SiZ346DT
www.vishay.com
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFETs
FEATURES
PowerPAIR® 3 x 3
G2
S2 8
S2 7
S2 6
5
S1/D2
• TrenchFET® Gen IV power MOSFETs
• 100 % Rg and UIS tested
• Optimized Qgs/Qgs ratio improves switching
characteristics
(Pin 9)
D1
3
m
m
1
3
1
2 G1
3 D1
4 D1
D1
Bottom View
mm
Top View
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
PRODUCT SUMMARY
CHANNEL-1
CHANNEL-2
30
0.0285
0.0370
3.2
17
30
0.0115
0.0153
4.5
30 a
VDS (V)
RDS(on) max. () at VGS = 10 V
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
ID (A) g
Configuration
D1
• CPU core power
• Computer / server peripherals
G1
• POL
N-Channel 1
MOSFET
S1/D2
• Synchronous buck converter
G2
• Telecom DC/DC
N-Channel 2
MOSFET
Dual
S2
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAIR 3 x 3
SiZ346DT-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
Continuous drain current (TJ = 150 °C)
SYMBOL
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Pulsed drain current (100 μs pulse width)
ID
IDM
Continuous source drain diode current
TC = 25 °C
TA = 25 °C
IS
Single pulse avalanche current
Single pulse avalanche energy
L = 100 mH
IAS
EAS
Maximum power dissipation
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
PD
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d
TJ, Tstg
CHANNEL-1
CHANNEL-2
30
30
± 20
+20, -16
17
30
13.8
24
8 b, c
14.1 b, c
b,
c
6.3
11.3 b, c
25
100
13.4
13.9
2.8 b, c
3.1 b, c
9
10
4.1
5
16
16.7
10.3
10.7
3.4 b, c
3.7 b, c
2.2 b, c
2.4 b, c
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
CHANNEL-1
CHANNEL-2
TYP.
30
6.3
TYP.
27
6
MAX.
37
7.8
MAX.
34
7.5
UNIT
t 10 s
RthJA
Maximum junction-to-ambient b, f
°C/W
Maximum junction-to-case (drain)
Steady state
RthJC
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 71 °C/W for channel-1 and 69 °C/W for channel-2
g. TC = 25 °C
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-source breakdown voltage
VDS Temperature coefficient
VGS(th) Temperature coefficient
Gate threshold voltage
Gate source leakage
Zero gate voltage drain current
On-state drain current b
Drain-source on-state resistance b
Forward transconductance b
VGS = 0 V, ID = 250 μA
Ch-1
30
-
-
VGS = 0 V, ID = 250 μA
Ch-2
30
-
-
VDS/TJ
ID = 250 μA
Ch-1
-
31
-
ID = 250 μA
Ch-2
-
20
-
VGS(th)/TJ
ID = 250 μA
Ch-1
-
-4.9
-
VDS
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
ID = 250 μA
Ch-2
-
-5.6
-
VDS = VGS, ID = 250 μA
Ch-1
1.1
-
2.2
VDS = VGS, ID = 250 μA
Ch-2
1.2
-
2.4
VDS = 0 V, VGS = +20 V, -20 V
Ch-1
-
-
± 100
VDS = 0 V, VGS = +20 V, -16 V
Ch-2
-
-
± 100
1
VDS = 30 V, VGS = 0 V
Ch-1
-
-
VDS = 30 V, VGS = 0 V
Ch-2
-
-
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
Ch-1
-
-
5
VDS = 30 V, VGS = 0 V, TJ = 55 °C
Ch-2
-
-
5
VDS 5 V, VGS = 10 V
Ch-1
10
-
-
VDS 5 V, VGS = 10 V
Ch-2
10
-
-
VGS = 10 V, ID = 10 A
Ch-1
-
0.0230
0.0285
VGS = 10 V, ID = 14.4 A
Ch-2
-
0.0084
0.0115
VGS = 4.5 V, ID = 5 A
Ch-1
-
0.0300
0.0370
VGS = 4.5 V, ID = 13 A
Ch-2
-
0.0111
0.0153
VGS = 10 V, ID = 10 A
Ch-1
-
17
-
VGS = 10 V, ID = 14.4 A
Ch-2
-
17
-
Ch-1
-
325
-
V
mV/°C
V
nA
μA
A
S
Dynamic a
Input capacitance
Ciss
Output capacitance
Coss
Channel-1
VDS = 15 V, VGS = 0 V, f = 1 MHz
Reverse transfer capacitance
Crss
Channel-2
VDS = 15 V, VGS = 0 V, f = 1 MHz
Crss/Ciss ratio
Qg
-
650
Ch-1
-
66
-
Ch-2
-
236
-
Ch-1
-
33
-
Ch-2
-
20
-
Ch-1
-
0.1
0.2
Ch-2
-
0.03
