SIP32454DB-T2-GE1

SiP32454, SiP32455 www.vishay.com Vishay Siliconix 0.8 V to 2.5 V, 28 m, Slew Rate Controlled Load Switch in WCSP4 DESCRIPTION FEATURES The SiP32454 and SiP32455 are slew rate controlled integrated high side load switches that operate in the input voltage range from 0.8 V to 2.5 V. The SiP32454 and SiP32455 are of n-channel MOSFET switching elements that provide 28 m switch on resistance. They have a 1 ms at 1.2 V and 1.5 ms at 2.5 V slow slew rate that limits the in-rush current and minimizes the switching noise. These devices’ low voltage logic control threshold can interface with low voltage control I/O directly without extra level shift or driver. A 2 MW pull-down resistor is integrated at logic control EN pin. SiP32454 integrates a switch off output discharge circuit. • Low input voltage, 0.8 V to 2.5 V • Low RON, 28 m typical • Slew rate control • Low logic control with hysteresis • Reverse current blocking when disabled Available • Integrated output discharge switch for SiP32454 • Integrated pull down resistor at EN pin • 4 bump WCSP 0.8 mm x 0.8 mm with 0.4 mm pitch package • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Both SiP32454 and SiP32455 are available in compact wafer level CSP package, WCSP4 0.8 mm x 0.8 mm with 0.4 mm pitch. APPLICATIONS • Battery operated devices • Smart phones • GPS and PMP • Computer • Medical and healthcare equipment • Industrial and instrument • Cellular phones and portable media players • Game consol TYPICAL APPLICATION CIRCUIT VIN IN OUT VOUT SiP32454, SiP32455 CIN COUT EN GND EN GND GND Fig. 1 - SiP32454 and SiP32455 Typical Application Circuit ORDERING INFORMATION TEMPERATURE RANGE -40 °C to +85 °C PACKAGE MARKING PART NUMBER WCSP: 4 bumps (2 x 2, 0.4 mm pitch, 208 μm bump height, 0.8 mm x 0.8 mm die size) AD SiP32454DB-T2-GE1 AE SiP32455DB-T2-GE1 Note • -GE1 denotes halogen-free and RoHS-compliant S20-0528-Rev. B, 06-Jul-2020 Document Number: 62531 1 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix ABSOLUTE MAXIMUM RATINGS PARAMETER Supply input voltage (VIN) Enable input voltage (VEN) Output voltage (VOUT) Maximum continuous switch current (Imax.) Maximum repetitive pulsed current (IDM) VIN (pulsed at 1 ms, 10 % duty cycle) ESD rating (HBM) Junction temperature (TJ) Thermal resistance (JA) a Power dissipation (PD) a LIMIT -0.3 to 2.75 -0.3 to 2.75 -0.3 to 2.75 1.2 2 4000 -40 to +150 280 196 UNIT V A V °C °C/W mW Notes a. Device mounted with all leads and power pad soldered or welded to PC board, see PCB layout b. Derate 3.6 mW/°C above TA = 25 °C  Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating/conditions for extended periods may affect device reliability. RECOMMENDED OPERATING RANGE PARAMETER LIMIT Input voltage range (VIN) Operating junction temperature range (TJ) UNIT 0.8 to 2.5 V -40 to +125 °C SPECIFICATIONS PARAMETER Operating voltage c SYMBOL TEST CONDITIONS UNLESS SPECIFIED VIN = 1 V, TA = -40 °C to +85 °C (typical values are at TA = 25 °C) VIN LIMITS MIN. a TYP. b MAX. a 0.8 - 2.5 VIN = 1.2 V, VEN = VIN, OUT = open - 10 15 VIN = 2.5 V, VEN = VIN, OUT = open - 34 60 SiP32454 - - 30 - - 1 Quiescent current IQ Off supply current IQ(off) Off switch current IDS(off) EN = GND, OUT = 0 V - - 30 IRB VOUT = 2.5 V, VIN = 0.9 V, VEN = 0 V - 0.001 30 Reverse blocking current On-resistance On-resistance temp. coefficient RDS(on) SiP32455 EN = GND, OUT = open VIN = 1 V, IL = 200 mA, TA = 25 °C - 30 35 VIN = 1.2 V, IL = 200 mA, TA = 25 °C - 29 35 VIN = 1.8 V, IL = 200 mA, TA = 25 °C - 28 35 VIN = 2.5 V, IL = 200 mA, TA = 25 °C - 28 35 TCRDS UNIT V μA m - 4100 - ppm/°C Output pull-down resistance RPD VEN = 0 V, TA = 25 °C (SiP32454 only) - 417 550  EN input low voltage c VIL VIN = 1 V - - 0.1 EN input high voltage c VIH VIN = 2.5 V 1.5 - - EN input leakage IEN VIN = 2.5 V, VEN = 0 V - - 1 VIN = 2.5 V, VEN = 2.5 V - 6.5 12 Output turn-on delay time Output turn-on rise time Output turn-off delay time td(on) tr td(off) VIN = 1.2 V - 0.6 1.2 VIN = 2.5 V - 0.6 1.2 0.4 1 1.6 VIN = 1.2 V VIN = 2.5 V RLOAD = 10 , CL = 0.1 μF, TA = 25 °C 0.5 1.5 2.5 VIN = 1.2 V - 0.3 1 VIN = 2.5 V - 0.1 1 V μA ms μs Notes a. