SQ4005EY
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Vishay Siliconix
Automotive P-Channel 12 V (D-S) 175 °C MOSFET
FEATURES
• TrenchFET® power MOSFET
SO-8 Single
D
8
D
7
D
6
D
5
• AEC-Q101 qualified d
• 100 % Rg and UIS tested
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Top View
1
S
2
S
3
S
4
G
S
Marking Code: Q4005
G
PRODUCT SUMMARY
VDS (V)
-12
RDS(on) (Ω) at VGS = -4.5 V
0.016
RDS(on) (Ω) at VGS = -2.5 V
0.022
ID (A)
Configuration
P-Channel MOSFET
D
-15
Single
ORDERING INFORMATION
Package
SO-8
Lead (Pb)-free and halogen-free
SQ4005EY
(for detailed order number please see www.vishay.com/doc?79771)
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
Drain-source voltage
VDS
-12
Gate-source voltage
VGS
±8
Continuous drain current a
TC = 25 °C
TC = 125 °C
Continuous source current (diode conduction) a
Pulsed drain current b
Single pulse avalanche current
Single pulse avalanche energy
Maximum power dissipation b
L = 0.1 mH
TC = 25 °C
TC = 125 °C
Operating junction and storage temperature range
ID
-15
IS
-5.4
-60
IAS
-20
EAS
20
TJ, Tstg
Soldering recommendations (peak temperature)
V
-8.7
IDM
PD
UNIT
6
2
-55 to +175
260
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-ambient
Junction-to-foot (drain)
PCB Mount c
SYMBOL
LIMIT
RthJA
92
RthJF
25
UNIT
°C/W
Notes
a. Package limited
b. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
c. When mounted on 1" square PCB (FR4 material)
d. Parametric verification ongoing
S21-0375-Rev. B, 23-Apr-2021
Document Number: 64454
1
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4005EY
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Vishay Siliconix
SPECIFICATIONS (TC = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-source breakdown voltage
Gate-source threshold voltage
Gate-source leakage
Zero gate voltage drain current
On-state drain current a
Drain-source on-state resistance a
Forward transconductance b
VDS
VGS = 0, ID = -250 μA
-12
-
-
VGS(th)
VDS = VGS, ID = -250 μA
-0.45
-0.6
-1
VDS = 0 V, VGS = ± 8 V
IGSS
IDSS
ID(on)
RDS(on)
gfs
-
-
± 100
VGS = 0 V
VDS = -12 V
-
-
-1
VGS = 0 V
VDS = -12 V, TJ = 125 °C
-
-
-50
VGS = 0 V
VDS = -12 V, TJ = 175 °C
-
-
-150
VGS = -4.5 V
VDS ≤ -5 V
-20
-
-
VGS = -4.5 V
ID = -13.5 A
-
0.013
0.016
VGS = -4.5 V
ID = -13.5 A
-
-
0.020
VGS = -4.5 V
ID = -13.5 A
-
-
0.022
VGS = -2.5 V
ID = -12 A
VDS = -6 V, ID = -12 A
-
0.018
0.022
-
34
-
V
nA
μA
A
Ω
S
Dynamic b
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance
Crss
Total gate charge c
Qg
Gate-source charge c
Qgs
Gate-drain charge c
Qgd
Gate resistance
Rg
Turn-on delay
time c
Rise time c
Turn-off delay time c
Fall time c
VGS = 0 V
VDS = -6 V, f = 1 MHz
td(off)
2433
3600
922
1380
-
752
1120
-
29
38
-
4.2
-
-
8.4
-
f = 1 MHz
1.3
2.7
4
-
19
26
VDD = -6 V, RL = 0.6 Ω
ID ≅ -10 A, VGEN = -4.5 V, Rg = 1 Ω
-
33
44
-
73
97
-
30
40
VGS = -4.5 V
VDS = -6 V, ID = -10 A
td(on)
tr
-
tf
pF
nC
Ω
ns
Source-Drain Diode Ratings and Characteristics b
Pulsed current a
ISM
Forward voltage
VSD
IF = -10 A, VGS = 0 V
-
-
-60
A
-
-0.8
-1.1
V
Notes
a. Pulse test; pulse width ≤ 300 μs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing
c. Independent of operating temperature
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S21-0375-Rev. B, 23-Apr-2021
Document Number: 64454
2
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4005EY
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
30
30
VGS = 5 V thru 2 V
24
ID - Drain Current (A)
ID - Drain Current (A)
24
18
VGS = 1.5 V
12
18
TC = 25 °C
12
6 T = 125 °C
C
6
TC = - 55 °C
VGS = 1 V
0
0
0
2
4
6
8
VDS - Drain-to-Source Voltage (V)
0
10
1
2
3
4
VGS - Gate-to-Source Voltage (V)
5
Transfer Characteristics
Output Characteristics
5
50
4
40
gfs - Transconductance (S)
ID - Drain Current (A)
TC = - 55 °C
3
TC = 25 °C
2
1
TC = 25 °C
30
TC = 125 °C
20
10
TC = 125 °C
TC = - 55 °C
0
0
0
1.5
1
2.5
2
VGS - Gate-to-Source Voltage (V)
0
3
0.04
4000
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
5000
VGS = 1.8 V
VGS = 2.5 V
VGS = 4.5 V
0.01
9
12
15
3
6
9
