New Product
SiB412DK
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
20
RDS(on) (Ω)
ID (A)
0.034 at VGS = 4.5 V
9a
0.040 at VGS = 2.5 V
9a
0.054 at VGS = 1.8 V
a
9
• Halogen-free
• TrenchFET® Power MOSFET
• New Thermally Enhanced PowerPAK®
SC-75 Package
- Small Footprint Area
- Low On-Resistance
Qg (Typ.)
6.14 nC
RoHS
COMPLIANT
APPLICATIONS
• Load Switch, PA Switch and Battery Switch for Portable
Devices
D
• DC/DC Converter
PowerPAK SC-75-6L-Single
1
D
Marking Code
2
D
3
6
G
D
5
G
XXX
Lot Traceability
and Date code
S
D
1.60 mm
AAX
Part # code
S
1.60 mm
S
4
Ordering Information: SiB412DK-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
IDM
Pulsed Drain Current
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
ID
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
IS
PD
TJ, Tstg
Limit
20
±8
9a
9a
6.6b, c
5.29b, c
20
9a
2b, c
13
8.4
2.4b, c
1.6b, c
- 55 to 150
260
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
t≤5s
RthJA
41
51
Maximum Junction-to-Ambientb, f
°C/W
Steady State
RthJC
7.5
9.5
Maximum Junction-to-Case (Drain)
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 Board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SC-75 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 70439
S-80515-Rev. C, 10-Mar-08
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1
New Product
SiB412DK
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
20
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
ΔVDS/TJ
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
ID = 250 µA
VGS(th)
VDS = VGS, ID = 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 8 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
V
20.9
mV/°C
- 2.82
0.35
1
V
± 100
nA
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 55 °C
10
VDS ≤ 5 V, VGS = 4.5 V
15
µA
A
VGS = 4.5 V, ID = 6.6 A
0.028
0.034
VGS = 2.5 V, ID = 5.5 A
0.033
0.040
VGS = 1.8 V, ID = 1.8 A
0.045
0.054
VDS = 10 V, ID = 6.6 A
23
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
535
VDS = 10 V, VGS = 0 V, f = 1 MHz
50
VDS = 10 V, VGS = 5 V, ID = 6.6 A
VDS = 10 V, VGS = 4.5 V, ID = 6.6 A
td(off)
6.77
10.16
6.14
9.21
0.96
nC
0.96
f = 1 MHz
td(on)
tr
pF
85
VDD = 10 V, RL = 1.89 Ω
ID ≅ 5.3 A, VGEN = 4.5 V, Rg = 1 Ω
tf
Ω
3.6
6.6
9.9
16
24
50
75
14
21
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
TC = 25 °C
9
15
IS = 3.2 A, VGS = 0 V
0.8
1.2
A
V
Body Diode Reverse Recovery Time
trr
9.82
14.7
ns
Body Diode Reverse Recovery Charge
Qrr
3.47
5.2
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = 3.2 A, di/dt = 100 A/µs, TJ = 25 °C
6.46
3.36
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 70439
S-80515-Rev. C, 10-Mar-08
New Product
SiB412DK
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
5
VGS = 5 thru 2 V
4
I D - Drain Current (A)
I D - Drain Current (A)
16
12
VGS = 1.5 V
8
4
3
2
TJ = 25 °C
TJ = 125 °C
1
VGS = 1 V
TJ = - 55 °C
0
0.0
0.6
1.2
1.8
2.4
0
0.0
3.0
0.4
VDS - Drain-to-Source Voltage (V)
0.8
1.6
2.0
2.4
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.100
800
0.075
600
C - Capacitance (pF)
R DS(on) - D to S On-Resistance (Ω)
1.2
VGS = 1.8 V
0.050
VGS = 2.5 V
Ciss
400
0.025
200
VGS = 4.5 V
Coss
0.000
Crss
0
0
4
8
12
16
20
0
4
8
12
16
20
VDS - Drain-to-Source Voltage (V)
I D - Drain Current (A)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
1.8
5
1.5
4
3
VDS = 16 V
2
1
1.2
(Normalized)
VDS = 10 V
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
VGS = 4.5 V, ID = 6.6 A
VGS = 2.5 V, ID = 5.5 A
VGS = 1.8 V, ID = 1.80 A
0.9
0.6
0.3
0
0
1
2
3
4
5
6
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 70439
S-80515-Rev. C, 10-Mar-08
7
8
0.0
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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New Product
SiB412DK
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
0.10
10
0.08
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
ID = 6.6 A
TJ = 150 °C
1
TJ = 25 °C
0.1
0.01
0.001
0.0
0.06
TA = 125 °C
0.04
0.02
TA = 25 °C
0.00
0.2
0.4
0.6
0.8
1.0
0
1.2
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
VSD - Source-to-Drain Voltage (V)
Soure-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
1.0
20
0.8
0.6
Power (W)
VGS(th) (V)
15
ID = 250 µA
0.4
5
0.2
0.0
- 50
10
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
10
1
100
TJ - Temperature (°C)
Pulse (s)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
1000
100
Limited by R DS(on)*
1 ms
I D - Drain Current (A)
10
10 ms
100 ms
1
1s
10 s
0.1
DC
TA = 25 °C
Single Pulse
0.01
0.001
0.1
* VGS
1
10
100
VDS - Drain-to-Source Voltage (V)
minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Case
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Document Number: 70439
S-80515-Rev. C, 10-Mar-08
New Product
SiB412DK
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
18
16
12
12
Power (W)
I D - Drain Current (A)
15
9
8
6
4
3
0
0
0
25
50
75
100
TC - Case Temperature (°C)
Current Derating*
125
150
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Power Derating
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 70439
S-80515-Rev. C, 10-Mar-08
www.vishay.com
5
New Product
SiB412DK
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
Notes:
0.05
PDM
0.02
t1
t2
1. Duty Cycle, D =
Single Pulse
t1
t2
2. Per Unit Base = R thJA = 80 °C/W
3. T JM - TA = PDMZthJA(t)
4. Surface Mounted
0.01
10-4
10-3
10-2
10-1
1
Square Wave Pulse Duration (s)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
10-4
10-3
10-2
10-1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?70439.
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Document Number: 70439
S-80515-Rev. C, 10-Mar-08
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 01-Jan-2022
1
Document Number: 91000