SiR574DP
www.vishay.com
Vishay Siliconix
N-Channel 150 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8 Single
D
5
D
6
D
7
• TrenchFET® Gen V power MOSFET
D
8
• Very low RDS x Qg figure-of-merit (FOM)
• Tuned for the lowest RDS x Qoss FOM
• 100 % Rg and UIS tested
6.
15
m
m
m
1
5m
5.1
Top View
3
4 S
G
Bottom View
2
S
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
S
APPLICATIONS
•
•
•
•
•
PRODUCT SUMMARY
VDS (V)
RDS(on) max. (Ω) at VGS = 10 V
RDS(on) max. (Ω) at VGS = 7.5 V
Qg typ. (nC)
ID (A)
Configuration
150
0.0135
0.0143
23.6
48.1
Single
D
Synchronous rectification
Primary side switch
DC/DC converters
Power supplies
Motor drive control
G
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
Alternate manufacturing location
PowerPAK SO-8
SIR574DP-T1-RE3
SIR574DP-T1-BE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
Continuous drain current (TJ = 150 °C)
SYMBOL
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Pulsed drain current (t = 100 μs)
ID
IDM
Continuous source-drain diode current
TC = 25 °C
TA = 25 °C
IS
Single pulse avalanche current
Single pulse avalanche energy
L = 0.1 mH
IAS
EAS
TC = 25 °C
TC = 70 °C
Maximum power dissipation
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
PD
TJ, Tstg
LIMIT
150
± 20
48.1
38.4
12.1 b, c
9.7 b, c
150
71
4.5 b, c
15
11.25
78
50
5 b, c
3.2 b, c
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient b
t ≤ 10 s
RthJA
20
25
°C/W
1.3
1.6
Maximum junction-to-case (drain)
Steady state
RthJC
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 65 °C/W
g. TC = 25 °C
S23-1061-Rev. B, 04-Dec-2023
Document Number: 63093
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR574DP
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
Static
Drain-source breakdown voltage
VDS
VGS = 0 V, ID = 1 mA
150
-
-
ΔVDS/TJ
ID = 10 mA
-
100
-
VGS(th) temperature coefficient
ΔVGS(th)/TJ
ID = 250 μA
-
-6.7
-
Gate-source threshold voltage
VDS temperature coefficient
mV/°C
VGS(th)
VDS = VGS, ID = 250 μA
2
-
4
V
Gate-source leakage
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
100
nA
Zero gate voltage drain current
IDSS
Drain-source on-state resistance a
Forward transconductance a
RDS(on)
gfs
VDS = 120 V, VGS = 0 V
-
-
1
VDS = 120 V, VGS = 0 V, TJ = 70 °C
-
-
15
VGS = 10 V, ID = 10 A
-
0.0112
0.0135
VGS = 7.5 V, ID = 10 A
-
0.0119
0.0143
VDS = 15 V, ID = 10 A
-
45
-
-
2300
-
-
205
-
-
8.4
-
-
31.5
48
-
23.6
36
-
11.6
-
-
3.7
-
μA
Ω
S
Dynamic b
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Total gate charge
Qg
VDS = 75 V, VGS = 0 V, f = 1 MHz
VDS = 75 V, VGS = 10 V, ID = 10 A
VDS = 75 V, VGS = 7.5 V, ID = 10 A
Gate-source charge
Qgs
Gate-drain charge
Qgd
Output charge
Qoss
VDS = 75 V, VGS = 0 V
-
68
-
Gate resistance
Rg
f = 1 MHz
0.4
1.0
1.8
-
15
30
-
7
14
-
24
48
tf
-
9
18
td(on)
-
18
36
-
9
18
-
22
44
-
9
18
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Turn-on delay time
Rise time
Turn-off delay time
Fall time
td(on)
tr
td(off)
tr
td(off)
VDD = 75 V, RL = 7.5 Ω, ID ≅ 10 A,
VGEN = 10 V, Rg = 1 Ω
VDD = 75 V, RL = 7.5 Ω, ID ≅ 10 A,
VGEN = 7.5 V, Rg = 1 Ω
tf
pF
nC
Ω
ns
Drain-Source Body Diode Characteristics
Continuous source-drain diode current
IS
Pulse diode forward current
ISM
Body diode voltage
VSD
Body diode reverse recovery time
trr
Body diode reverse recovery charge
Qrr
Reverse recovery fall time
ta
Reverse recovery rise time
tb
TC = 25 °C
IS = 5 A, VGS = 0 V
IF = 10 A, di/dt = 100 A/μs,
TJ = 25 °C
-
-
71
-
-
150
-
0.78
1.1
-
68
136
ns
-
143
286
nC
-
53
-
-
15
-
A
V
ns
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S23-1061-Rev. B, 04-Dec-2023
Document Number: 63093
2
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR574DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
100
1000
1st line
2nd line
60
VGS = 5 V
100
1000
75
1st line
2nd line
VGS = 10 V thru 6 V
90
2nd line