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing c. For VIN outside this range consult typical EN threshold curve S20-0528-Rev. B, 06-Jul-2020 Document Number: 62531 2 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix PIN CONFIGURATION Index-Bump A1 1 OUT A B A GND 2 IN 1 OUT 2 IN W A D B EN EN Backside GND Bumpside Fig. 2 - WCSP 2 x 2 Package PIN DESCRIPTION PIN NUMBER A1 NAME OUT A2 IN B1 GND B2 EN FUNCTION This is the output pin of the switch This is the input pin of the switch Ground connection Enable input BLOCK DIAGRAM IN EN OUT Control logic Charge pump Turn on slew rate control GND For SiP32454 only Fig. 3 - Functional Block Diagram S20-0528-Rev. B, 06-Jul-2020 Document Number: 62531 3 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix 45 45 40 40 35 35 IQ - Quiescent Current (μA) IQ - Quiescent Current (μA) TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted) 30 25 20 15 10 5 VIN = 2.5 V 30 25 20 15 VIN = 1.2 V 10 5 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 VIN = 1 V 0 - 40 2.8 - 20 0 VIN (V) 1400 100 100 000 SiP32454 SiP32454 1200 VIN = 2.5 V 10 000 IIQ(OFF) - Off Supply Current (nA) IQ(OFF) - Off Supply Current (nA) 80 Fig. 7 - Quiescent vs. Temperature Fig. 4 - Quiescent vs. Input Voltage 1000 800 600 400 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VIN (V) 2.2 2.4 2.6 100 VIN = 1 V 10 1 - 40 2.8 VIN = 1.2 V 1000 - 20 0 20 40 60 Temperature (°C) 80 100 Fig. 8 - Off Supply Current vs. Temperature Fig. 5 - Off Supply Current vs. Input Voltage 12 1000 SiP32455 SiP32455 10 IIQ(OFF) - Off Supply Current (nA) IQ(OFF) - Off Supply Current (nA) 20 40 60 Temperature (°C) 8 6 4 2 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VIN (V) 2.2 2.4 2.6 Fig. 6 - Off Supply Current vs. Input Voltage S20-0528-Rev. B, 06-Jul-2020 2.8 100 VIN = 2.5 V VIN = 1.2 V 10 1 VIN = 1 V 0.1 0.01 0.001 - 40 - 20 0 20 40 Temperature (°C) 60 80 100 Fig. 9 - Off Supply Current vs. Temperature Document Number: 62531 4 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted) 1600 100 000 IDS(off) - Off Switch Current (nA) IDS(off) - Off Switch Current (nA) 1400 VIN = 5 V 10 000 1200 1000 800 600 VIN = 3.6 V 1000 100 VIN = 1.2 V 10 400 200 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VIN (V) 2.2 2.4 2.6 1 - 40 2.8 - 20 0 20 40 60 Temperature (°C) 80 100 Fig. 13 - Off Switch Current vs. Temperature Fig. 10 - Off Switch Current vs. Input Voltage 35 36 34 34 IO = 0.2 A VIN = 1.2 V 32 RDS - On-Resistance (mΩ) RDS - On-Resistance (mΩ) 33 IO = 1.2 A 31 30 29 IO = 0.5 A 28 32 30 28 26 24 27 IO = 0.2 A 26 22 20 - 40 25 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VIN (V) 2.2 2.4 2.6 2.8 0 20 40 60 Temperature (°C) 80 100 Fig. 14 - On Resistance vs. Temperature Fig. 11 - On Resistance vs. Input Voltage 160 4.0 3.8 140 VIN = 0.9 V IIN - Input Current (nA) 3.6 IIN - Input Current (nA) - 20 3.4 3.2 3.0 2.8 VOUT = 2.5 V VIN = 0.9 V 120 100 80 60 2.6 40 2.4 20 2.2 2.0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VOUT (V) 2.2 2.4 2.6 2.8 Fig. 12 - Reverse Blocking Current vs. Output Voltage S20-0528-Rev. B, 06-Jul-2020 0 - 40 - 20 0 20 40 60 80 100 Temperature (°C) Fig. 15 - Reverse Blocking Current vs. Temperature Document Number: 62531 5 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted) 450 SiP32454 only VOUT = VIN 450 RPD - Output Pulldown Resistance (Ω) RPD - Output Pulldown Resistance (Ω) 460 440 430 420 410 400 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VIN (V) 2.2 2.4 2.6 430 420 410 400 1.6 7 1.4 