VDS - Drain-to-Source Voltage (V)
12
Transconductance
0.05
0.02
6
ID - Drain Current (A)
Transfer Characteristics
0.03
3
3000
Ciss
2000
Coss
1000
Crss
0
0.00
0
6
12
18
ID - Drain Current (A)
24
On-Resistance vs. Drain Current
S21-0375-Rev. B, 23-Apr-2021
30
0
Capacitance
Document Number: 64454
3
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4005EY
www.vishay.com
Vishay Siliconix
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise noted)
1.5
5
RDS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
ID = 10 A
4
3
2
1
10
20
VGS = 2.5 V
1.1
0.9
VGS = 4.5 V
0.7
0.5
- 50 - 25
0
0
ID = 13 A
1.3
30
Qg - Total Gate Charge (nC)
50
75
100
125
150
175
On-Resistance vs. Junction Temperature
0.05
100
TJ = 150 °C
0.04
RDS(on) - On-Resistance (Ω)
10
IS - Source Current (A)
25
TJ - Junction Temperature (°C)
Gate Charge
1
TJ = 25 °C
0.1
0.01
0.001
0.03
TJ = 150 °C
0.02
TJ = 25 °C
0.01
0.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
VSD - Source-to-Drain Voltage (V)
2
3
4
5
On-Resistance vs. Gate-to-Source Voltage
- 13
0.5
VDS - Drain-to-Source Voltage (V)
ID = 600 μA
0.3
0.1
ID = 2mA
- 0.1
- 0.3
- 0.5
- 50 - 25
1
VGS - Gate-to-Source Voltage (V)
Source Drain Diode Forward Voltage
VGS(th) Variance (V)
0
0
25
50
75 100
TJ - Temperature (°C)
Threshold Voltage
S21-0375-Rev. B, 23-Apr-2021
125
150
175
- 13
ID = 1 mA
- 14
- 14
- 15
- 15
- 50 - 25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
Breakdown Voltage vs. Junction Temperature
Document Number: 64454
4
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4005EY
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
100
ID - Drain Current (A)
10
100 µs
IDM Limited
1 ms
1
0.1
0.01
0.01
10 ms
Limited by RDS(on)a
TC = 25 °C
Single Pulse
100 ms
1 s, 10 s, DC
BVDSS Limited
0.1
1
10
VDS - Drain-to-Source Voltage (V)
100
Safe Operating Area
Note
a. VGS > minimum VGS at which RDS(on) is specified
S21-0375-Rev. B, 23-Apr-2021
Document Number: 64454
5
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SQ4005EY
www.vishay.com
Vishay Siliconix
THERMAL RATINGS (TA = 25 °C, unless otherwise noted)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 84 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Note
• The characteristics shown in the two graphs
- Normalized Transient Thermal Impedance Junction-to-Ambient (25 °C)
- Normalized Transient Thermal Impedance Junction-to-Foot (25 °C)
are given for general guidelines only to enable the user to get a “ball park” indication of part capabilities. The data are extracted from single
pulse transient thermal impedance characteristics which are developed from empirical measurements. The latter is valid for the part
mounted on printed circuit board - FR4, size 1" x 1" x 0.062", double sided with 2 oz. copper, 100 % on both sides. The part capabilities
can widely vary depending on actual application parameters and operating conditions
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?64454.
S21-0375-Rev. B, 23-Apr-2021
Document Number: 64454
6
For technical questions, contact: automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
8
6
7
5
E
1
3
2
H
4
S
h x 45
D
C
0.25 mm (Gage Plane)
A
e
B
All Leads
q
A1
L
0.004"
MILLIMETERS
INCHES
DIM
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.20
0.004
0.008
B
0.35
0.51
0.014
0.020
C
0.19
0.25
0.0075
0.010
D
4.80
5.00
0.189
0.196
E
3.80
4.00
0.150
e
0.101 mm
1.27 BSC
0.157
0.050 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.50
0.93
0.020
0.037
q
0°
8°
0°
8°
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
Document Number: 71192
11-Sep-06
www.vishay.com
1
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR SO-8
0.172
(4.369)
0.028
0.022
0.050
(0.559)
(1.270)
0.152
(3.861)
0.047
(1.194)
0.246
(6.248)
(0.711)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
APPLICATION NOTE
Return to Index
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Document Number: 72606
Revision: 21-Jan-08
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Revision: 09-Jul-2021
1
Document Number: 91000