Si7448DP
www.vishay.com
Vishay Siliconix
N-Channel 20 V (D-S) Fast Switching MOSFET
FEATURES
PowerPAK® SO-8 Single
D
5
D
6
D
7
D
8
6.
15
m
m
m
1
m
.15
5
Top View
4
G
Bottom View
3
S
2
S
1
S
• TrenchFET® power MOSFET
• New low thermal resistance PowerPAK®
package with low 1.07 mm profile
• 100 % Rg tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Available
APPLICATIONS
• Synchronous rectifier low output voltage
• Portable computer battery selection or protection
D
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 4.5 V
RDS(on) max. () at VGS = 2.5 V
Qg typ. (nC)
ID (A)
Configuration
20
0.0065
0.0090
38
22
Single
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free
Lead (Pb)-free and halogen-free
PowerPAK SO-8
Si7448DP-T1-E3
Si7448DP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
10 s
STEADY STATE
Drain-source voltage
VDS
20
20
Gate-source voltage
VGS
± 12
± 12
TA = 25 °C
Continuous drain current (TJ = 150 °C) a
TA = 70 °C
Pulsed drain current
Continuous source current (diode conduction) a
TA = 25 °C
Maximum power dissipation a
TA = 70 °C
Operating junction and storage temperature range
22
13.4
17.6
10.7
IDM
50
50
IS
4.3
1.6
5.2
1.9
3.3
1.2
ID
PD
TJ, Tstg
-55 to +150
Soldering recommendations (peak temperature) b, c
UNIT
V
A
W
°C
260
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient a
Maximum junction-to-case (drain)
SYMBOL
t 10 s
Steady state
Steady state
RthJA
RthJC
TYPICAL
MAXIMUM
19
24
52
65
1.5
1.8
UNIT
°C/W
Notes
a. Surface mounted on 1" x 1" FR4 board
b. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
S09-0270-Rev. D, 16-Feb-09
Document Number: 71635
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si7448DP
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Gate threshold voltage
VGS(th)
VDS = VGS, ID = 250 μA
0.6
-
1.5
V
Gate-body leakage
IGSS
VDS = 0 V, VGS = ± 12 V
-
-
± 100
nA
Zero gate voltage drain current
IDSS
VDS = 20 V, VGS = 0 V
-
-
1
VDS = 20 V, VGS = 0 V, TJ = 85°C
-
-
20
On-state drain current a
ID(on)
VDS 5 V, VGS = 4.5 V
50
-
-
VGS = 4.5 V, ID = 22 A
-
0.0054
0.0065
VGS = 2.5 V, ID = 19 A
-
0.0075
0.0090
gfs
VDS = 15 V, ID = 22 A
-
90
-
S
VSD
IS = 3 A, VGS = 0 V
-
0.8
1.2
V
-
38
50
Drain-source on-state resistance a
Forward transconductance a
Diode forward voltage
a
RDS(on)
μA
A
Dynamic b
Total gate charge
Qg
VDS = 10 V, VGS = 4.5 V, ID = 21 A
Gate-source charge
Qgs
-
8
-
Gate-drain charge
Qgd
-
8.5
-
Gate resistance
Rg
0.2
0.9
1.1
Turn-on delay time
Rise time
Turn-off delay time
td(on)
-
22
35
tr
-
22
35
td(off)
Fall time
tf
Source-drain reverse recovery time
trr
VDD = 10 V, RL = 10
ID 1 A, VGEN = 10 V, Rg = 6
IF = 3 A, di/dt = 100 A/μs
-
125
190
-
60
90
-
60
90
nC
ns
Notes
a. Pulse test: pulse width 300 μs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S09-0270-Rev. D, 16-Feb-09
Document Number: 71635
2
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si7448DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
50
5
VDS = 10 V
ID = 22 A
I D - Drain Current (A)
VGS - Gate-to-Source Voltage (V)
VGS = 4.5 V thru 2.5 V
40
2V
30
20
10
4
3
2
1
1.5 V
0
0
0
1
2
3
4
5
0
8
16
24
32
VDS - Drain-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
Output Characteristics
Gate Charge
50
40
50
I S - Source Current (A)
I D - Drain Current (A)
40
30
20
TJ = 150 °C
10
TJ = 25 °C
TC = 125 °C
10
25 °C
