4.5 V
ID = 4.5 A
1.4
(Normalized)
VDS = 10 V
ID = 4.5 A
3.6
R DS(on) - On-Resistance
V GS - Gate-to-Source Voltage (V)
12
1.2
1.0
0.8
0.6
0
0
3
6
9
12
15
0.4
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (° C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 70720
S-81056-Rev. C, 12-May-08
150
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Si6562DQ
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
R DS(on) - On-Resistance (Ω)
0.10
I S - Source Current (A)
10
TJ = 150 °C
TJ = 25 °C
0.08
ID = 4.5 A
0.06
0.04
0.02
0
0
0
0.2
0.4
0.6
0.8
1.0
1.2
0
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.4
40
32
0.0
24
Power (W)
V GS(th) Variance (V)
ID = 250 µA
0.2
- 0.2
16
8
- 0.4
- 0.6
- 50
- 25
0
25
50
75
100
125
0
150
0.01
0.1
1
10
30
Time (s)
TJ - Temperature (° C)
Threshold Voltage
Single Pulse Power
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
0.05
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 125 ° C/W
0.02
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
1
10
30
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 70720
S-81056-Rev. C, 12-May-08
Si6562DQ
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
30
20
3V
VGS = 5, 4.5, 4, 3,5 V
16
I D - Drain Current (A)
I D - Drain Current (A)
24
2.5 V
18
12
2V
6
12
8
TC = 125 °C
4
25 °C
1.5 V
0
0
2
4
6
8
10
0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.20
2500
0.16
2000
3.0
Ciss
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
0
VGS = 2.5 V
0.12
VGS = 4.5 V
0.08
1500
1000
0.04
500
0
0
0
6
12
18
24
30
Coss
Crss
0
4
ID - Drain Current (A)
8
12
16
20
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
1.8
4.5
VDS = 10 V
ID = 3.5 A
1.6
2.7
1.8
VGS = 4.5 V
ID = 3.5 A
1.4
(Normalized)
3.6
RDS(on) - On-Resistance
V GS - Gate-to-Source Voltage (V)
- 55 °C
1.2
1.0
0.8
0.9
0.6
0
0
3
6
9
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 70720
S-81056-Rev. C, 12-May-08
12
15
0.4
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si6562DQ
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.20
10
RDS(on) - On-Resistance (Ω)
I S - Source Current (A)
30
TJ = 150 °C
TJ = 25 °C
0.16
0.12
0.08
ID = 4.5 A
0.04
1
0.00
0
0.25
0.50
0.75
1.00
1.25
1.50
0
VSD - Source-to-Drain Voltage (V)
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
0.8
40
ID = 250 µA
0.6
30
Power (W)
V GS(th) Variance (V)
0.4
0.2
0.0
20
- 0.2
10
- 0.4
- 0.6
- 50
- 25
0
25
50
75
100
125
0
150
0.01
0.1
1
TJ - Temperature (° C)
10
30
Time (s)
Single Pulse Power
Threshold Voltage
2
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 125 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
0.01
10- 4
10- 3
4. Surface Mounted
10- 2
10- 1
1
10
30
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?70720.
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Document Number: 70720
S-81056-Rev. C, 12-May-08
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Revision: 01-Jan-2022
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Document Number: 91000