SiHP21N80AEF
www.vishay.com
Vishay Siliconix
EF Series Power MOSFET With Fast Body Diode
FEATURES
D
• Low figure-of-merit (FOM) Ron x Qg
TO-220AB
• Low effective capacitance (Co(er))
• Reduced switching and conduction losses
• Avalanche energy rated (UIS)
G
G
D
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
S
S
APPLICATIONS
N-Channel MOSFET
• Server and telecom power supplies
• Switch mode power supplies (SMPS)
PRODUCT SUMMARY
• Power factor correction power supplies (PFC)
VDS (V) at TJ max.
RDS(on) typ. (Ω) at 25 °C
850
VGS = 10 V
Qg max. (nC)
71
Qgs (nC)
10
Qgd (nC)
Configuration
• Lighting
0.220
- High-intensity discharge (HID)
- Fluorescent ballast lighting
• Industrial
21
- Welding
Single
- Induction heating
- Motor drives
- Battery chargers
- Solar (PV inverters)
ORDERING INFORMATION
Package
TO-220AB
Lead (Pb)-free and halogen-free
SIHP21N80AEF-GE3
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-source voltage
VDS
800
Gate-source voltage
VGS
± 30
Continuous drain current (TJ = 150 °C)
VGS at 10 V
TC = 25 °C
TC = 100 °C
Pulsed drain current a
ID
UNIT
V
16.3
10.3
A
IDM
37
1.4
W/°C
Single pulse avalanche energy b
EAS
127
mJ
Maximum power dissipation
PD
179
W
TJ, Tstg
-55 to +150
°C
Linear derating factor
Operating junction and storage temperature range
Drain-source voltage slope
TJ = 125 °C
Reverse diode dv/dt d
Soldering recommendations (peak temperature) c
For 10 s
dv/dt
100
50
260
V/ns
°C
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature
b. VDD = 140 V, starting TJ = 25 °C, L = 28.2 mH, Rg = 25 Ω, IAS = 3.0 A
c. 1.6 mm from case
d. ISD ≤ ID, di/dt = 170 A/μs, starting TJ = 25 °C
S21-1050-Rev. B, 01-Nov-2021
Document Number: 92389
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiHP21N80AEF
www.vishay.com
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYP.
MAX.
Maximum junction-to-ambient
RthJA
-
62
Maximum junction-to-case (drain)
RthJC
-
0.7
UNIT
°C/W
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-source breakdown voltage
VDS temperature coefficient
Gate-source threshold voltage (N)
VDS
VGS = 0 V, ID = 250 μA
800
-
-
V
ΔVDS/TJ
Reference to 25 °C, ID = 1 mA
-
0.8
-
V/°C
VGS(th)
VDS = VGS, ID = 250 μA
2.0
-
4.0
V
VGS = ± 20 V
-
-
± 100
nA
VGS = ± 30 V
-
-
±1
μA
Gate-source leakage
IGSS
Zero gate voltage drain current
IDSS
VDS = 640 V, VGS = 0 V
-
-
1
μA
VDS = 640 V, VGS = 0 V, TJ = 125 °C
-
-
2
mA
-
0.220
0.250
Ω
gfs
VDS = 30 V, ID = 11 A
-
8.7
-
S
Input capacitance
Ciss
1511
-
Coss
-
58
-
Reverse transfer capacitance
Crss
VGS = 0 V,
VDS = 100 V,
f = 1 MHz
-
Output capacitance
-
5
-
Effective output capacitance, energy
related a
Co(er)
-
44
-
Effective output capacitance, time
related b
Co(tr)
-
271
-
Drain-source on-state resistance
Forward transconductance a
RDS(on)
VGS = 10 V
ID = 8.5 A
Dynamic
pF
VDS = 0 V to 480 V, VGS = 0 V
Total gate charge
Qg
Gate-source charge
Qgs
VGS = 10 V
ID = 11 A, VDS = 640 V
-
47
71
-
10
-
Gate-drain charge
Qgd
-
21
-
Turn-on delay time
td(on)
-
18
36
VDD = 640 V, ID = 11 A,
VGS = 10 V, Rg = 9.1 Ω
-
28
56
-
44
88
-
43
86
f = 1 MHz, open drain
0.2
0.5
1.0
-
-
16.3
-
-
37
Rise time
Turn-off delay time
tr
td(off)
Fall time
tf
Gate input resistance
Rg
nC
ns
Ω
Drain-Source Body Diode Characteristics
Continuous source-drain diode current
IS
Pulsed diode forward current
ISM
Diode forward voltage
VSD
Reverse recovery time
trr
Reverse recovery charge
Qrr
Reverse recovery current
IRRM
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
A
G
TJ = 25 °C, IS = 11 A, VGS = 0 V
TJ = 25 °C, IF = IS = 11 A,
di/dt = 100 A/μs, VR = 400 V
S
-
-
1.2
V
-
128
256
ns
-
0.8
1.6
μC
-
12
-
A
Notes
e. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 V to 480 V
f. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 V to 480 V
S21-1050-Rev. B, 01-Nov-2021
Document Number: 92389
2
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiHP21N80AEF
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
6V
100
10
5V
1.5
VGS = 10 V
0
5
10
15
100
1.0
0.5
10
0
10
0
1000
2.0
20
-60 -40 -20 0
20 40 60 80 100 120 140 160
VDS - Drain-to-Source Voltage (V)
TJ - Junction Temperature (°C)
Fig. 1 - Typical Output Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
Axis Title
15 V
14 V
13 V
12 V
11 V
10 V
9V
7V
10000
TJ = 150 °C
Ciss
6V
1000
12
100
5V
6
1000
2nd line
C - Capacitance (pF)
18
Axis Title
10 000
10000
1st line
2nd line
2nd line
ID - Drain-to-Source Current (A)
24
5
10
15
VGS = 0 V, f = 1 MHz
Ciss = Cgs + Cgd, Cds shorted
Crss = Cgd
Coss = Cds + Cgd
100
100
Crss
10
1
20
0
100
200
300
400
500
600
VDS - Drain-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Fig. 2 - Typical Output Characteristics
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Axis Title
Axis Title
TJ = 25 °C
30
1st line
2nd line
1000
20
TJ = 150 °C
100
10
12
10 000
10000
2nd line
Coss - Output Capacitance (pF)
40
2nd line
ID - Drain-to-Source Current (A)
1000
Coss
10
10
0
0
1st line
2nd line
1000
2.5
1st line
2nd line
20
7V
ID = 11 A
9
1000
Coss
6
Eoss
100
3
VDS = 29.2 V
10
0
0
5
10
15
20
10
0
0
100
200
300
400
500
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Fig. 3 - Typical Transfer Characteristics
Fig. 6 - Coss and Eoss vs. VDS
S21-1050-Rev. B, 01-Nov-2021
Eoss - Output Capacitance Stored Energy (µJ)
2nd line
30
RDS(on) - Drain-to-Source On-Resistance
(Normalized)
TJ = 25 °C
15 V
14 V
13 V
12 V
11 V
10 V
9V
8V
10000
3.0
10000
1st line
2nd line
2nd line
ID - Drain-to-Source Current (A)
40
600
Document Number: 92389
3
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiHP21N80AEF
www.vishay.com
Vishay Siliconix
Axis Title
Axis Title
20
10000
VDS = 640 V
VDS = 400 V
VDS = 160 V
6
100
3
15
1000
10
100
5
10
0
0
12
24
36
10000
1st line
2nd line
1000
2nd line
ID - Drain Current (A)
9
1st line
2nd line
2nd line
VGS - Gate-to-Source Voltage (V)
12
10
0
48
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TC - Case Temperature (°C)
Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage
Fig. 10 - Maximum Drain Current vs. Case Temperature
Axis Title
1000
TJ = 25 °C
1
100
VGS = 0 V
10
0.1
0.2
0.4
0.6
0.8
1.0
1.2
1.2
10000
1.1
1000
1
100
0.9
ID = 1mA
0.8
10
-60 -40 -20 0
1.4
1st line
2nd line
TJ = 150 °C
1st line
2nd line
2nd line
ISD - Reverse Drain Current (A)
10
2nd line
VDS - Drain-to-Source Breakdown Voltage
(Normalized)
Axis Title
10000
20 40 60 80 100 120 140 160
VSD - Source-Drain Voltage (V)
TJ - Junction Temperature (°C)
Fig. 8 - Typical Source-Drain Diode Forward Voltage
Fig. 11 - Temperature vs. Drain-to-Source Voltage
Axis Title
10000
Operation in this area
limited by RDS(on)
IDM limited
BVDSS limited
10
1000
Limited by RDS(on) a
100 µs
1
1st line
2nd line
2nd line
ID - Drain Current (A)
100
100
1 ms
0.1
TC = 25 °C,
TJ = 150 °C,
single pulse
10 ms
0.01
1
10
100
10
1000
VDS - Drain-to-Source Voltage (V)
Fig. 9 - Maximum Safe Operating Area
Note
a. VGS > minimum VGS at which RDS(on) is specified
S21-1050-Rev. B, 01-Nov-2021
Document Number: 92389
4
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiHP21N80AEF
www.vishay.com
Vishay Siliconix
Axis Title
1
10000
0.2
1000
0.1
1st line
Normalized Effective Transient
Thermal Impedance
Duty cycle = 0.5
0.1
0.05
100
0.02
Single pulse
10
0.01
0.0001
0.001
0.01
0.1
1
Pulse Time (s)
Fig. 12 - Normalized Transient Thermal Impedance, Junction-to-Case
RD
VDS
VDS
tp
VGS
D.U.T.
