SiR873DP
www.vishay.com
Vishay Siliconix
P-Channel 150 V (D-S) MOSFET
FEATURES
PowerPAK® SO-8 Single
D
5
D
6
D
7
• TrenchFET® power MOSFET
D
8
• Very low RDS(ON) minimizes power loss
from conduction
• 100 % Rg and UIS tested
6.
15
m
m
m
1
m
.15
5
Top View
4
G
Bottom View
3
S
2
S
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
1
S
APPLICATIONS
PRODUCT SUMMARY
VDS (V)
RDS(on) max. (Ω) at VGS = 10 V
Qg typ. (nC)
ID (A)
Configuration
S
• Active clamp in DC/DC
power supplies
-150
0.0475
31.8
-29
Single
G
• Battery protection
• Load switch
• Motor drive control
P-Channel MOSFET
D
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SO-8
SiR873DP-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
Continuous drain current (TJ = 150 °C)
SYMBOL
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Pulsed drain current (t = 100 μs)
ID
IDM
Continuous source-drain diode current
TC = 25 °C
TA = 25 °C
IS
Single pulse avalanche current
Single pulse avalanche energy
L = 0.1 mH
IAS
EAS
TC = 25 °C
TC = 70 °C
Maximum power dissipation
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
PD
TJ, Tstg
LIMIT
-150
± 20
-37
-29.6
-9 b, c
-7.2 b, c
50
37
5.6 b, c
-40
80
104
66.6
6.25 b, c
4 b, c
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient b
t ≤ 10 s
RthJA
15
20
°C/W
0.9
1.2
Maximum junction-to-case (drain)
Steady state
RthJC
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 54 °C/W
g. TC = 25 °C
S17-1080-Rev. A, 17-Jul-17
Document Number: 75954
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR873DP
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
Static
Drain-source breakdown voltage
VDS
VGS = 0 V, ID = -250 μA
-150
-
-
ΔVDS/TJ
ID = -250 μA
-
-92
-
VGS(th) temperature coefficient
ΔVGS(th)/TJ
ID = -250 μA
-
6.8
-
Gate-source threshold voltage
VDS temperature coefficient
mV/°C
VGS(th)
VDS = VGS, ID = -250 μA
-2
-
-4
V
Gate-source leakage
IGSS
VDS = 0 V, VGS = ± 20 V
-
-
-100
nA
Zero gate voltage drain current
IDSS
On-state drain current a
Drain-source on-state resistance
a
Forward transconductance a
VDS = -150 V, VGS = 0 V
-
-
-1
VDS = -150 V, VGS = 0 V, TJ = 70 °C
-
-
-15
ID(on)
VDS ≥ -10 V, VGS = -10 V
-20
-
-
A
RDS(on)
VGS = -10 V, ID = -10 A
-
0.0395
0.0475
Ω
gfs
VDS = -15 V, ID = -10 A
-
12
-
S
-
1805
-
VDS = -75 V, VGS = 0 V, f = 1 MHz
-
332
-
-
14.5
-
-
31.8
48
-
25
-
-
9.2
-
-
9.5
-
μA
Dynamic b
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Total gate charge
Qg
VDS = -75 V, VGS = -10 V, ID = -10 A
VDS = -75 V, VGS = -7.5 V, ID = -10 A
Gate-source charge
Qgs
Gate-drain charge
Qgd
Output charge
Qoss
VDS = -75 V, VGS = 0 V
-
68.8
-
Gate resistance
Rg
f = 1 MHz
1.9
3.4
6
-
15
30
-
7
14
-
28
56
-
9
18
Turn-on delay time
Rise time
Turn-off delay time
Fall time
td(on)
tr
td(off)
VDD = -75 V, RL = 7.5 Ω, ID ≅ -10 A,
VGEN = 10 V, Rg = 1 Ω
tf
pF
nC
Ω
ns
Drain-Source Body Diode Characteristics
Continuous source-drain diode current
IS
Pulse diode forward current
ISM
Body diode voltage
VSD
Body diode reverse recovery time
trr
Body diode reverse recovery charge
Qrr
Reverse recovery fall time
ta
Reverse recovery rise time
tb
TC = 25 °C
IS = -5 A, VGS = 0 V
IF = -5 A, di/dt = -100 A/μs, TJ = 25 °C
-
-
37
-
-
50
A
-
-0.79
-1.1
V
-
75
150
ns
-
245
490
nC
-
58
-
-
17
-
ns
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S17-1080-Rev. A, 17-Jul-17
Document Number: 75954
2
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR873DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
50
60
VGS = -10 V thru -8 V
40
VGS = -7 V
2nd line
ID - Drain Current (A)
2nd line
ID - Drain Current (A)
50
40
VGS = -6 V
30
20
VGS = -5 V
30
20
TC = 25 °C
TC = 125 °C
10
10
TC = -55 °C
VGS = -4 V
0
0
0
2
4
6
8
0
10
2
4
Output Characteristics
Transfer Characteristics
10
Axis Title
Axis Title
3000
10000
10000
2400
0.040
VGS = 10 V
0.039
100
0.038
Ciss
1000
1800
1st line
2nd line
1000
2nd line
