SiZ720DT
Vishay Siliconix
N-Channel 20-V (D-S) MOSFETs
FEATURES
PRODUCT SUMMARY
VDS (V)
Channel-1
20
Channel-2
20
RDS(on) ()
ID (A)
0.0087 at VGS = 10 V
16a
0.0115 at VGS = 4.5 V
16a
0.0062 at VGS = 10 V
16a
0.0080 at VGS = 4.5 V
16a
Qg (Typ.)
7.3 nC
21 nC
PowerPAIR® 6 x 3.7
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFETs
• 100 % Rg and UIS Tested
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Notebook System Power
• POL
• Low Current DC/DC
D1
Pin 1
3.73 mm
G1
1
D1
2
D1
S2
5
G1
N-Channel 1
MOSFET
S1/D2
(Pin 7)
G2
6
D1
3
S2
S1/D2
6 mm
G2
4
N-Channel 2
MOSFET
Ordering Information:
SiZ720DT-T1-GE3 (Lead (Pb)-free and Halogen-free)
S2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Channel-2
20
± 20
Unit
V
16a
16a
ID
16a, b, c
16a, b, c
IDM
Pulsed Drain Current
Source Drain Current Diode Current
TC = 25 °C
TA = 25 °C
IS
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
IAS
EAS
Maximum Power Dissipation
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
PD
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
Channel-1
70
16a
A
70
3.2b, c
18
16
27
17
16a
3.8b, c
20
20
48
31
3.9b, c
2.5b, c
4.6b, c
3b, c
TJ, Tstg
- 55 to 150
260
mJ
W
°C
THERMAL RESISTANCE RATINGS
Channel-1
Parameter
Symbol
RthJA
RthJC
Typ.
Max.
Channel-2
Typ.
Max.
Unit
t 10 s
24
32
20
27
Maximum Junction-to-Ambientb, f
°C/W
Maximum Junction-to-Case (Drain)
Steady State
3.5
4.6
2
2.6
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAIR is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required
to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 67 °C/W for channel-1 and 65 °C/W for channel-2.
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currentb
Drain-Source On-State Resistanceb
Forward Transconductanceb
VDS
VDS/TJ
VGS(th)/TJ
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V, ID = 250 µA
Ch-1
20
VGS = 0 V, ID = 250 µA
Ch-2
20
ID = 250 µA
Ch-1
ID = 250 µA
Ch-2
20
ID = 250 µA
Ch-1
- 5.2
V
21
mV/°C
ID = 250 µA
Ch-2
VDS = VGS, ID = 250 µA
Ch-1
1
2
VDS = VGS, ID = 250 µA
Ch-2
1
2
- 5.5
Ch-1
± 100
Ch-2
± 100
VDS = 20 V, VGS = 0 V
Ch-1
1
VDS = 20 V, VGS = 0 V
Ch-2
1
VDS = 20 V, VGS = 0 V, TJ = 55 °C
Ch-1
5
VDS = 0 V, VGS = ± 20 V
VDS = 20 V, VGS = 0 V, TJ = 55 °C
Ch-2
VDS 5 V, VGS = 10 V
Ch-1
20
VDS 5 V, VGS = 10 V
Ch-2
20
V
nA
µA
5
A
VGS = 10 V, ID = 16.8 A
Ch-1
0.0070 0.0087
VGS = 10 V, ID = 20 A
Ch-2
0.0050 0.0062
VGS = 4.5 V, ID = 14.6 A
Ch-1
0.0091 0.0115
0.0065 0.0080
VGS = 4.5 V, ID = 20 A
Ch-2
VDS = 10 V, ID = 16.8 A
Ch-1
60
VDS = 10 V, ID = 20 A
Ch-2
60
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Crss
Qg
Channel-1
VDS = 10 V, VGS = 0 V, f = 1 MHz
Channel-2
VDS = 10 V, VGS = 0 V, f = 1 MHz
Rg
825
Ch-2
2350
Ch-1
295
Ch-2
800
Ch-1
130
pF
Ch-2
350
VDS = 10 V, VGS = 10 V, ID = 16.8 A
Ch-1
14.8
23
VDS = 10 V, VGS = 10 V, ID = 20 A
Ch-2
44
66
Ch-1
7.3
11
Channel-1
VDS = 10 V, VGS = 4.5 V, ID = 16.8 A
Ch-2
21
32
Ch-1
2.5
Channel-2
VDS = 10 V, VGS = 4.5 V, ID = 20 A
Ch-2
6.8
Ch-1
2.3
Qgs
Qgd
Ch-1
Ch-2
f = 1 MHz
nC
5.9
Ch-1
0.4
2
4
Ch-2
0.3
1.5
3
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %.