6 1.2 1 VIH 0.8 VIL 0.6 0.4 0 20 40 60 Temperature (°C) 80 100 VIN = 2.5 V 5 4 3 2 1 0.2 0 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VIN (V) 2.2 2.4 2.6 2.8 0.0 0.8 1.5 2.0 2.5 2.50 VIN = 2.5 V CL = 0.1 μF RL = 10 Ω 2.25 2.00 tr - Rise Time (ms) 0.7 0.6 0.5 0.4 1.50 1.25 1.00 0.75 0.2 0.50 0.1 0.25 - 20 0 20 40 Temperature (°C) 60 80 Fig. 18 - Turn-On Delay Time vs. Temperature S20-0528-Rev. B, 06-Jul-2020 100 VIN = 2.5 V CL = 0.1 μF RL = 10 Ω 1.75 0.3 0 - 40 1.0 Fig. 20 - EN Input Leakage vs. VEN 1 0.9 0.5 VEN (V) Fig. 17 - EN Threshold Voltage vs. Input Voltage td(on) - Turn-On Delay Time (ms) - 20 Fig. 19 - Output Pull-Down Resistance vs. Temperature IEN, EN Current (μA) EN Threshold Voltage (V) 440 390 - 40 2.8 Fig. 16 - Output Pull-Down Resistance vs. Input Voltage SiP32454 only VOUT = VIN = 2.5 V 0.00 - 40 - 20 0 20 40 Temperature (°C) 60 80 100 Fig. 21 - Rise Time vs. Temperature Document Number: 62531 6 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix ELECTRICAL CHARACTERISTICS 0.30 td(off) - Turn-Off Delay Time (μs) 0.25 VIN = 2.5 V CL = 0.1 μF RL = 10 Ω 0.20 0.15 0.10 0.05 0.00 - 40 - 20 0 20 40 60 Temperature (°C) 80 100 Fig. 22 - Turn-Off Delay Time vs. Temperature TYPICAL WAVEFORMS Fig. 23 - Turn-On Time (VIN = 1.2 V) Fig. 25 - Turn-Off Time (VIN = 1.2 V) Fig. 24 - Turn-On Time (VIN = 2.5 V) Fig. 26 - Turn-Off Time (VIN = 2.5 V) S20-0528-Rev. B, 06-Jul-2020 Document Number: 62531 7 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix DETAILED DESCRIPTION Thermal Considerations SiP32454 and SiP32455 are n-channel power MOSFET designed as high side load switch. Once enable the device charge pumps the gate of the power MOSFET to a constant gate to source voltage for fast turn on time. The mostly constant gate to source voltage keeps the on resistance low through out the input voltage range. SiP32454 and SiP32455 are designed with slow slew rate to minimize the inrush current during turn on. Because the body of the output n-channel is always connected to GND, it prevents the current from going back to the input in case the output voltage is higher than the output. The SiP32454 especially incorporates an active output pull-down resistor to discharge output capacitance when the device is off. These devices are designed to maintain a constant output load current. Due to physical limitations of the layout and assembly of the device the maximum switch current is 1.2 A as stated in the Absolute Maximum Ratings table. However, another limiting characteristic for the safe operating load current is the thermal power dissipation of the package. To obtain the highest power dissipation (and a thermal resistance of 280 °C/W) the device should be connected to a heat sink on the printed circuit board. The maximum power dissipation in any application is dependent on the maximum junction temperature, TJ(max.) = 125 °C, the junction-to-ambient thermal resistance, JA = 280 °C/W, and the ambient temperature, TA, which may be formulaically expressed as: 125 - T A T J(max.) - T A P (max.) = -------------------------------- = ---------------------- JA 280 APPLICATION INFORMATION Input Capacitor While a bypass capacitor on the input is not required, a 4.7 μF or larger capacitor for CIN is recommended in almost all applications. The bypass capacitor should be placed as physically close as possible to the input pin to be effective in minimizing transients on the input. Ceramic capacitors are recommended over tantalum because of their ability to withstand input current surges from low impedance sources such as batteries in portable devices. Output Capacitor A 0.1 μF capacitor across VOUT and GND is recommended to insure proper slew operation. There is inrush current through the output MOSFET and the magnitude of the inrush current depends on the output capacitor, the bigger the COUT the higher the inrush current. There are no ESR or capacitor type requirement. Enable The EN pin is compatible with CMOS logic voltage levels. It requires at least 0.1 V or below to fully shut down the device and 1.5 V or above to fully turn on the device. Protection Against Reverse Voltage Condition Both the SiP32454 and SiP32455 can block the output current from going to the input in case where the output voltage is higher than the input voltage when the main switch is off.  