ID - Drain Current (A)
120
2nd line
ID - Drain Current (A)
10000
125
10000
150
50
100
TC = 25 °C
25
30
0
1
2
3
4
10
0
10
0
TC = -55 °C
TC = 125 °C
VGS = 4 V thru 0 V
0
5
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Transfer Characteristics
Output Characteristics
Axis Title
Axis Title
10000
0.014
10 000
10000
1000
0.012
0.011
100
VGS = 10 V
1000
100
100
Crss
10
0.010
0
20
40
60
80
10
1
10
0.009
0
100
30
60
90
120
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
Axis Title
1st line
2nd line
VDS = 50 V, 75 V, 100 V
4
100
2
10
0
7
14
21
28
35
2.1
VGS = 10 V, 10 A
1000
1.7
1st line
2nd line
1000
2nd line
RDS(on) - On-Resistance (Normalized)
ID = 10 A
6
10000
2.5
8
0
150
Axis Title
10000
10
2nd line
VGS - Gate-to-Source Voltage (V)
1000
Coss
1st line
2nd line
VGS = 7.5 V
2nd line
C - Capacitance (pF)
0.013
1st line
2nd line
2nd line
RDS(on) - On-Resistance
(Ω)
Ciss
1.3
VGS = 7.5 V, 10 A
0.9
10
0.5
-50
-25
0
25
50
75
100 125 150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
S23-1061-Rev. B, 04-Dec-2023
100
Document Number: 63093
3
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR574DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
10000
0.6
10000
100
TJ = 150 °C
1
TJ = 25 °C
100
0.1
1000
0
1st line
2nd line
2nd line
VGS(th) - Variance (V)
1000
1st line
2nd line
2nd line
IS - Source Current (A)
0.3
10
ID = 5 mA
-0.3
100
-0.6
ID = 250 μA
-0.9
0.01
10
0
0.2
0.4
0.6
0.8
1.0
10
-1.2
1.2
-50
-25
0
25
50
75
100 125 150
VSD - Source-to-Drain Voltage (V)
TJ - Junction Temperature (°C)
Source-Drain Diode Forward Voltage
Threshold Voltage
Axis Title
Axis Title
10000
0.08
10000
500
400
TJ = 125 °C
0.032
100
0.016
1000
300
1st line
2nd line
2nd line
P - Power (W)
1000
0.048
1st line
2nd line
2nd line
RDS(on) - On-Resistance
(Ω)
ID = 10 A
0.064
200
100
100
TJ = 25 °C
10
0
0
2
4
6
8
10
0
0.001
10
0.01
0.1
1
10
VGS - Gate-to-Source Voltage (V)
t - Time (s)
On-Resistance vs. Gate-to-Source Voltage
Single Pulse Power, Junction-to-Ambient
Axis Title
10000
55
1000
33
1st line
2nd line
2nd line
ID - Drain Current (A)
44
22
100
11
10
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Safe Operating Area, Junction-to-Ambient
Note
a. VGS > minimum VGS at which RDS(on) is specified
S23-1061-Rev. B, 04-Dec-2023
Document Number: 63093
4
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR574DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
10000
55
1000
33
1st line
2nd line
2nd line
ID - Drain Current (A)
44
22
100
11
10
0
0
25
50
75
100
125
150
TC - Case Temperature (°C)
Current Derating a
Axis Title
Axis Title
10000
100
2.0
1st line
2nd line
40
100
20
1000
1.5
1st line
2nd line
1000
60
2nd line
P - Power (W)
80
2nd line
P - Power (W)
10000
2.5
1.0
100
0.5
10
0
0
25
50
75
100
125
150
10
0
0
25
50
75
100
125
TC - Case Temperature (°C)
TA - Ambient Temperature (°C)
Power, Junction-to-Case
Power, Junction-to-Ambient
150
Note
a. The power dissipation PD is based on TJ max. = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit
S23-1061-Rev. B, 04-Dec-2023
Document Number: 63093
5
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR574DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
10000
Duty cycle = 0.5
Notes
0.2
PDM
0.1
0.1
t1
0.05
t2
t1
1. Duty cycle, D = t
2
2. Per unit base = RthJA = 65 °C/W
0.02
3. TJM - TA = PDMZthJA
Single pulse
0.01
0.0001
0.001
1000
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
1
0.01
100
(t)
4. Surface mounted
0.1
1
10
100
10
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Axis Title
1
10000
0.2
1000
0.1
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
Duty cycle = 0.5
0.05
0.1
0.02
Single pulse
100
0.01
0.0001
10
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63093.
S23-1061-Rev. B, 04-Dec-2023
Document Number: 63093
6
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 01-Jan-2023
1
Document Number: 91000