VDD
Rg
+
- VDD
VDS
10 V
Pulse width ≤ 1 μs
Duty factor ≤ 0.1 %
IAS
Fig. 13 - Switching Time Test Circuit
Fig. 16 - Unclamped Inductive Waveforms
VDS
Qg
10 V
90 %
Qgs
10 %
VGS
Qgd
VG
td(on)
td(off)
tr
tf
Charge
Fig. 14 - Switching Time Waveforms
Fig. 17 - Basic Gate Charge Waveform
Current regulator
Same type as D.U.T.
L
VDS
Vary tp to obtain
required IAS
50 kΩ
D.U.T.
Rg
+
- VDD
12 V
0.2 μF
0.3 μF
+
IAS
D.U.T.
-
VDS
10 V
tp
0.01 Ω
VGS
3 mA
Fig. 15 - Unclamped Inductive Test Circuit
IG
ID
Current sampling resistors
Fig. 18 - Gate Charge Test Circuit
S21-1050-Rev. B, 01-Nov-2021
Document Number: 92389
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For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiHP21N80AEF
www.vishay.com
Vishay Siliconix
Peak Diode Recovery dv/dt Test Circuit
+
D.U.T.
Circuit layout considerations
• Low stray inductance
• Ground plane
• Low leakage inductance
current transformer
3
+
2
-
-
4
+
1
Rg
•
•
•
•
1 Driver gate drive
Period
P.W.
+
V
- DD
dv/dt controlled by Rg
Driver same type as D.U.T.
ISD controlled by duty factor “D”
D.U.T. - device under test
D=
P.W.
Period
V GS = 10 V a
2
D.U.T. ISD waveform
Reverse
recovery
current
3 D.U.T. VDS
Body diode forward
current
di/dt
waveform
Diode recovery
dv/dt
Re-applied
voltage
V DD
Body diode forward drop
4 Inductor current
Ripple ≤ 5 %
ISD
Note
a. VGS = 5 V for logic level devices
Fig. 19 - For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?92389.
S21-1050-Rev. B, 01-Nov-2021
Document Number: 92389
6
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
TO-220-1
A
E
F
D
H(1)
Q
ØP
3
2
L(1)
1
M*
L
b(1)
C
b
e
J(1)
e(1)
MILLIMETERS
DIM.
INCHES
MIN.
MAX.
MIN.
MAX.
A
4.24
4.65
0.167
0.183
b
0.69
1.02
0.027
0.040
b(1)
1.14
1.78
0.045
0.070
c
0.36
0.61
0.014
0.024
D
14.33
15.85
0.564
0.624
E
9.96
10.52
0.392
0.414
e
2.41
2.67
0.095
0.105
e(1)
4.88
5.28
0.192
0.208
F
1.14
1.40
0.045
0.055
H(1)
6.10
6.71
0.240
0.264
J(1)
2.41
2.92
0.095
0.115
L
13.36
14.40
0.526
0.567
L(1)
3.33
4.04
0.131
0.159
ØP
3.53
3.94
0.139
0.155
Q
2.54
3.00
0.100
0.118
ECN: E21-0621-Rev. D, 04-Nov-2021
DWG: 6031
Note
• M* = 0.052 inches to 0.064 inches (dimension including protrusion), heatsink hole for HVM
Document Number: 66542
1
For technical questions, contact: hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Revison: 04-Nov-2021
Legal Disclaimer Notice
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Vishay
Disclaimer
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Revision: 09-Jul-2021
1
Document Number: 91000