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Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Ch-1
15
25
Ch-2
25
40
Ch-1
15
25
Ch-2
17
30
Ch-1
18
30
Ch-2
35
55
Ch-1
12
20
Ch-2
15
25
Ch-1
10
15
Ch-2
15
25
Ch-1
10
20
Ch-2
9
15
Ch-1
20
30
Ch-2
32
50
Ch-1
10
20
Ch-2
10
15
Unit
Dynamica
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
td(on)
tr
td(off)
tf
td(on)
tr
Channel-1
VDD = 10 V, RL = 1
ID 10 A, VGEN = 4.5 V, Rg = 1
Channel-2
VDD = 10 V, RL = 1
ID 10 A, VGEN = 4.5 V, Rg = 1
Channel-1
VDD = 10 V, RL = 1
ID 10 A, VGEN = 10 V, Rg = 1
tf
Channel-2
VDD = 10 V, RL = 1
ID 10 A, VGEN = 10 V, Rg = 1
IS
TC = 25 °C
td(off)
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Currenta
Body Diode Voltage
Body Diode Reverse Recovery Time
ISM
VSD
16
Ch-1
70
Ch-2
0.8
1.2
IS = 10 A, VGS = 0 V
Ch-2
0.78
1.2
Ch-1
10
20
Ch-2
22
40
Ch-1
2.5
5
Ch-2
11
20
Ch-1
5.5
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Channel-2
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
A
70
Ch-1
trr
tb
16
Ch-2
IS = 10 A, VGS = 0 V
Channel-1
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
Reverse Recovery Rise Time
Ch-1
Ch-2
11
Ch-1
4.5
Ch-2
11
V
ns
nC
ns
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
70
20
VGS = 10 V thru 4 V
60
50
40
I D - Drain Current (A)
I D - Drain Current (A)
16
VGS = 3 V
30
20
12
8
TC = 25 °C
4
TC = 125 °C
10
VGS = 2 V
0.5
1.0
1.5
2.0
2.5
3.0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.014
1200
0.012
1000
3.0
Ciss
0.010
VGS = 4.5 V
0.008
VGS = 10 V
0.006
0.004
800
600
Coss
400
200
0.002
Crss
0
0
10
20
30
40
50
60
70
0
5
10
15
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
20
1.6
10
R DS(on) - On-Resistance (Normalized)
ID = 16.8 A
VGS - Gate-to-Source Voltage (V)
TC = - 55 °C
0
0.0
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
0
0.0
8
VDS = 16 V
6
VDS = 5 V
VDS = 20 V
4
2
0
0
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4
4
8
12
16
ID = 16.8 A
VGS = 10 V
1.4
1.2
VGS = 4.5 V
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
150
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
100
0.020
TJ = 150 °C
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
ID = 16.8 A
TJ = 25 °C
10
0.015
TJ = 125 °C
0.010
TJ = 25 °C
0.005
0.000
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
2
VSD - Source-to-Drain Voltage (V)
4
6
8
10
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
2.0
50
1.9
1.8
40
ID = 250 µA
1.7
Power (W)
VGS(th) (V)
1.6
1.5
1.4
1.3
30
20
1.2
10
1.1
1.0
0.9
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
100
1000
Time (s)
TJ - Temperature (°C)
Threshold Voltage
Single Pulse Power
100
I D - Drain Current (A)
Limited by RDS(on)*
100 µs
10
1 ms
10 ms
1
100 ms
1s
10 s
0.1
TA = 25 °C
Single Pulse
DC
BVDSS Limited
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
50
30
25
20
30
20
Power (W)
I D - Drain Current (A)
40
Package Limited
15
10
10
5
0
0
0
25
50
75
100
125
150
25
50
75
100
125
TC - Case Temperature (°C)
TC - Case Temperature (°C)
Current Derating*
Power, Junction-to-Case
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
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Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-1 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
0.02
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 67 °C/W
3. TJM - T A = PDMZthJA(t)
0.01
10 -4
4. Surface Mounted
Single Pulse
10 -3
10 -2
10 -1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
70
20
VGS = 10 V thru 4 V
60
50
I D - Drain Current (A)
I D - Drain Current (A)
16
VGS = 3 V
40
30
20
12
8
TC = 25 °C
4
TC = 125 °C
10
VGS = 2 V
0
0.0
0.5
1.0
1.5
2.0
2.5
0
0.0
3.0
TC = - 55 °C
0.5
1.0
2.0
2.5
3.0
VGS - Gate-to-Source Voltage (V)