0.06
Ch-1
-
6.6
10
VDS = 15 V, VGS = 10 V, ID = 14.4 A
Ch-2
-
10
20
VDS = 15 V, VGS = 4.5 V, ID = 5 A
Ch-1
-
3.2
5
VDS = 15 V, VGS = 4.5 V, ID = 14.4 A
Ch-2
-
4.5
9
VDS = 15 V, VGS = 10 V, ID = 5 A
Total gate charge
Ch-2
Gate-source charge
Qgs
Channel-1
VDS = 15 V, VGS = 4.5 V, ID = 5 A
Ch-1
-
1
-
Ch-2
-
2.1
-
Gate-drain charge
Qgd
Channel-2
VDS = 15 V, VGS = 4.5 V, ID = 14.4 A
Ch-1
-
1.2
-
Ch-2
-
0.7
-
Ch-1
-
1.5
-
Output charge
Gate resistance
S17-0249-Rev. A, 20-Feb-17
Qoss
Rg
VDS = 15 V, VGS = 0 V
f = 1 MHz
Ch-2
-
6.6
-
Ch-1
0.2
0.85
1.7
Ch-2
0.3
1.4
2.8
pF
nC
Document Number: 68128
2
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
Ch-1
-
7
15
Ch-2
-
8
16
Ch-1
-
40
80
Ch-2
-
15
30
Ch-1
-
7
15
Ch-2
-
17
35
Ch-1
-
8
20
Ch-2
-
7
15
Ch-1
-
14
30
UNIT
Dynamic a
Turn-on delay time
td(on)
Rise time
Turn-off delay time
tr
td(off)
Fall time
Turn-on delay time
Channel-2
VDD = 15 V, RL = 1.5
ID 10 A, VGEN = 10 V, Rg = 1
tf
td(on)
Rise time
Turn-off delay time
Channel-1
VDD = 15 V, RL = 3
ID 5 A, VGEN = 10 V, Rg = 1
tr
td(off)
Fall time
Channel-1
VDD = 10 V, RL = 2
ID 5 A, VGEN = 4.5 V, Rg = 1
Channel-2
VDD = 15 V, RL = 1.5
ID 10 A, VGEN = 4.5 V, Rg = 1
tf
Ch-2
-
15
30
Ch-1
-
53
100
Ch-2
-
50
100
Ch-1
-
10
20
Ch-2
-
16
30
Ch-1
-
30
60
Ch-2
-
10
20
Ch-1
-
-
13.4
Ch-2
-
-
13.9
Ch-1
-
-
25
ns
Drain-Source Body Diode Characteristics
Continuous source-drain diode current
Pulse diode forward current (t = 100 μs)
Body diode voltage
TC = 25 °C
IS
ISM
VSD
Ch-2
-
-
100
IS = 5 A, VGS = 0 V
Ch-1
-
0.87
1.2
IS = 10 A, VGS = 0 V
Ch-2
-
0.8
1.2
Ch-1
-
20
40
Ch-2
-
20
40
Body diode reverse recovery time
trr
Body diode reverse recovery charge
Qrr
Channel-1
IF = 5 A, dI/dt = 100 A/μs, TJ = 25 °C
Ch-1
-
15
30
Ch-2
-
10
20
Reverse recovery fall time
ta
Channel-2
IF = 10 A, dI/dt = 100 A/μs, TJ = 25 °C
Ch-1
-
13
-
Ch-2
-
12.5
-
Ch-1
-
7
-
Ch-2
-
7.5
-
Reverse recovery rise time
tb
A
V
ns
nC
ns
Notes
a. Guaranteed by design, not subject to production testing
b. Pulse test; pulse width 300 μs, duty cycle 2 %
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
3
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
25
25
10000
10000
VGS = 10 V thru 4 V
10
100
5
1.5
2
2.5
3
10
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
2nd line
VGS - Gate-to-Source Voltage (V)
2nd line
Output Characteristics
Transfer Characteristics
Axis Title
5
Axis Title
0.05
500
10000
10000
400
1000
0.03
0.02
VGS = 10 V
100
0.01
Ciss
1000
300
1st line
2nd line
VGS = 4.5 V
2nd line
C - Capacitance (pF)
0.04
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
TC = -55 °C
0
10
1
100
TC = 25 °C
TC = 125 °C
0
0.5
10
5
VGS = 3 V
0
1000
15
1st line
2nd line
1000
15
2nd line
ID - Drain Current (A)
20
1st line
2nd line
2nd line
ID - Drain Current (A)
20
200
100
Coss
100
Crss
0
0
10
0
5
10
15
20
25
10
0
5
10
VDS - Drain-to-Source Voltage (V)
2nd line
On-Resistance vs. Drain Current
Capacitance
Axis Title
Axis Title
VDS = 7.5 V
4
100
2
0
10
2
4
6
8
10000
ID = 5 A
1.8
1.6
1000
VGS = 10 V, 4.5 V
1st line
2nd line
1000
VDS = 24 V
2nd line
RDS(on) - On-Resistance (Normalized)
VDS = 15 V
1st line
2nd line
2nd line
VGS - Gate-to-Source Voltage (V)
ID = 5 A
6
25
2.0
10000
0
20
ID - Drain Current (A)
2nd line
10
8
15
1.4
1.2
100
1.0
0.8
0.6
10
-50
-25
0
25
50
75
100 125 150
Qg - Total Gate Charge (nC)
2nd line
TJ - Junction Temperature (°C)