-55 °C
0
0.0
0.5
1.0
1.5
2.0
1
0.0
2.5
0.2
7000
0.010
6000
C - Capacitance (pF)
R DS(on) - On-Resistance ()
0.012
VGS = 2.5 V
0.006
0.6
0.8
1.0
1.2
Source-Drain Diode Forward Voltage
Transfer Characteristics
0.008
0.4
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
VGS = 4.5 V
0.004
0.002
Ciss
5000
4000
3000
2000
Coss
1000
Crss
0.000
0
0
10
20
30
40
50
0
4
8
12
16
I D - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
S09-0270-Rev. D, 16-Feb-09
20
Document Number: 71635
3
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si7448DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.6
VGS = 10 V
ID = 22 A
0.4
ID = 250 µA
1.4
0.2
VGS(th) Variance (V)
R DS(on) - On-Resistance (Normalized)
1.6
1.2
1.0
0.0
-0.2
-0.4
-0.6
0.8
-0.8
0.6
-50
-25
0
25
50
75
100
125
-1.0
-50
150
-25
0
25
TJ - Junction Temperature (°C)
75
100
125
150
TJ - Temperature (°C)
On-Resistance vs. Junction Temperature
Threshold Voltage
100
0.020
ID = 22 A
80
0.015
Power (W)
R DS(on) - On-Resistance ()
50
0.010
0.005
60
40
20
0.000
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
S09-0270-Rev. D, 16-Feb-09
0
0.001
0.01
0.1
1
10
Time (s)
Single Pulse Power, Junction-to-Ambient
Document Number: 71635
4
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si7448DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 68 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 - 4
10 - 3
10 - 2
10 - 1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71635.
S09-0270-Rev. D, 16-Feb-09
Document Number: 71635
5
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
PowerPAK® SO-8, (Single/Dual)
L
H
E2
K
E4
θ
D4
W
1
M
1
Z
2
D5
D2
e
2
D1
D
2
D
3
4
θ
4
b
3
L1
E3
θ
A1
Backside View of Single Pad
H
K
E2
E4
L
1
D1
D5
2
D2
Detail Z
K1
2
E1
E
D3 (2x) D4
c
A
θ
3
4
Notes
1. Inch will govern.
2 Dimensions exclusive of mold gate burrs.
3. Dimensions exclusive of mold flash and cutting burrs.
DIM.
A
A1
b
c
D
D1
D2
D3
D4
D5
E
E1
E2
E3
E4
e
K
K1
H
L
L1
W
M
b
D2
E3
Backside View of Dual Pad
MILLIMETERS
INCHES
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
0.97
1.04
0.41
0.28
5.15
4.90
3.76
1.50
0.57 typ.
3.98 typ.
6.15
5.89
3.66
3.78
0.75 typ.
1.27 BSC
1.27 typ.
0.61
0.61
0.13
0.25
0.125 typ.
1.12
0.05
0.51
0.33
5.26
5.00
3.91
1.68
0.038
0
0.013
0.009
0.199
0.189
0.140
0.052
0.044
0.002
0.020
0.013
0.207
0.197
0.154
0.066
6.25
5.99
3.84
3.91
0.238
0.228
0.137
0.145
0.71
0.71
0.20
12°
0.36
0.022
0.020
0.020
0.002
0°
0.006
0.041
0.016
0.011
0.203
0.193
0.148
0.059
0.0225 typ.
0.157 typ.
0.242
0.232
0.144
0.149
0.030 typ.
0.050 BSC
0.050 typ.
0.024
0.024
0.005
0.010
0.005 typ.
0.33
0.23
5.05
4.80
3.56
1.32
6.05
5.79
3.48
3.68
0.56
0.51
0.51
0.06
0°
0.15
0.246
0.236
0.151
0.154
0.028
0.028
0.008
12°
0.014
ECN: S17-0173-Rev. L, 13-Feb-17
DWG: 5881
Revison: 13-Feb-17
1
Document Number: 71655
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR PowerPAK® SO-8 Single
0.260
(6.61)
0.150
(3.81)
0.050
0.174
(4.42)
0.154
(1.27)
0.026
(0.66)
(3.91)
0.024
(0.61)
0.050
0.032
0.040
(1.27)
(0.82)
(1.02)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
Return to Index
APPLICATION NOTE
Document Number: 72599
Revision: 21-Jan-08
www.vishay.com
15
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Vishay
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Revision: 01-Jan-2022
1
Document Number: 91000