VDS - Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.0080
3000
0.0075
Ciss
2400
0.0070
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
1.5
VGS = 4.5 V
0.0065
0.0060
0.0055
VGS = 10 V
0.0050
1800
1200
Coss
600
Crss
0.0045
0.0040
0
0
10
20
30
40
50
60
70
0
5
15
20
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
On-Resistance vs. Drain Current
Capacitance
10
1.6
R DS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
10
ID = 20 A
8
VDS = 16 V
6
VDS = 5 V
VDS = 20 V
4
2
0
0
9
18
27
Qg - Total Gate Charge (nC)
Gate Charge
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8
36
45
ID = 20 A
VGS = 10 V
1.4
1.2
VGS = 4.5 V
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.020
100
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
ID = 20 A
TJ = 150 °C
10
TJ = 25 °C
1
0.1
0.0
0.015
0.010
TJ = 125 °C
TJ = 25 °C
0.005
0.000
0.2
0.4
0.6
0.8
1.0
0
1.2
2
4
6
8
10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
50
2.0
1.8
40
ID = 250 µA
Power (W)
VGS(th) (V)
1.6
1.4
30
20
1.2
10
1.0
0.8
- 50
- 25
0
25
50
75
100
125
0
0.01
150
0.1
1
10
100
1000
Time (s)
TJ - Temperature (°C)
Threshold Voltage
Single Pulse Power
100
100 µs
Limited by RDS(on)*
I D - Drain Current (A)
10
1 ms
10 ms
1
100 ms
1s
10 s
0.1
DC
TA = 25 °C
Single Pulse
BVDSS Limited
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
www.vishay.com
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
80
50
Power (W)
I D - Drain Current (A)
40
60
40
30
20
Package Limited
20
10
0
0
0
25
50
75
100
125
150
25
50
75
100
125
TC - Case Temperature (°C)
TC - Case Temperature (°C)
Current Derating*
Power, Junction-to-Case
150
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
www.vishay.com
10
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SiZ720DT
Vishay Siliconix
CHANNEL-2 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 65 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
10
100
1000
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.05
0.02
Single Pulse
0.1
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?65579.
Document Number: 65579
S11-2379-Rev. B, 28-Nov-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
PowerPAIRTM 6 x 3.7 CASE OUTLINE
A
D
0.10 C
2X
Pin 5
K2
K2
Pin 4
Pin 4
Pin 5
Pin 6
K
L
Pin 6
E
E1
D1
K1
Pin #1 Ident
(Optional)
Pin 1
Pin 2
0.10 C
Pin 3
Pin 2
Pin 3
2X
E2
D1
Pin 1
e
b
BACK SIDE VIEW
b1
C
A1
C
A
0.08
c
0.10 C
Z
Z
MILLIMETERS
INCHES
DIM.
MIN.
NOM.
MAX.
MIN.
NOM.
MAX.
A
0.70
0.75
0.80
0.028
0.030
0.032
A1
0.00
-
0.05
0.000
-
0.002
b
0.46
0.51
0.56
0.018
0.020
0.022
b1
0.20
0.25
0.38
0.008
0.010
0.015
C
0.18
0.20
0.23
0.007
0.008
0.009
D
3.65
3.73
3.81
0.144
0.147
0.150
D1
2.41
2.53
2.65
0.095
0.100
0.104
E
5.92
6.00
6.08
0.233
0.236
0.239
E1
2.62
2.67
2.72
0.103
0.105
0.107
E2
0.87
0.92
0.97
0.034
0.036
0.038
e
1.27 BSC
0.05 BSC
K
0.45 TYP.
0.018 TYP.
K1
0.66 TYP.
0.026 TYP.
K2
L
0.60 TYP.
0.38
0.43
0.024 TYP.
0.48
0.015
0.017
0.019
ECN: S-82772-Rev. B, 17-Nov-08
DWG: 5979
Document Number: 69028
17-Nov-08
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1
PAD Pattern
Vishay Siliconix
RECOMMENDED PAD FOR PowerPAIR™ 6 x 3.7
0.3520
(8.941)
0.0220
(0.559)
0.0190
(0.483)
0, 0.11
0.0170
(0.432)
0, 0.03
0.1070
(2.718)
0.1040
(2.642)
0.4390
(11.151)
0, 0
0.0220
(0.559)
0, - 0.0645
0.0170
(0.432)
0.0380
(0.965)
- 0.05, - 0.11
0, - 0.11
1
0.0500
(1.27)
Recommended PAD for PowerPAIR 6 x 3.7
Dimensions in inches (mm)
Keep-out 0.3520 (8.94) x 0.4390 (11.151)
Document Number: 65278
Revision: 04-Aug-09
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1
Legal Disclaimer Notice
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Disclaimer
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Revision: 01-Jan-2022
1
Document Number: 91000