2nd line
Gate Charge
On-Resistance vs. Junction Temperature
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
4
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
100
10000
10000
0.12
10
1000
TJ = 25 °C
1
100
0.1
0.2
0.4
0.6
0.8
1.0
1000
0.08
0.06
TJ = 125 °C
0.04
100
0.02
TJ = 25 °C
0
10
0
0.10
1.2
10
0
2
4
6
8
10
VSD - Source-to-Drain Voltage (V)
2nd line
VGS - Gate-to-Source Voltage (V)
2nd line
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
Axis Title
Axis Title
50
10000
2.2
2.0
10000
40
1000
1000
1.6
ID = 250 μA
1.4
30
1st line
2nd line
2nd line
Power (W)
1.8
1st line
2nd line
2nd line
VGS(th) (V)
1st line
2nd line
2nd line
RDS(on) - On-Resistance (Ω)
TJ = 150 °C
1st line
2nd line
2nd line
IS - Source Current (A)
ID = 5 A
20
100
100
10
1.2
1.0
10
-50
-25
0
25
50
75
0
0.001
100 125 150
0.01
0.1
1
10
100
10
1000
TJ - Temperature (°C)
2nd line
Time (s)
2nd line
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
Axis Title
10
RDS(on) Limited
(1)
10000
IDM Limited
ID(on) Limited
100 μs
1000
1st line
2nd line
2nd line
ID - Drain Current (A)
100
1 ms
1
10 ms
100 ms
1s
10 s
DC
0.1
TA = 25 °C
Single pulse
100
BVDSSLimited
0.01
10
0.1
(1)
1
10
100
VDS - Drain-to-Source Voltage (V)
VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
5
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
Axis Title
20
16
15
1000
8
1st line
2nd line
12
2nd line
Power (W)
1000
1st line
2nd line
2nd line
ID - Drain Current (A)
10000
20
10000
10
100
100
5
4
0
10
0
25
50
75
100
125
150
0
10
0
25
50
75
100
125
TC - Case Temperature (°C)
2nd line
TC - Ambient Temperature (°C)
2nd line
Current Derating a
Power, Junction-to-Case
150
Note
a. The power dissipation PD is based on TJ max. = 25 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit.
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
6
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
10000
1
0.2
Notes:
0.1
0.1
1000
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
PDM
0.05
t1
t2
t
1. Duty cycle, D = t1
2
2. Per unit base = RthJA = 71 °C/W
0.02
3. TJM - TA = PDMZthJA
Single pulse
0.01
0.0001
0.001
100
(t)
4. Surface mounted
0.01
0.1
1
10
100
10
1000
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Ambient
Axis Title
10000
Duty Cycle = 0.5
1000
1st line
2nd line
Normalized Effective Transient
Thermal Impedance
1
0.2
0.1
100
0.05
0.02
Single pulse
0.1
0.0001
10
0.001
0.01
0.1
Square Wave Pulse Duration (s)
2nd line
Normalized Thermal Transient Impedance, Junction-to-Case
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
7
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Axis Title
50
50
VGS = 10 V thru 4 V
40
30
20
VGS = 3 V
1000
30
1st line
2nd line
2nd line
ID - Drain Current (A)
ID - Drain Current (A)
40
10000
20
100
TC = 25 °C
10
10
TC = 125 °C
TC = -55 °C
0
10
0
0
0
0.5
1
1.5
VDS - Drain-to-Source Voltage (V)
1
2
2
3
4
VGS - Gate-to-Source Voltage (V)
2nd line
Transfer Characteristics
Output Characteristics
840
0.0215
RDS(on) - On-Resistance (Ω)
Ciss
C - Capacitance (pF)
630
0.0165
VGS = 4.5 V
0.0115
VGS = 10 V
Coss
210
0.0065
Crss
0.0015
0
0
10
20
30
40
50
0
6
12
18
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
1.65
ID = 14.4 A
RDS(on) - On-Resistance (Normalized)
VDS = 8 V
8
6
VDS = 15 V, 24 V
4
2
0
0
24
ID - Drain Current (A)
10
VGS - Gate-to-Source Voltage (V)
420
2
4
6
Qg - Total Gate Charge (nC)