C - Capacitance (pF)
0.041
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
8
VGS - Gate-to-Source Voltage (V)
2nd line
0.042
Coss
1200
100
600
Crss
0.037
0
10
0
10
20
30
40
10
0
50
30
60
90
120
ID - Drain Current (A)
2nd line
VDS - Drain-to-Source Voltage (V)
2nd line
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
Axis Title
1.6
8
1000
VDS = -50 V, -75 V, -100 V
1st line
2nd line
6
4
100
2
0
10
7
14
21
28
35
10000
1.4
VGS = 10 V, ID = 10 A
1000
1.2
1st line
2nd line
ID = 10 A
2nd line
RDS(on) - On-Resistance (Normalized)
10000
0
150
Axis Title
10
2nd line
VGS - Gate-to-Source Voltage (V)
6
VDS - Drain-to-Source Voltage (V)
2nd line
1.0
100
0.8
0.6
10
-50
-25
0
25
50
75
100 125 150
Qg - Total Gate Charge (nC)
2nd line
TJ - Junction Temperature (°C)
2nd line
Gate Charge
On-Resistance vs. Junction Temperature
S17-1080-Rev. A, 17-Jul-17
Document Number: 75954
3
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR873DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
10000
ID = 250 μA
0.7
2nd line
VGS(th) - Variance (V)
1000
TJ = 150 °C
TJ = 25 °C
1
100
0.1
1000
0.4
ID = 5 mA
0.1
100
-0.2
0.01
-0.5
10
0
0.3
0.6
0.9
1.2
10
-50
1.5
-25
0
25
50
75
100 125 150
VSD - Source-to-Drain Voltage (V)
2nd line
TJ - Temperature (°C)
2nd line
Source-Drain Diode Forward Voltage
Threshold Voltage
Axis Title
Axis Title
0.30
ID = 10 A
0.24
10000
500
10000
400
1000
2nd line
Power (W)
1000
0.12
300
1st line
2nd line
0.18
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
1st line
2nd line
10
1st line
2nd line
2nd line
IS - Source Current (A)
1.0
10000
100
200
100
TJ = 150 °C
100
0.06
100
TJ = 25 °C
0
10
2
4
6
8
10
0
0.001
10
0.01
0.1
1
10
VGS - Gate-to-Source Voltage (V)
2nd line
Time (s)
2nd line
On-Resistance vs. Gate-to-Source Voltage
Single Pulse Power, Junction-to-Ambient
Axis Title
100
10000
IDM limited
100 μs
ID limited
1 ms
1000
1
10 ms
Limited by
RDS(on) (1)
1st line
2nd line
2nd line
ID - Drain Current (A)
10
100 ms
0.1
1s
100
10 s
0.01
DC
TA = 25 °C
Single pulse
BVDSS limited
0.001
0.1
(1)
1
10
100
10
1000
VDS - Drain-to-Source Voltage (V)
VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
S17-1080-Rev. A, 17-Jul-17
Document Number: 75954
4
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR873DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
45
10000
1000
27
1st line
2nd line
2nd line
ID - Drain Current (A)
36
18
100
9
0
10
0
25
50
75
100
125
150
TC - Case Temperature (°C)
2nd line
Current Derating a
Axis Title
Axis Title
125
10000
3.0
100
10000
2.4
1.8
1st line
2nd line
50
2nd line
Power (W)
1000
1st line
2nd line
2nd line
Power (W)
1000
75
1.2
100
25
100
0.6
0
10
0
25
50
75
100
125
150
0
10
0
25
50
75
100
125
TC - Case Temperature (°C)
2nd line
TA - Ambient Temperature (°C)
2nd line
Power, Junction-to-Case
Power, Junction-to-Ambient
150
Note
a. The power dissipation PD is based on TJ max. = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit
S17-1080-Rev. A, 17-Jul-17
Document Number: 75954
5
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiR873DP
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
10000
Duty Cycle = 0.5
Notes:
0.2
1000
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
1
PDM
0.1
0.1
t1
t2
t
1. Duty cycle, D = 1
t2
2. Per unit base = RthJA = 54 °C/W
0.05
0.02
3. TJM - TA = PDMZthJA
Single pulse
0.01
0.0001
0.001
0.01
100
(t)
4. Surface mounted
0.1
1
10
100
10
1000
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Ambient
Axis Title
1
10000
0.2
0.1
1000
0.05
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.02
0.1
Single pulse
100
0.01
0.0001
10
0.001
0.01
0.1
1
10
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package / tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?75954.
S17-1080-Rev. A, 17-Jul-17
Document Number: 75954
6
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 01-Jan-2022
1
Document Number: 91000