SMF43A-HE3-18

SMF5V0A to SMF58A www.vishay.com Vishay Semiconductors Surface-Mount ESD Protection Diodes FEATURES eSMP® Series • 200 W peak pulse power capability with a 10/1000 μs waveform, repetition rate (duty cycle): 0.01 % Available • Low profile package 2 1 • Wave and reflow solderable • ESD immunity acc. IEC 61000-4-2 ± 30 kV contact discharge ± 30 kV air discharge 20278 • ESD capability according to AEC-Q101: human body model: class H3B: > 8 kV SMF (DO-219AB) • Low incremental surge resistance, excellent clamping capability MARKING (example only) XX YY • “Low Noise” technology - very fast response time • AEC-Q101 qualified available 22623 • Compatible to SOD-123W package case outline or SOD-123F and SOD-123FL Bar = cathode marking YY = type code (see table below) XX = date code • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912     LINKS TO ADDITIONAL RESOURCES 3D 3D 3D Models Simulation Tools Models ORDERING INFORMATION ENVIRONMENTAL AND QUALITY CODE PART NUMBER (EXAMPLE) AEC-Q101 QUALIFIED E E E 3 - 18 SMF5V0A-E3-18 E 3 _A 18 SMF5V0A-HE3_A18 H SMF5V0ASMF5V0A- 10K PER 13" REEL (8 mm TAPE), MOQ = 50K TIN PLATED SMF5V0ASMF5V0A- PACKAGING CODE RoHS-COMPLIANT + LEAD (Pb)-FREE TERMINATIONS H REVISION CODE 3K PER 7" REEL (8 mm TAPE), MOQ = 30K 3 - 08 SMF5V0A-E3-08 3 _A 08 SMF5V0A-HE3_A08 ORDERING CODE (EXAMPLE) PACKAGE DATA PACKAGE NAME SMF (DO-219AB) WEIGHT (mg) HEIGHT MAX. (mm) LENGTH MAX. (mm) WIDTH MAX. (mm) MOLDING COMPOUND FLAMMABILITY RATING MOISTURE SENSITIVITY LEVEL WHISKER TEST ACC. JESD 201 SOLDERING CONDITIONS 15 1.08 3.9 1.9 UL 94 V-0 MSL level 1 (acc. J-STD-020) Class 2 Peak temperature max. 260 °C Rev. 2.3, 15-Dec-2022 Document Number: 85881 1 For technical questions, contact: ESDprotection@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000