Gate Charge
S17-0249-Rev. A, 20-Feb-17
8
10
30
VGS = 10 V, 14.4 A
VGS = 4.5 V, 13 A
1.4
1.15
0.9
0.65
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 68128
8
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.030
100
ID =14.4 A
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
0.024
TJ = 150 °C
10
TJ = 25 °C
1
0.018
TJ = 125 °C
0.012
TJ = 25 °C
0.006
0.000
0.1
0.0
0.3
0.6
0.9
2
1.2
4
VSD - Source-to-Drain Voltage (V)
50
ID = 250 μA
40
1.35
30
Power (W)
VGS(th) (V)
10
On-Resistance vs. Gate-to-Source Voltage
1.60
1.10
0.85
0.60
- 50
8
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
1.85
6
20
10
- 25
0
25
50
75
100
125
150
0
0.001
0.01
TJ - Temperature (°C)
Threshold Voltage
0.1
1
Time (s)
10
100
1000
Single Pulse Power, Junction-to-Ambient
100
Limited by IDM
Limited by RDS(on)*
ID - Drain Current (A)
10
100 μs
1 ms
1
10 ms
100 ms
10 s, 1 s
0.1
DC
TA = 25 °C
BVDSS Limited
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
9
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
35
20
Package
Limited
15
Power (W)
ID - Drain Current (A)
28
21
10
14
5
7
0
0
0
25
50
75
100
TC - Case Temperature (°C)
Current Derating a
125
150
0
25
50
75
100
TC - Case Temperature (°C)
125
150
Power, Junction-to-Case
Note
a. The power dissipation PD is based on TJ max. = 25 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit.
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
10
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ346DT
www.vishay.com
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
t1
t2
1. Duty Cycle, D =
0.05
0.02
t1
t2
2. Per Unit Base = RthJA = 69 °C/W
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
0.0001
0.001
0.01
0.1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
0.0001
0.001
0.01
0.1
1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?68128.
S17-0249-Rev. A, 20-Feb-17
Document Number: 68128
11
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
www.vishay.com
Vishay Siliconix
PowerPAIR® 3 x 3 Case Outline
D
8
7
6
A
A1
5
K2
D2
5
6
K2
7
8
E1
K
L
d 0.10 C
2X
*
1
2
3
d 0.10 C
2X
0.10
4
0.15
4
3
2
1
e
b
b1
0.10 C
A
f
E2
K1
E
9
Note
* Indicates pin #1 orientation (optional)
c
C
d
0.08 C
MILLIMETERS
INCHES
DIM.
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.70
0.75
0.80
0.028
0.030
0.031
A1
0.00
0.05
0.000
b
0.35
0.40
0.45
0.014
0.016
0.018
b1
0.20
0.25
0.38
0.008
0.010
0.015
C
0.18
0.20
0.23
0.007
0.008
0.009
D
2.90
3.00
3.10
0.114
0.118
0.122
D2
2.35
2.40
2.45
0.093
0.094
0.096
E
2.90
3.00
3.10
0.114
0.118
0.122
E1
0.94
0.99
1.04
0.037
0.039
0.041
E2
0.47
0.52
0.57
0.019
0.020
0.022
e
0.002
0.65 BSC
0.026 BSC
K
0.25 typ.
0.010 typ.
K1
0.35 typ.
0.014 typ.
K2
0.30 typ.
L
0.27
0.32
0.012 typ.
0.37
0.011
0.013
0.015
ECN: T12-0347-Rev. C, 18-Jun-12
DWG: 5998
Revison: 18-Jun-12
1
Document Number: 67698
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PAD Pattern
Vishay Siliconix
RECOMMENDED MINIMUM PAD FOR PowerPAIR® 3 x 3
0.450
0.650
(0.018)
(0.026)
0.450
(0.018)
1.036
2.450
(0.096)
0.084
(0.003)
(0.041)
0.209
(0.008)
0.306
(0.012)
0.562
(0.022)
(0.063)
1.611
0.390
(0.015)
1.200
(0.047)
Recommended PAD for PowerPAIR 3 x 3
Dimensions in millimeters (inches)
Keep-Out 3.5 mm x 3.5 mm for non terminating traces
Document Number: 63294
Revision: 25-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
1
Document Number: 91000