S20-0528-Rev. B, 06-Jul-2020 It then follows that, assuming an ambient temperature of 70 °C, the maximum power dissipation will be limited to about 196 mW. So long as the load current is below the 1.2 A limit, the maximum continuous switch current becomes a function two things: the package power dissipation and the RDS(on) at the ambient temperature. As an example let us calculate the worst case maximum load current at TA = 70 °C. The worst case RDS(on) at 25 °C is 35 m. The RDS(on) at 70 °C can be extrapolated from this data using the following formula: RDS(on) (at 70 °C) = RDS(on) (at 25 °C) x (1 + TC x T) Where TC is 4100 ppm/°C. Continuing with the calculation we have RDS(on) (at 70 °C) = 35 m x (1 + 0.0041 x (70 °C - 25 °C)) = 42.2 m The maximum current limit is then determined by P (max.) I LOAD(max.)  --------------------R DS(on) which in this case is 2.1 A. Under the stated input voltage condition, if the 2.1 A current limit is exceeded the internal die temperature will rise and eventually, possibly damage the device. To avoid possible permanent damage to the device and keep a reasonable design margin, it is recommended to operate the device maximum up to 1.2 A only as listed in the Absolute Maximum Ratings table. Document Number: 62531 8 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 SiP32454, SiP32455 www.vishay.com Vishay Siliconix PRODUCT SUMMARY Part number SiP32454 SiP32455 Description 0.8 V to 2.5 V, 28 m, 1.5 ms rise time, output discharge 0.8 V to 2.5 V, 28 m, 1.5 ms rise time Configuration Single Single Slew rate time (μs) 1000 1000 On delay time (μs) 600 600 Input voltage min. (V) 0.8 0.8 Input voltage max. (V) 2.5 2.5 On-resistance at input voltage min. (m) 30 30 On-resistance at input voltage max. (m) 28 28 Quiescent current at input voltage min. (μA) 4 4 Quiescent current at input voltage max. (μA) 32 32 Output discharge (yes / no) Yes No Reverse blocking (yes / no) Yes Yes Continuous current (A) 1.2 1.2 WCSP4 WCSP4 0.8 x 0.8 x 0.5 0.8 x 0.8 x 0.5 Package type Package size (W, L, H) (mm) Status code 2 2 Product type Slew rate Slew rate Applications Computers, consumer, industrial, healthcare, networking, portable Computers, consumer, industrial, healthcare, networking, portable Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?62531. S20-0528-Rev. B, 06-Jul-2020 Document Number: 62531 9 For technical questions, contact: powerictechsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Information www.vishay.com Vishay Siliconix WCSP4: 4 Bumps (2 x 2, 0.4 mm pitch, 208 μm bump height, 0.8 mm x 0.8 mm die size) Mark on backside of die 1 A 2 1 2 W A A B B B e D 4 x Ø 0.15 to Ø 0.20 Solder mask dia. - Pad diameter + 0.1 0.4 e 4xØb D Pin 1 mark A 0.4 Note 3 A1 Recommended Land Pattern All dimensions in millimeters Bump Note 2 DWG-No: 6004 Notes (1) Laser mark on the backside surface of die (2) Bumps are SAC396 (3) 0.05 max. coplanarity DIM. A MILLIMETERS a NOM. MAX. MIN. NOM. MAX. 0.515 0.530 0.545 0.0203 0.0209 0.0215 0.250 0.260 0.270 0.0098 0.800 0.0283 A1 b 0.208 e D INCHES MIN. 0.0082 0.400 0.720 0.760 0.0102 0.0106 0.0157 0.0299 0.0315 Note a. Use millimeters as the primary measurement T19-0364-Rev. D, 07-Oct-2019 1 Document Number: 63459 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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